-
公开(公告)号：EP1808963B1
公开(公告)日：2010-09-15
申请号：EP07075267.0
申请日：2000-09-20
Applicant: STMicroelectronics, Inc.
Inventor： Rezzi, Francesco , Marrow, Marcus
CPC classification number: H03M13/098 , G11B20/14 , G11B20/18 , H03M13/09
-
公开(公告)号：EP1750280B1
公开(公告)日：2010-09-08
申请号：EP06253766.7
申请日：2006-07-19
Applicant: STMicroelectronics, Inc.
Inventor： Lysinger, Mark
IPC: G11C15/04
CPC classification number: G11C15/04
-
163.发明授权System and method for supporting precise exceptions in a data processor having a clustered architecture 有权系统和方法，用于在数据处理器处理精确异常的与葡萄状结构
公开(公告)号：EP1235139B1
公开(公告)日：2009-12-16
申请号：EP01310602.6
申请日：2001-12-19
Applicant: STMicroelectronics, Inc.
Inventor： Homewood, Marc Owen , Jarvis, Anthony X , Starr, Alexander J
IPC: G06F9/38
CPC classification number: G06F9/3891 , G06F9/3865 , G06F9/3885
-
164.发明授权A system independent and scalable packet buffer management architecture for network processors 有权独立于系统的可扩展的包缓冲器管理体系结构的网络处理器
公开(公告)号：EP1324566B1
公开(公告)日：2009-11-11
申请号：EP02258959.2
申请日：2002-12-24
Applicant: STMicroelectronics, Inc.
Inventor： Karim, Faraydon O. , Chandra, Ramesh , Stramm, Bernd H.
IPC: H04L29/06
CPC classification number: H04L49/9031 , H04L49/90 , H04L49/901
-
公开(公告)号：EP1612804B1
公开(公告)日：2009-08-05
申请号：EP05254099.4
申请日：2005-06-29
Applicant: STMicroelectronics, Inc.
Inventor： Frey, Christophe
CPC classification number: G11C11/16 , G11C11/5607
-
Patent Agency Ranking166.发明授权Circuit and method for instruction compression and dispersal in VLIW processors 有权电路装置和方法，用于在VLIW处理器压缩命令和分配
公开(公告)号：EP1220091B1
公开(公告)日：2009-08-05
申请号：EP01310630.7
申请日：2001-12-19
Applicant: STMicroelectronics, Inc.
Inventor： Faraboschi, Paolo , Jarvis, Anthony X. , Homewood, Mark Owen
IPC: G06F9/38
CPC classification number: G06F9/3891 , G06F9/30054 , G06F9/30101 , G06F9/3802 , G06F9/3853 , G06F9/3885
-
167.发明授权Write driver with improved boosting circuit and interconnect impedance matching 有权写有电压增加驱动器和与匹配阻抗相结合
公开(公告)号：EP1587066B1
公开(公告)日：2009-04-08
申请号：EP05008158.7
申请日：2005-04-14
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Venca, Alessandro , Alini, Roberto , Posat, Baris
CPC classification number: G11B5/02 , G11B5/022 , G11B2005/0018 , H02M3/07
-
168.发明授权Method for executing conditional branch instructions in a data processor and corresponding data processor 有权一种用于在数据处理器中执行的条件分支指令和相应的数据处理器的方法
公开(公告)号：EP1220089B1
公开(公告)日：2008-12-31
申请号：EP01310643.0
申请日：2001-12-19
Applicant: STMicroelectronics, Inc.
Inventor： Homewood, Mark Owen , Vondran, Gary L. , Brown, Geoffrey M. , Faraboschi, Paolo
CPC classification number: G06F9/30058 , G06F9/3885
-
169.发明公开Improved reliability and improved frequency response package for extremely high power density transistors 审中-公开对于具有非常高的功率密度的晶体管壳体具有改进的可靠性和改进的频率响应
公开(公告)号：EP1722414A3
公开(公告)日：2008-12-24
申请号：EP06251749.5
申请日：2006-03-30
Applicant: STMicroelectronics, Inc.
Inventor： Rotay, Craig J.
IPC: H01L23/498 , H05K3/34
CPC classification number: H01L23/49562 , H01L2924/0002 , H01L2924/3011 , H05K3/3426 , H05K2201/10166 , H05K2201/10818 , H05K2201/1084 , Y02P70/613 , H01L2924/00
Abstract: A high power density transistor structure includes a transistor package capable of housing a high power density transistor. The transistor package has a package insulator and a plurality of transistor leads. Each of the transistor leads has a far end, a near end and a lead periphery. The high power density transistor structure also includes a solder lock located on at least one of the transistor leads. At least a portion of the solder lock is attachable to a printed circuit board (PCB). At least a portion of the lead periphery of each transistor lead is attachable to at least one of the PCB and the package insulator.
-
公开(公告)号：EP1646102B1
公开(公告)日：2008-11-26
申请号：EP05256167.7
申请日：2005-10-03
Applicant: STMicroelectronics, Inc.
Inventor： Chiu, Anthony M.
IPC: H01M8/06
CPC classification number: H01M8/0612 , H01M8/04089 , H01M8/04201 , H01M8/04291 , H01M8/0656 , H01M8/186 , H01M2008/1095 , Y02E60/528
-
-
-
-
-
-
-
-
-
Search Results
4082
records
(took 0.053 seconds)
