公开(公告)号：KR1020100098989A

公开(公告)日：2010-09-10

申请号：KR1020090017733

申请日：2009-03-02

Applicant: 엘지이노텍 주식회사

Inventor： 김경준 ,  박철호

IPC: H01L33/48

CPC classification number: H05K1/183 ,  F21K9/00 ,  F21K9/20 ,  F21V19/045 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01087 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  Y10S362/80 ,  H01L2924/00014

Abstract: PURPOSE: A light emitting module and a light unit including the same are provided to regulate the brightness uniformity and the moire characteristic by varying the amount of light emitting devices and the gap between the light emitting devices. CONSTITUTION: A substrate(110) includes a device hole(117), a first pad, and a second pad. A plurality of light emitting devices(130) is electrically connected with the first and the second pads. The light emitting devices include a body, which includes a light emitting diode chip, a first lead electrode(135), and a second lead electrode(136). The first and the second lead electrodes are protruded from both sides of the body. The body is inserted into the device hole. The first and the second lead electrodes are inserted into a first lead unit and a second lead unit, respectively.

Abstract translation: 目的：提供发光模块和包括该发光模块的光单元，以通过改变发光器件的数量和发光器件之间的间隙来调节亮度均匀性和莫尔条纹特性。 构成：衬底（110）包括器件孔（117），第一焊盘和第二焊盘。 多个发光器件（130）与第一和第二焊盘电连接。 发光器件包括主体，其包括发光二极管芯片，第一引线电极（135）和第二引线电极（136）。 第一和第二引线电极从主体的两侧突出。 身体插入设备孔中。 第一和第二引线电极分别插入第一引线单元和第二引线单元中。

公开(公告)号：KR1020100069704A

公开(公告)日：2010-06-24

申请号：KR1020107009879

申请日：2008-12-22

Applicant: 미쓰비시덴키 가부시키가이샤

Inventor： 기도코로히토시

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K1/18 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913

Abstract: In the case of mounting upright an axial lead type electronic component subjected to U character forming on a printed board, two axial lead type electronic components subjected to U character forming are arranged so as not to be located on the same line, and a wiring pattern is provided such that the lead wires on the curved side have the same potential. Since each electronic component is tilted so that the lead wires on the curved side are brought close to each other, the electronic components are supported each other by the lead wires on the curved side. Consequently, the electronic component can be prevented from collapsing without spoiling heat dissipation properties of the electronic component and the substrate, and without greatly deteriorating assemblability of the substrate.

Abstract translation: 在将U字形成型的轴向引线型电子部件安装在印刷电路板上的情况下，经受U字形成的两个轴向引线型电子部件被布置成不位于同一条线上，并且布线图案 被设置为使得弯曲侧的引线具有相同的电位。 由于每个电子部件被倾斜使得弯曲侧的引线彼此靠近，所以电子部件由弯曲侧的引线彼此支撑。 因此，可以防止电子部件塌陷而不破坏电子部件和基板的散热特性，并且不会使基板的组装性大大降低。

公开(公告)号：KR100915549B1

公开(公告)日：2009-09-03

申请号：KR1020080006032

申请日：2008-01-21

Applicant: 에버라이트 일렉트로닉스 컴패니 리미티드

Inventor： 셍-지아쉐우 ,  치엔-창페이

IPC: H01L33/62

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: 발광 다이오드의 한 가지 구조를 개시한다. 이 발광 다이오드는 발광 다이오드 다이(die); 전자적으로 각각 상기 발광 다이오드 다이의 양극(anode)과 음극(cathode)에 연결되는 두 개의 전도성 리드프레임과 두 개의 기판을 포함한다. 각 전도성 리드프레임은 고정 구멍(fixing hole)을 가지며, 각 기판은 돌출 기둥(protrusive pillar)를 가지고 있다. 상기 고정 구멍의 위쪽 개구는 바닥쪽 개구보다 더 넓다. 상기 돌출 기둥은 상기 고정 구멍에 삽입되고, 상기 돌출 기둥의 형태는 이 고정 구멍에 들어맞고 단단히 결합되도록 변형된다.

