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    Thick-film capacitors and methods of making them
    161.
    发明公开
    Thick-film capacitors and methods of making them 审中-公开
    Dickschichtkondensatoren und Verfahren zu deren Herstellung

    公开(公告)号：EP1667206A1

    公开(公告)日：2006-06-07

    申请号：EP05257178.3

    申请日：2005-11-22

    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

    Inventor： Borland, William J.

    IPC: H01L21/00 ,  H01G4/12 ,  H05K1/16

    CPC classification number: H05K1/162 ,  H01L27/013 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/1126 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49156

    Abstract: The invention provides a method of making a capacitor comprising: providing a metallic foil; forming a capacitor dielectric over said metallic foil; forming a first electrode over a portion of said capacitor dielectric, thus forming a component side of said metallic foil; laminating the component side of said metallic foil to a laminate material; and etching said metallic foil outside the boundary of said capacitor dielectric to form a second electrode. Using this method allows the laminate material to prevent etching solutions from coming in contact with and damaging the capacitor dielectric layers.

    Abstract translation: 本发明提供一种制造电容器的方法，包括：提供金属箔; 在所述金属箔上形成电容器电介质; 在所述电容器电介质的一部分上形成第一电极，从而形成所述金属箔的部件侧; 将所述金属箔的组件侧层压到层压材料上; 以及在所述电容器电介质的边界之外蚀刻所述金属箔以形成第二电极。 使用该方法允许层压材料防止蚀刻溶液与电容器电介质层接触并损坏电容器电介质层。

    Capacitive/Resistive devices, high dielectric constant organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
    162.
    发明公开
    Capacitive/Resistive devices, high dielectric constant organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof 有权
    电容/电阻器件，高介电常数的有机介电层压板及印刷电路板具有这样的设备，并且它们的制备方法

    公开(公告)号：EP1648207A2

    公开(公告)日：2006-04-19

    申请号：EP05020896.6

    申请日：2005-09-26

    Applicant: E.I. du Pont de Nemours and Company

    Inventor： Borland, Willima J. ,  Cox, Sidney G. ,  McGregor, David Ross

    IPC: H05K1/16 ,  H01G4/40

    CPC classification number: H01C17/06533 ,  H01C7/005 ,  H01C17/06586 ,  H01G4/40 ,  H05K1/162 ,  H05K1/167 ,  H05K3/429 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/09763 ,  Y10T29/49155

    Abstract: A capacitive/resistive device (101) provides both resistive and capacitive functions. The capacitive/resistive device (101) may be embedded within a layer of a printed wiring board (1000). The capacitive/resistive device (101) comprises a first electrode (110); a dielectric (120) disposed over the first electrode (110); a resistor element (140) formed on and adjacent to the dielectric (120); a conductive trace (145); and a second electrode (130) disposed over the dielectric (120) and in electrical contact with the resistor element (140), wherein the dielectric is disposed between the first electrode (110) and the second electrode (130) and wherein the dielectric (120) comprises a polymer filled with a high dielectric constant powder phase.

    Abstract translation: 电容/电阻装置（101）同时提供电阻和电容的功能。 的电容/电阻装置（101）可被嵌入印刷线路板（1000）的一个层内。 的电容/电阻装置（101）包括第一电极（110）; 设置在第一电极（110）的电介质（120）; 一个电阻器元件（140）上形成并邻近所述电介质（120）; 的导电迹线（145）; 和设置在所述电介质（120），并与worin所述电介质是所述第一电极（110）和第二电极（130）之间设置在所述电阻器元件（140）电接触的第二电极（130）和worin所述电介质（ 120）包括填充有具有高介电常数的粉末相的聚合物。

    Circuitized substrate with an internal organic memory device
    163.
    发明公开
    Circuitized substrate with an internal organic memory device 审中-公开
    Schaltungssubstrat mit einer eingebetten organischen Speichervorrichtung

    公开(公告)号：EP1622433A1

    公开(公告)日：2006-02-01

    申请号：EP05254523.3

    申请日：2005-07-20

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

    IPC: H05K1/16

    CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

    Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.

    Abstract translation: 由至少一个其上具有导电图案的介电材料（13）组成的电路化基板（11）。 图案的至少一部分被用作有机存储器件（35）的第一层，该有机存储器件（35）还包括至少第二电介质层，并且相对于下部部分对准第二电介质层，以实现几个接触点 从而形成设备。 衬底（11）优选地与其它介质电路分层组件组合以形成多层衬底，其上可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其中以与之组合工作。 还提供能够使用基板的电气组件（71），以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统（101）。

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