公开(公告)号：EP2023697A4

公开(公告)日：2012-11-14

申请号：EP07744278

申请日：2007-05-28

Applicant: FUJIKURA LTD

Inventor： HIRATA SHUZO ,  ONO AKINOBU

IPC: H05K1/11 ,  H01R12/50

CPC classification number: H05K1/117 ,  H05K1/095 ,  H05K3/247 ,  H05K3/28 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2201/09436 ,  H05K2201/09709

公开(公告)号：EP1377141B1

公开(公告)日：2011-11-30

申请号：EP03014334.1

申请日：2003-06-26

Applicant: NEC TOPPAN CIRCUIT SOLUTIONS, INC. ,  NEC TOKIN Corporation

Inventor： Nakamura, Hirofumi ,  Arai, Satoshi

IPC: H05K1/16 ,  H01L23/64

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/162 ,  H05K3/382 ,  H05K2201/0329 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315 ,  Y10T428/24917 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/0401

公开(公告)号：EP2099068A4

公开(公告)日：2011-01-26

申请号：EP07851092

申请日：2007-12-21

Applicant: TOKUYAMA CORP

Inventor： YAMAMOTO YASUYUKI ,  MAEDA MASAKATSU ,  YATABE OSAMU

IPC: H01L23/12 ,  C04B35/581 ,  H01B5/14 ,  H01L23/15

CPC classification number: H05K3/38 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L21/4867 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/0347 ,  H05K2201/035 ,  Y10T428/12576 ,  C04B35/581 ,  C04B41/4517 ,  C04B41/4539 ,  C04B41/5133 ,  C04B41/4541 ,  C04B41/5144 ,  C04B41/5127 ,  C04B41/522 ,  C04B41/5116 ,  H01L2924/00

公开(公告)号：EP0804056B1

公开(公告)日：2009-06-17

申请号：EP97106924.0

申请日：1997-04-25

Applicant: NGK Spark Plug Co. Ltd.

Inventor： Yamasaki, Kozo, c/o NGK Spark Plug Co.,Ltd ,  Saiki, Hajime, c/o NGK Spark Plug Co.,Ltd

IPC: H05K3/34 ,  H01R43/02

CPC classification number: H01R12/52 ,  H01R43/0235 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49165

公开(公告)号：EP2001069A2

公开(公告)日：2008-12-10

申请号：EP08251797.0

申请日：2008-05-23

Applicant: Nitto Denko Corporation

Inventor： Yamazaki, Taiki, c/o Nitto Denko Corporation ,  Sueyoshi, Taiki, c/o Nitto Denko Corporation

IPC: H01M8/02

CPC classification number: H05K3/249 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/04201 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0272 ,  H05K1/16 ,  H05K3/06 ,  H05K2201/035 ,  H05K2201/056 ,  Y02E60/523

Abstract: An FPC board includes a base insulating layer made of polyimide, for example. A conductor layer made of copper, for example, is formed on one surface of the base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and extraction conductor portions extending in long-sized shapes from the collector portions. A coating layer is formed on the base insulating layer so as to coat the conductor layer. The coating layer is formed so as to coat the collector portions and the extraction conductor portions of the conductor layer. The coating layer is made of a resin composition containing carbon.

Abstract translation: FPC基板包括例如由聚酰亚胺制成的基底绝缘层。 例如，由铜制成的导体层形成在基底绝缘层的一个表面上。 导体层由一对矩形集电器部分和从集电部分延伸成长尺寸形状的引出导体部分组成。 在基底绝缘层上形成涂层以涂覆导体层。 涂层形成为涂覆导体层的集电体部分和引出导体部分。 涂层由含有碳的树脂组合物制成。

公开(公告)号：EP1364220A4

公开(公告)日：2007-06-27

申请号：EP02709401

申请日：2002-02-07

Applicant: INTERLINK ELECTRONICS INC

Inventor： BAKER JEFFREY R ,  SANCHEZ CARLOS S

IPC: G01R27/08 ,  G01L1/20 ,  H01H13/702 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K3/24 ,  H05K3/30 ,  H05K3/36