公开(公告)号：KR1020090085868A

公开(公告)日：2009-08-10

申请号：KR1020080011761

申请日：2008-02-05

Applicant: 엘지이노텍 주식회사

Inventor： 김경준

IPC: H01L33/62 ,  H01L33/48

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting apparatus is provided to prevent mechanical deflection of a flexible substrate by attaching a stiffened plate on a bottom part of the flexible substrate. A light emitting apparatus includes a LED(100) and a flexible substrate(150). The LED includes a body, a first lead electrode(134), and a second lead electrode(135). The first lead electrode and the second lead electrode are formed in one side of the body. A first electrode pad(158) and a second electrode pad(159) are formed on the flexible substrate. A shape of the first electrode pad and the second electrode pad is the same as a shape of the first lead electrode and the second lead electrode. The first lead electrode, the second lead electrode, the first electrode pad, and the second electrode pad are formed into a polygonal shape or a partially cut shape. The flexible substrate includes a bottom cover lay film and a bottom stiffened plate. The bottom stiffened plate is formed on one surface of the bottom cover lay film.

Abstract translation: 提供一种发光装置，用于通过将加强板附接在柔性基板的底部上来防止柔性基板的机械偏转。 发光装置包括LED（100）和柔性基板（150）。 LED包括主体，第一引线电极（134）和第二引线电极（135）。 第一引线电极和第二引线电极形成在主体的一侧。 第一电极焊盘（158）和第二电极焊盘（159）形成在柔性基板上。 第一电极焊盘和第二电极焊盘的形状与第一引线电极和第二引线电极的形状相同。 第一引线电极，第二引线电极，第一电极焊盘和第二电极焊盘形成为多边形或部分切割形状。 柔性基板包括底盖放置膜和底部加强板。 底部加强板形成在底盖放置膜的一个表面上。

公开(公告)号：KR1020080079179A

公开(公告)日：2008-08-29

申请号：KR1020080006032

申请日：2008-01-21

Applicant: 에버라이트 일렉트로닉스 컴패니 리미티드

Inventor： 셍-지아쉐우 ,  치엔-창페이

IPC: H01L33/62

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode and a diode assembling method are provided to extend a lifetime of the LED(Light Emitting Diode) by improving heat radiating efficiency of the LED. A structure of a light emitting diode includes an LED(100), two conductive frames(104,104'), two substrates(108,108'), and two protrusive pillars(110,110'). The conductive frames are electrically connected to an anode and a cathode of the LED and have two fixing holes(106,106'). The protrusive pillars are formed on the substrates, respectively. The protrusive pillars are inserted into the fixing holes, respectively, and deformed, such that the protrusive pillars are attached to the fixing holes. An exit-side opening of the fixing hole is wider than an inlet-side opening of the fixing hole.

Abstract translation: 提供发光二极管和二极管组装方法的结构，通过提高LED的散热效率来延长LED（发光二极管）的寿命。 发光二极管的结构包括LED（100），两个导电框架（104,104'），两个基板（108,108'）和两个突出支柱（110,110'）。 导电框架电连接到LED的阳极和阴极，并且具有两个固定孔（106,106'）。 突起柱分别形成在基板上。 突出柱分别插入固定孔中并变形，使得突出柱附接到固定孔。 固定孔的出口侧开口比固定孔的入口侧开口宽。

公开(公告)号：KR1020080041494A

公开(公告)日：2008-05-13

申请号：KR1020060109639

申请日：2006-11-07

Applicant: 삼성디스플레이 주식회사

Inventor： 박진희 ,  강정태 ,  하진호 ,  배현철 ,  김주영

IPC: G02F1/13357

CPC classification number: F21V19/0025 ,  G02F1/133603 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/182 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2201/10878 ,  H01L2924/00014

Abstract: A light source unit, and a backlight unit and an LCD(Liquid Crystal Display) device having the same are provided to mount an LED on a PCB by fastening without soldering to replace the LED with a good one when a defect occurs in the LED, thereby reducing material cost and the production cost of the light source unit. An LED(Light Emitting Diode)(410) comprises a substrate(411), a light emitting chip, a wire, a molding portion(414), a first base portion, a first lead terminal(415), and a second lead terminal(416). If the first head portion of the first lead terminal is inserted and penetrated into the first fastening hole, a first projected portion is disposed into the first fastening hole. The first head portion is disposed on a surface on which a circuit pattern is formed. The first base portion is formed on a surface opposite to the surface, on which the circuit pattern is formed, for the first lead terminal to be fastened to the first fastening hole. As the first head portion is in contact with the circuit pattern of a PCB(Printed Circuit Board), the first lead terminal is electrically connected to the circuit pattern without separate soldering.

