公开(公告)号：US20060189205A1

公开(公告)日：2006-08-24

申请号：US11353604

申请日：2006-02-14

Applicant: Eriko Noguchi

Inventor： Eriko Noguchi

IPC: H01R3/00

CPC classification number: H01M2/10 ,  H01M2/0222 ,  H01M2/0421 ,  H01M2/20 ,  H01M2/30 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/10666

Abstract: To prevent harmful glass fiber powders from being produced by abrasing and wearing a circuit board and to dispense with a change in a battery minus terminal when changed to a circuit board having a different thickness. Tongue shape locking spring portions formed at both ends of a minus battery terminal comprising an elastic thin plate are inserted into locking holes of a circuit board and the minus terminal is fixed to the circuit board by a contact pressure produced by bringing the tongue shape locking spring portions into contact with inner walls of the locking holes to be elastically deformed thereby. The tongue shape locking spring portion is constituted by a pair of tongue pieces symmetrical in a left and right direction, and each tongue piece includes a horizontal extended portion and a locking hole inserting portion. The locking hole inserting portion is formed with a projection in a semicircular shape brought into contact with the inner wall of the locking hole.

Abstract translation: 为了防止由于磨损和磨损电路板而产生有害的玻璃纤维粉末，并且当改变为具有不同厚度的电路板时，减少电池减去端子的变化。 在包括弹性薄板的负电池端子的两端形成的舌形锁定弹簧部分插入到电路板的锁定孔中，并且负端子通过使舌形锁定弹簧产生的接触压力固定到电路板 与锁定孔的内壁接触的部分由此弹性变形。 舌形锁定弹簧部分由在左右方向上对称的一对舌片构成，每个舌片包括水平延伸部分和锁定孔插入部分。 锁定孔插入部形成有与锁定孔的内壁接触的半圆形的突起。

公开(公告)号：US06954987B2

公开(公告)日：2005-10-18

申请号：US10849478

申请日：2004-05-19

Applicant: Kenneth Daryl Wong ,  Sean L. Bell

Inventor： Kenneth Daryl Wong ,  Sean L. Bell

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/44 ,  H01K3/10

CPC classification number: H05K3/44 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/1178 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

Abstract translation: 公开了一种印刷电路板组件，其采用与连接到导电托盘的焊料填充的互连通孔相邻的焊剂通气孔。 焊锡通气孔允许气体在回流焊接过程中从另一个密封的空腔中逸出，减轻正压，从而允许焊料流入其中。 通过为焊膏回流期间产生的被捕获的空气和气体提供逃生路径，熔融焊料的排气压力和重量足以使焊膏流入空腔。

公开(公告)号：US20050207114A1

公开(公告)日：2005-09-22

申请号：US10801515

申请日：2004-03-16

Applicant: Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

Inventor： Thomas Gall ,  Michael Pfeifer ,  Anthony Polak ,  Michael Pomeroy

IPC: H05K1/02 ,  H05K3/42 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0047 ,  H05K1/0215 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/42 ,  H05K5/0213 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/0999 ,  H05K2201/10666 ,  H05K2203/0191 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: A vent assembly (50) for an electronic control module (28) is provided. The vent assembly (50) may be adheringly coupled to a printed circuit board (38). The vent assembly (50) being adapted to prevent the ingress of moisture and permit the egress of certain gases.

Abstract translation: 提供了一种用于电子控制模块（28）的排气组件（50）。 通气组件（50）可以附着地联接到印刷电路板（38）。 排气组件（50）适于防止湿气进入并允许某些气体流出。

公开(公告)号：US20050122700A1

公开(公告)日：2005-06-09

申请号：US10790310

申请日：2004-03-01

Applicant: Deok-heung Kim ,  Bong-hui Lee

Inventor： Deok-heung Kim ,  Bong-hui Lee

IPC: H05K1/02 ,  H05K1/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H01R11/09 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

Abstract: A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Abstract translation: 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

公开(公告)号：US06750396B2

公开(公告)日：2004-06-15

申请号：US09737303

申请日：2000-12-15

Applicant: Apurba Roy

Inventor： Apurba Roy

IPC: H05K500

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface-mount connector includes a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

Abstract translation: 低阻表面安装连接器包括具有I形横截面的圆柱形杆的长度。 该器件允许通过拾取和放置技术进行互连，并且互连具有低电阻，低电感，机械符合性和易于制造的优点。 具有一个或多个电路部件的第一电路装置通过将这种连接器表面安装在第一电路装置上而与第二电路装置互连，在第二电路装置上提供相应的焊盘，并将第一电路装置的连接器安装到焊盘 的第二。

