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    Rain sensor embedded on printed circuit board
    152.
    发明公开
    Rain sensor embedded on printed circuit board 有权
    Regensensor，Regereensor，Leiterplatte montiert ist

    公开(公告)号：EP2100783A2

    公开(公告)日：2009-09-16

    申请号：EP09155248.9

    申请日：2009-03-16

    Applicant: Guardian Industries Corp.

    Inventor： Veerasamy, Vijayen S.

    IPC: B60S1/08 ,  B32B17/10 ,  G01D5/24 ,  G01N21/25 ,  H05K1/02

    CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

    Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

    Abstract translation: 用于感测诸如车辆窗口（例如，车辆挡风玻璃，天窗或背衬）的窗户上的湿气（例如雨）和/或其他材料的存在的系统和/或方法。 在某些示例性实施例中，多个感测电容器由诸如车辆挡风玻璃的窗户支撑，每个电容器具有不同的场和/或图案。 感测电路输出基于和/或与一个或多个感测电容器的电容相关的模拟信号。 在某些示例性实施例中，提供可安装在车窗中或其上的柔性印刷电路板（PCB）。 第一和第二感测电路形成在柔性PCB的相对侧上，每个所述感测电路包括多个不同的分形结构。 接地平面位于第一感测电路和第二感测电路之间，其中接地平面布置成使第一和第二电容器阵列去耦，并且使第一电容器阵列与从第二电容器阵列发出的场屏蔽起来，反之亦然。 电子设备被配置为检测车辆窗口的外表面上的湿气，车窗内表面上的湿度和EMI。

    High frequency multilayer integrated circuit
    157.
    发明公开
    High frequency multilayer integrated circuit 审中-公开
    Mehrschichtige integrierte Hochfrequenzschaltung

    公开(公告)号：EP1605735A2

    公开(公告)日：2005-12-14

    申请号：EP05253515.0

    申请日：2005-06-08

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Suzuki, Ryota ,  Nakada, Taihei ,  Kumamoto, Tsuyoshi ,  Yamashita, Yuusuke

    IPC: H05K1/02 ,  H05K3/46 ,  H01L23/66

    CPC classification number: H01L23/50 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0218 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/182 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09336 ,  H05K2201/10545 ,  H01L2924/00

    Abstract: A high frequency multiplayer integrated circuit is provided with: a multiplayer board (1) including n earth conductor layers (6a, 6b, 6c) (n: integer of two or more than two) and (n-1) dielectric layers (7a, 7b) each arranged between adjacent earth conductor layers (6a, 6b, 6c); a first high frequency circuit (8a) disposed in one of the most outside earth conductor layers (6c) of the multiplayer board (1); a first power-supply/control circuit (9a) disposed in this most outside earth conductor layer (6c); a second high frequency circuit (8b) disposed in at least one of the dielectric layers (7a, 7b) and connected to the first high frequency circuit (8a) in the multiplayer board (1); a second power-supply/control circuit (9b) disposed in another one of the most outside earth conductor layers (6c) of the multiplayer board; and a third power-supply/control circuit (8c) disposed in at least one of the dielectric layers (7a, 7b) at a portion at which the second high frequency circuit does not exist (8b), the third power-supply/control circuit (9c) being connected to the first and second power-supply/control circuits (9a, 9b).

    Abstract translation: 高频多人集成电路具有：多层板（1），包括n个接地导体层（6a，6b，6c）（n：两个或两个以上的整数）和（n-1）个电介质层（7a， 7b），每个布置在相邻的接地导体层（6a，6b，6c）之间; 设置在多层板（1）的最外侧的接地导体层（6c）之一中的第一高频电路（8a） 设置在该最外部接地导体层（6c）中的第一电源/控制电路（9a）; 设置在至少一个电介质层（7a，7b）中并与多层板（1）中的第一高频电路（8a）连接的第二高频电路（8b）; 第二电源/控制电路（9b），设置在所述多人板的最外部接地导体层（6c）中的另一个中; 以及设置在不存在第二高频电路的部分（8b）的至少一个电介质层（7a，7b）中的第三电源/控制电路（8b），第三电源/控制 电路（9c）连接到第一和第二电源/控制电路（9a，9b）。