Abstract translation: 提供具有该光源单元的光源单元以及具有该光源单元的背光单元和LCD（液晶显示器）装置，以便在LED未发生缺陷的情况下通过紧固而不焊接来将LED安装在PCB上，以更换LED， 从而降低光源单元的材料成本和生产成本。 LED（发光二极管）（410）包括基板（411），发光芯片，导线，模制部分（414），第一基座部分，第一引线端子（415）和第二引线端子 （416）。 如果第一引线端子的第一头部插入并穿入第一紧固孔，则第一突出部分设置在第一紧固孔中。 第一头部设置在其上形成有电路图案的表面上。 第一基部形成在与形成有电路图案的表面相对的表面上，用于将第一引线端子紧固到第一紧固孔。 当第一头部与PCB（印刷电路板）的电路图案接触时，第一引线端子电连接到电路图案而不需要单独的焊接。

公开(公告)号：KR1020080003921A

公开(公告)日：2008-01-08

申请号：KR1020077027208

申请日：2005-05-24

Applicant: 후지쯔 가부시끼가이샤

Inventor： 다케우치슈이치

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A mounting structure for an IC tag where an IC chip (10) for mounting purpose is mounted electrically connected with antenna patterns (44a, 44b). The structure facilitates assembling work where the IC chip (10) is mounted on the antenna patterns (44a, 44b), reducing production costs of the IC tag. In the IC chip (10), conductive wires (12a, 12b) are wound around an IC chip (20), with the IC chip (10) being mechanically in contact with and electrically connected to electrodes formed on the IC chip (20), so as to circle the outer surfaces between opposite sides of the IC chip (20), and the IC chip (10) is joined to the antenna patterns (44a, 44b) via the conductive wires (12a, 12b).

Abstract translation: 用于安装目的的IC芯片（10）与天线图案（44a，44b）电连接的用于IC标签的安装结构。 该结构有助于将IC芯片（10）安装在天线图案（44a，44b）上的组装工作，从而降低了IC标签的生产成本。 在IC芯片（10）中，导线（12a，12b）缠绕在IC芯片（20）上，IC芯片（10）机械地与IC芯片（20）上形成的电极接触并电连接， ，以便使IC芯片（20）的相对侧之间的外表面环绕，并且通过导线（12a，12b）将IC芯片（10）接合到天线图案（44a，44b）。

公开(公告)号：KR100782747B1

公开(公告)日：2007-12-05

申请号：KR1020050070805

申请日：2005-08-02

Applicant: 삼성전기주식회사

Inventor： 한경택 ,  이선구 ,  함헌주 ,  한성연 ,  송창호 ,  박영삼

IPC: H01L33/62

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: 본 발명은 납땜 구조를 개선한 LED, 이 LED를 납땜을 통해 기판에 조립하는 방법 및 이 조립 방법에 의해 제조한 LED 어셈블리에 관한 것이다. 상기 LED는 LED 칩; 일단이 상기 LED 칩과 전기적으로 연결되고 외부 전원과 연결될 타단에는 홈 또는 구멍이 뚫린 한 쌍의 리드; 상기 LED 칩 쪽의 상기 리드의 일부를 봉지하는 패키지 본체; 및 상기 LED 칩 쪽의 상기 패키지 본체의 일면에 씌워지고 상기 LED 칩에서 발생된 빛을 측방으로 방출하도록 구성된 투명 렌즈를 포함한다. 이렇게 하면, 리드의 타단을 솔더에 올려놓고 납땜 작업할 때의 작업 조건을 개선하고 솔더 재료를 절감하면서 납땜 후의 강도를 향상시킬 수 있다.
LED, 리드, 리드의 구멍, 납땜, 솔더

Abstract translation: 本发明涉及具有改进的焊接结构的LED，通过焊接将LED组装到基板上的方法，以及通过该方法制造的LED组件。 其中LED包括LED芯片; 一对引线，其一端电连接到LED芯片，另一端连接到具有凹槽或孔的外部电源; 一个封装体，用于密封LED芯片侧面的一部分引线; 以及透明透镜，其覆盖LED芯片侧的封装主体的一侧，并被配置为横向发射从LED芯片产生的光。 通过这样做，可以将引线的另一端放置在焊料上以改善焊接工作中的工作条件，并且可以节省焊料材料，并且可以改善焊接后的强度。

