Abstract:
A flame-retarded copper-clad laminate is provided comprising a plurality of paper substrate layers each impregnated with an unsaturated polyester resin and a copper cladding adhesively bonded onto at least one side thereof.The improvement comprises said unsaturated polyester resin containing an aliphatic and/or alicyclic brominated flame-retardant and aromatic brominated flame-retardant in combination.
Abstract:
A metal-clad laminate comprising a base plate composed of a plurality of electrically insulating material layers and a metal foil or foils laminated on one side or both sides of the base plate, characterized in that to at least the metal foil or foils is laminated an electrically insulating material layer composed of a silane-modified polyethylene resin sheet, that to the silane-modified polyethylene resin is laminated an electrically insulating material layer made of a paper or cloth containing an epoxy resin and/or a silanol condensation catalyst, and that the layer made of a paper or cloth contains 5 to 35% by weight of an epoxy resin and/or that to the layer made of a paper or cloth is laminated an electrically insulating material layer other than the above-mentioned two layers. Said metal-clad laminate has excellent characteristics such as low, .epsilon., low tan .delta. and excellent moisture-resistant insulating property.
Abstract:
An electrical laminate comprising layers of an unsaturated polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a mixture and/or a condensate of an aminoplast with a higher fatty derivative having at least one functional group capable of condensation with the methylol group of aminoplast. The laminate exhibits improved moisture resistance and punchability.
Abstract:
A base material for the production of printed circuits according to the additive method includes a laminate base made up of laminated-together core sheets impregnated with hardenable resin, and a cover layer made up of a substrate sheet preimpregnated with phenolic resol resin and provided with an adhesive layer of an elastomeric polymer. The preimpregnated substrate sheet is also provided with a further resin impregnation containing a self-crosslinking copolymer of acrylic monomers and up to 30% by weight of a hardenable phenolic resol resin.
Abstract:
The insulating substrate comprises an insulating sheet made of cellulose material and a prepreg impregnated with a thermosetting resin and bonded to at least one surface of the insulating substrate. A printed circuit board is prepared by forming electric conductors arranged in a predetermined circuit pattern on the surface of the prepreg.
Abstract:
Self-extinguishing laminates are made by an improved process, wherein individual layers of a carrier material are impregnated with a thermosetting phenolic resin containing a flame-retardant agent and the impregnated layers are placed one above another and bonded together by compressing them at elevated temperature and under elevated pressure to give a hardened laminate. More specifically, finely pulverulent phosphorus pentanitride as a flame-retarding agent is dispersed in the plasticized or non-plasticized thermosetting phenolic resin, with or without a diluent; the phenolic resin, based on its solid matter content, and the phosphorus pentanitride being used in an approximate ratio by weight of 100:4 to 100:15; and the phenolic resin, based on its solid matter content, and the carrier being used in an approximate ratio by weight of 100:80 to 100:150.
Abstract:
A process for the manufacture of printed substrates and decalcomania compositions used therefor comprising a permeable backing paper, water-soluble binder, printed pattern such as hybrid or monolithic circuit, and removable cover coat, these components being laminated one upon another.
Abstract:
A transfer device comprises a base layer of paper or the like, an adhesive layer attached to said base layer directly or by means of a thin paper, a conductive pattern or circuit element pattern printed on said adhesive layer and, further, a carrier layer over said pattern. Printed wiring, integrated circuits or the like are fabricated by printing a circuit pattern on the base layer and covering same with the carrier layer, removing the base layer and mounting the circuit pattern and carrier layer on a substrate.