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    Metal coated laminate products made from textured polymide film
    176.
    发明公开
    Metal coated laminate products made from textured polymide film 失效
    Metallbeschichtete Laminatprodukte，hergestellt aus einem texturierten Polyimidfilm。

    公开(公告)号：EP0329406A1

    公开(公告)日：1989-08-23

    申请号：EP89301432.4

    申请日：1989-02-15

    Applicant: Polyonics Corporation

    Inventor： Walsh, Daniel Patrick

    IPC: C23C28/02 ,  B32B15/08

    CPC classification number: H05K3/181 ,  C23C18/22 ,  C25D5/56 ,  H05K1/0346 ,  H05K3/022 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12944

    Abstract: A process for coating at least one surface of a polyimide sheet with copper in the absence of an adhesive, initially comprises hydrophilizing the surfaces of the polyimide with a caustic solution, then contacting said sheet with a catalyst to create surfaces receptive to electroless deposition of nickel or cobalt. After depositing nickel or cobalt coatings which are electrically conductive, microcracks are formed in said coatings, and said polyimide sheet coated with nickel or cobalt containing microcracks is heated to volatalize components in said polyimide sheet. Subsequently copper is deposited on said nickel surface or cobalt surface by electrolytic deposition to form exposed copper coatings on said polyimide sheet. The layers of the resulting laminate are tenaciously bonded, exceeding current standard bond strength requirements for materials to be used in electronic circuitry.

    Abstract translation: 在不存在粘合剂的情况下用铜涂覆聚酰亚胺片材的至少一个表面的方法最初包括用苛性碱使聚酰亚胺的表面亲水化，然后使所述片材与催化剂接触以产生接受无电沉积镍的表面 或钴。 在沉积导电的镍或钴涂层之后，在所述涂层中形成微裂纹，并且加热涂覆有镍或钴的微裂纹的所述聚酰亚胺片材以使所述聚酰亚胺片材中的组分挥发。 随后通过电解沉积将铜沉积在所述镍表面或钴表面上，以在所述聚酰亚胺片上形成暴露的铜涂层。 所得层压材料的层被牢固地粘合，超过了用于电子电路中的材料的当前标准粘结强度要求。

    METAL-COATED POLYIMIDE RESIN SUBSTRATE WITH EXCELLENT THERMAL AGING RESISTANCE PROPERTIES
    180.
    发明公开
    METAL-COATED POLYIMIDE RESIN SUBSTRATE WITH EXCELLENT THERMAL AGING RESISTANCE PROPERTIES 审中-公开
    金属涂覆的聚酰亚胺树脂基材具有优异的耐热老化性能

    公开(公告)号：EP2402485A1

    公开(公告)日：2012-01-04

    申请号：EP10746116.2

    申请日：2010-02-17

    Applicant: JX Nippon Mining & Metals Corporation

    Inventor： YOSHIDA Taku

    IPC: C23C28/02 ,  B32B15/088 ,  C23C18/20 ,  C25D5/56 ,  H05K3/24 ,  H05K3/38

    CPC classification number: H05K3/388 ,  C23C18/1651 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/24 ,  C25D5/56 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2201/2063 ,  Y10T428/12535 ,  Y10T428/31721

    Abstract: [Object] To provide a metal-coated polyimide resin substrate that does not deteriorate the initial adhesion between the metal-coated polyimide resin film and the metal layer and has high adhesion after aging at 150°C for 168 hours.
    [solution] A metal-coated polyimide resin substrate in which a barrier layer is formed by a wet process after performing surface modification to one surface or both surfaces of a polyimide resin film by a wet process or a dry process or a combination thereof, a seed layer is thereafter formed by a wet process or a dry process, and a conductive film is formed on a surface layer thereof by a wet process; wherein, at the peeling surface on the conductive film layer side after the metal-coated polyimide resin substrate is subject to a 90-degree peel test, the thickness of a mixed layer of polyimide; residue and barrier metal layer residue according to in-depth profiting with a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is 2.60 nm or less based on Si sputter rate conversion, and peel strength retention after an aging test at 150°C for 168 hours (peel strength after aging at 150°C for 168 hours/initial peel strength) is 50% or higher.

    Abstract translation: 本发明的目的在于提供一种金属包覆的聚酰亚胺树脂基材，该金属包覆的聚酰亚胺树脂基材不损害金属包覆的聚酰亚胺树脂膜与金属层之间的初始粘合性，并且在150℃老化168小时后具有高粘合性。 [溶液]金属涂覆的聚酰亚胺树脂基板，其中通过湿法或干法或其组合对聚酰亚胺树脂膜的一个表面或两个表面进行表面改性后通过湿法形成阻挡层， 然后通过湿法或干法形成种子层，并且通过湿法在其表面层上形成导电膜; 其中，在金属涂覆的聚酰亚胺树脂基板经过90度剥离测试之后，在导电膜层侧上的剥离表面处测量聚酰亚胺混合层的厚度; 根据飞行时间二次离子质谱仪（TOF-SIMS）的深度获益的残留物和阻挡金属层残留物基于Si溅射速率转换为2.60nm或更小，并且老化测试后的剥离强度保持为150 ℃168小时（在150℃下老化168小时后的剥离强度/初始剥离强度）为50％以上。

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