    PRINTED-CIRCUIT BOARD, ELECTRONIC PART HAVING SHIELD STRUCTURE, AND RADIO COMMUNICATION APPARATUS
    158.
    发明公开
    PRINTED-CIRCUIT BOARD, ELECTRONIC PART HAVING SHIELD STRUCTURE, AND RADIO COMMUNICATION APPARATUS 审中-公开
    LEITERPLATTE，ELEKTRONISCHES TEIL MIT SCHIRMSTRUKTUR UND FUNKKOMMUNIKATIONSVORRICHTUNG

    公开(公告)号：EP1484948A1

    公开(公告)日：2004-12-08

    申请号：EP03703033.5

    申请日：2003-01-23

    Applicant: MITSUBISHI MATERIALS CORPORATION ,  MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    Inventor： YAMAGUCHI, Kunio Mitsubishi Materials Corporation ,  KIMURA, Ryouhei Mitsubishi Materials Corporation ,  TSUBOI, Atsushi Mitsubishi Materials Corporation ,  MOROZUMI,K. Matsushita Communication Ind.Co.Ltd.

    IPC: H05K1/02 ,  H05K9/00 ,  H03H9/25 ,  H04B1/04 ,  H04B1/10 ,  H04B1/38

    CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

    Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded. Furthermore, there is provided a protective member which has a conductive surface and which is in contact with the surface of said filter, and said conductive surface of said protective member which is in contact with the surface of said filter is set so as to be of the same size as the surface of said filter, or so as to be smaller than it.

    Abstract translation: 在作为其压电元件的包含斜方硅石的SAW滤波器的嵌合区域中，包括与SAW滤波器的输入端子和输出端子连接的输入侧端子电极和输出侧端子电极。 对于每个端子电极，在与SAW滤波器的嵌合区域分开只有预定距离的位置处，连接有沿着与传输方向平行的方向在相互相反的方向上延伸的微带线 SAW滤波器内的频率信号。 在SAW滤波器的装配区域中设置有狭缝，并且在与SAW滤波器内的频率信号的传输方向相交的方向上延伸。 多个通孔设置在印刷基板中，并将其表面及其背面接地电连接在一起。 此外，提供了具有导电表面并与所述过滤器的表面接触的保护构件，并且与所述过滤器的表面接触的所述保护构件的所述导电表面被设定为 与所述过滤器的表面相同的尺寸，或者小于其。

    MULTI-LAYER CIRCUIT BOARD THAT SUPPRESSES RADIO FREQUENCY INTERFERENCE FROM HIGH FREQUENCY SIGNALS
    160.
    发明授权
    MULTI-LAYER CIRCUIT BOARD THAT SUPPRESSES RADIO FREQUENCY INTERFERENCE FROM HIGH FREQUENCY SIGNALS 失效
    多层电路板，高频干扰从高频信号抑制。

    公开(公告)号：EP0489118B1

    公开(公告)日：1995-01-25

    申请号：EP90914326.5

    申请日：1990-08-22

    Applicant: AST RESEARCH, Inc.

    Inventor： BARAN, Jozef, B.

    IPC: H05K1/14 ,  H05K9/00

    CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K3/429 ,  H05K9/0039 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/10015 ,  Y10T29/49128 ,  Y10T29/49155

    Abstract: A multi-layer printed circuit board is constructed to suppress radio frequency interference (RFI) generated by high frequency clock and data signals therein. Suppression is achieved by positioning clock lines (254) carrying the clock signal on a first voltage reference layer (152) proximate to a second voltage reference layer (154). The two layers shield the clock signal from the signal lines on other layers. Noise may be further reduced by forming bridges (270) in the second voltage reference layer (154) proximate to the clock lines so that the bridges (270) span the width of the clock line. Capacitors are also preferably utilized to further suppress radiated noise. The capacitors provide AC coupling between the first and second voltage reference layers (152, 154) so that a low impedance path is provided for high frequency noise generated by the clock signal. The second voltage reference layer (154) thus operates as an effectively continuous shield between the bridges (270).

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