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

公开(公告)号：EP1772876A2

公开(公告)日：2007-04-11

申请号：EP06018840.6

申请日：2006-09-08

Applicant: E.I. du Pont de Nemours and Company

Inventor： Akimoto, Hideki

IPC: H01C17/242

CPC classification number: H01C17/24 ,  H05K1/095 ,  H05K1/167 ,  H05K3/125 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0361 ,  H05K2203/171

Abstract: Described herein is a resistor (11) to which a trimming process is applied (hereinafter, also called a trimming resistor), a method for manufacturing a trimming resistor (11) and a circuit substrate (30a) using the trimming resistor (11).

Abstract translation: 这里描述的是施加微调处理的电阻器（11）（以下也称为微调电阻器），使用微调电阻器（11）制造微调电阻器（11）和电路基板（30a）的方法。

公开(公告)号：EP1599077A1

公开(公告)日：2005-11-23

申请号：EP05291071.8

申请日：2005-05-18

Applicant: Aries Electronics, Inc

Inventor： Walter, James P. ,  Sinclair, William Y.

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2203/0554 ,  Y10T29/49147

Abstract: A method of creating domed shaped contacts on a printed circuit board (12) includes etching or drilling a central opening in each copper pad (14), and then screening a mound of silver epoxy into the opening. The silver epoxy above the pad slumps to form a domed bump. The silver epoxy is then cured and is coated, in turn, by a layer of electroless nickel (24) and gold (26). The resulting gold plated contacts are of monolithic structure and function to facilitate connection to a mezzanine board.

Abstract translation: 在印刷电路板（12）上形成圆顶形触点的方法包括蚀刻或钻取每个铜垫（14）中的中心开口，然后将银环氧树脂堰一起筛选到开口中。 垫上的银环氧树脂塌陷形成圆顶凸起。 然后将银环氧树脂固化，并依次由一层无电镀镍（24）和金（26）涂覆。 所得到的镀金触点具有整体结构，并且有助于连接到夹层板。

公开(公告)号：EP1542518A1

公开(公告)日：2005-06-15

申请号：EP03730747.7

申请日：2003-06-02

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： HAYASHI, N., Osaka Works SUMITOMO ELEC. IND. LTD. ,  OKA, Y., Osaka Works of SUMITOMO ELEC. IND. LTD. ,  KANDA, Masahiko ,  YAGI, N., Osaka Works of SUMITOMO ELEC. IND. LTD. ,  MIYAZAKI, K., Osaka Works SUMITOMO ELEC. IND. LTD. ,  NAKATSUGI, K., Osaka Works SUMITOMO ELEC. IND. LTD

IPC: H05K3/12 ,  H05K3/16

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 µm or less and the maximum particle diameter of which is 15 µm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

Abstract translation: 一种新的板，用于印刷电路，其包括具有一个明确的和有利的边界线，并通过在序印刷方法制造的细导体配线：例如丝网印刷，使用相同的印刷电路板，和用于制造它们的方法。 一种用于印刷电路板和用于制造该中DASS的特征的方法管芯的基板的表面进行的表面处理之一：（a）粗化，（2）等离子体处理，（3）粗糙化，然后等离子处理， 和（4）粗糙化，然后，通过溅射形成金属薄膜包衣的。 的印刷电路板以及用于制造它的方法是表征在没有导体布线是通过使用导电膏包含金属颗粒的所有的平均粒径是4微米或更小，所有的最大粒径是15印刷制造 微米或更小。 另一印刷电路板以及用于制造它的方法，使用以1.1 M / B的体积比的导电膏包含金属颗粒M和粘合剂乙制造的导体布线的DASS模具表面，其特征在于，以1.9 / 1 被蚀刻，电镀涂层的表面上形成。

公开(公告)号：EP1364220A2

公开(公告)日：2003-11-26

申请号：EP02709401.0

申请日：2002-02-07

Applicant: INTERLINK ELECTRONICS, INC.

Inventor： BAKER, Jeffrey, R. ,  SANCHEZ, Carlos, S.

IPC: G01R27/08

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.