公开(公告)号：WO2017009045A1

公开(公告)日：2017-01-19

申请号：PCT/EP2016/065126

申请日：2016-06-29

Applicant: CONTI TEMIC MICROELECTRONIC GMBH

Inventor： GRÜBL, Wolfgang ,  SCHUCH, Bernhard ,  TRAGESER, Hubert

IPC: H05K3/32 ,  H01R4/04 ,  H05K1/11

CPC classification number: H05K3/321 ,  H01R4/04 ,  H05K1/111 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: Die vorliegende Erfindung betrifft eine elektronische Anordnung (1), zumindest umfassend einen Schaltungskomponententräger (2) und ein elektrisches Bauelement (8), bei dem es sich vorzugsweise um einen elektrischen Widerstand (9) handelt, wobei der Schaltungskomponententräger (2) ein Substrat (3) und vorzugsweise darauf angebracht elektrische Leiter, bei denen es sich zum Beispiel um Leiterbahnen (4, 5, 6, 7) handelt, aufweist und wobei das elektrische Bauelement (8) zumindest zwei Anschlüsse (10, 11) aufweist und jeder der zumindest zwei Anschlüsse (10, 11) mittels elektrisch leitfähigem Klebstoff (12) an dem Schaltungskomponententräger (2) angebracht ist. Zur vorteilhaften Weiterbildung schlägt die Erfindung vor, dass jeder der zumindest zwei Anschlüsse (10, 11) mittels zwei voneinander getrennten, elektrisch leitfähigen Klebstoff (12) aufweisenden Klebeverbindungen (14, 15, 16, 17) an dem Schaltungskomponententräger (2) angebracht ist. Die Erfindung betrifft auch ein Verfahren zur Herstellung einer solchen elektronischen Anordnung (1).

Abstract translation: 本发明涉及一种电子组件（1），至少包括一个电路部件载体（2）和电元件（8），其优选为一个电阻（9），其中，所述电路部件载体（2）的基板（3 ），优选安装在其上的电导体，它们是，例如，导体轨迹（4，5，6，7）是，且其中所述电元件（8）（至少两个终端10，其包括11），并且每个所述至少两个的 端子（10，11）由所述电路部件载体（2）上的导电粘合剂（12）的装置安装。 对于有利的进一步改进，本发明提出使得每个所述至少两个端子（10,11）由两个单独的，导电性粘接剂（12），其包括粘合剂的化合物的装置（14，15，16，17）被附接到所述电路部件载体（2）。 本发明还涉及用于制备这样的电子组件（1）的方法。

公开(公告)号：WO2015195223A1

公开(公告)日：2015-12-23

申请号：PCT/US2015/030201

申请日：2015-05-11

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： AHMED, Yasoob ,  SIEVERS, Steven

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: F21V19/002 ,  F21V23/005 ,  F21V23/06 ,  F21W2111/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A holder structure for mounting light indicators on printed circuit boards using surface mount technology at a position elevated above the surface of the board is provided with a body member including a top wall, a bottom wall, opposed sidewalls, a front wall, and a rear wall, all being formed integrally together. Two spaced-apart recesses are formed and aligned vertically in the front wall of the body member terminating in respective first and second interior wall portions. The first interior wall portion has openings formed on diametrically opposed sides of a vertical partition and lying in a horizontal plane parallel to the bottom wall. The second interior wall portion has openings formed on diametrically opposed sides of a transverse partition and lying in a plane which is rotated a predetermined number of degrees from a vertical plane perpendicular to the bottom wall.

Abstract translation: 一种用于在印刷电路板上使用表面贴装技术将光指示器安装在高于板表面的位置的支架结构设置有主体部件，主体部件包括顶壁，底壁，相对的侧壁，前壁和后部 墙壁，整体形成在一起。 形成两个间隔开的凹部并且在主体构件的前壁中垂直排列，终止于相应的第一和第二内壁部分。 第一内壁部分具有形成在垂直隔板的直径相对的侧面上并且位于平行于底壁的水平面中的开口。 第二内壁部分具有形成在横向隔板的直径相对侧上的开口，并且位于从垂直于底壁的垂直平面旋转预定数量的平面中。