公开(公告)号：US20040066589A1

公开(公告)日：2004-04-08

申请号：US10674471

申请日：2003-10-01

Applicant: TDK CORPORATION

Inventor： Masaaki Togashi ,  Taisuki Ahiko

IPC: H02H007/16

CPC classification number: H01G2/065 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10636 ,  H05K2201/10666 ,  Y02P70/611

Abstract: A multilayer capacitor (2) consisting of a capacitor body (1) and an interposer board (20) arranged underneath it, wherein a pair of land patterns are arranged on a front surface of the interposer board (20) for connection with a pair of terminal electrodes of the capacitor body (11) and (12), and a pair of external electrodes are arranged on a back surface of the interposer board (20) for connection with interconnect patterns (34) of a mounting board (33) by solder (35), the pair of land patterns and the pair of external electrodes being arranged on the interposer board (20) so that a direction of a line connecting the pair of land patterns and a direction of a line connecting the pair of external electrodes intersect perpendicularly.

公开(公告)号：US20030214047A1

公开(公告)日：2003-11-20

申请号：US10259482

申请日：2002-09-30

Inventor： Takashi Noguchi

IPC: H01L023/48

CPC classification number: H01L22/32 ,  H01L23/498 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3651 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/0394 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

Abstract translation: 一种可以降低故障发生率的半导体器件的安装方法，可以容易地修复有缺陷的焊点的半导体器件的修复方法以及使这些方法可行的半导体器件。 衬底1上形成有布线层9内衬在内壁上的通孔7，并且焊球6以覆盖通孔7的方式熔合到衬底1上。在安装过程中 或者在维修过程中，加热用探针41穿过通孔7并推入焊球6，从而熔化焊球，并将加热探针从焊球中拉出以使焊球冷却。 在这些处理中，仅可以加热焊球6，从而避免对IC芯片3的不利影响。在修复过程中，焊球6可以恢复到没有金属间化合物的初始条件。

公开(公告)号：US06617528B2

公开(公告)日：2003-09-09

申请号：US09764476

申请日：2001-01-17

Applicant: Gregg J. Armezzani ,  Matthew A. Heller

Inventor： Gregg J. Armezzani ,  Matthew A. Heller

IPC: H05K111

CPC classification number: H01L23/4985 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/363 ,  H05K2201/096 ,  H05K2201/10666 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0455 ,  H01L2924/00

Abstract: An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

Abstract translation: 一种电子封装，其包括通过焊料固定在一起的第一和第二电路化基板，该焊接部件包括用于附接到印刷电路板的第一接触部分和用于将两个基板接合在一起的第二接触部分（例如，以形成多芯片 模块）。 半导体芯片可以定位在所形成的焊料部件上并电耦合到所形成的焊接部件上。

公开(公告)号：US20020131255A1

公开(公告)日：2002-09-19

申请号：US10138173

申请日：2002-05-02

Inventor： Apurba Roy

IPC: H01R012/14

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

公开(公告)号：US20020088986A1

公开(公告)日：2002-07-11

申请号：US10005960

申请日：2001-12-03

Inventor： Shun Kayama ,  Shunji Amano ,  Motosuke Ohmi ,  Junichi Ohsako ,  Ryota Odake ,  Hiroshi Ozaki

IPC: H05B033/02 ,  H01L021/00

CPC classification number: H05K3/363 ,  H01L27/32 ,  H05K3/305 ,  H05K3/3489 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10128 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/107

Abstract: A display device includes an organic electrroluminescence device provided on a first substrate, conductive metallic films provided on the first substrate at such positions as not to overlap with the organic electroluminescence device, a second substrate having a plurality of holes and conductive connection portions which are provided at peripheral portions forming the holes, and solder portions charged in the holes of the second substrate and, by being melted, electrically connecting the conductive metallic films of the first substrate with the conductive connection portions of the second substrate.

Abstract translation: 显示装置包括设置在第一基板上的有机电致发光器件，设置在不与有机电致发光器件重叠的位置处的第一基板上的导电金属膜，具有多个孔的第二基板和设置有导电连接部的导电连接部 在形成孔的周边部分，以及填充在第二基板的孔中的焊料部分，并且通过熔化将第一基板的导电金属膜与第二基板的导电连接部分电连接。