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公开(公告)号:CN1350770A
公开(公告)日:2002-05-22
申请号:CN00807291.4
申请日:2000-11-15
Applicant: 陶氏化学公司
CPC classification number: H05K3/4655 , C08G61/02 , H05K3/4652 , H05K2201/0158 , H05K2201/0358
Abstract: 本发明涉及一种用增韧的苯并环丁烯为基础的介电聚合物涂覆的金属箔制作印刷线路板的方法。本发明还涉及一种含有苯并环丁烯为基础的单体或低聚物、乙烯属不饱和聚合物添加剂以及任选的光活性化合物的增韧的介电聚合物。
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公开(公告)号:CN1321408A
公开(公告)日:2001-11-07
申请号:CN00801769.7
申请日:2000-04-06
Applicant: 三井金属鉱业株式会社
CPC classification number: H05K3/0038 , H05K3/025 , H05K3/382 , H05K3/384 , H05K3/385 , H05K3/4652 , H05K2201/0112 , H05K2201/0358 , H05K2203/0315
Abstract: 本发明提供了利用激光法形成确保从外层铜箔至铜箔电路层的层间导通用的穿孔、形成辅助孔的通孔或凹陷部分的敷铜层压板。通过在该敷铜层压板的外层铜箔表面形成微细铜氧化物或微细铜粒,使所述敷铜层压板满足激光反射率在86%以下、亮度(L值)在22以下等条件。
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公开(公告)号:CN1255087A
公开(公告)日:2000-05-31
申请号:CN98804932.5
申请日:1998-05-13
Applicant: 联合讯号公司
Inventor: G·C·史密斯
IPC: B32B3/00
CPC classification number: B32B15/08 , B32B7/06 , B32B7/12 , B32B2307/202 , B32B2457/08 , H05K3/025 , H05K2201/0317 , H05K2201/0355 , H05K2201/0358 , H05K2203/0769 , H05K2203/0786 , Y10S428/901 , Y10T428/12556 , Y10T428/12569 , Y10T428/265 , Y10T428/2804 , Y10T428/2839 , Y10T428/31678 , Y10T428/31692
Abstract: 本发明公开一种包金属的叠层的产品(10),其包含:载体膜(11)、水溶性的脱模剂层或分离层(12),其沉积在载体膜(11)上并可以机械方式由载体膜(11)剥离、以及沉积在分离层(12)上的超薄金属层(13)。还公开了用于制造该包金属叠层(10)的方法。
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公开(公告)号:CN1129423A
公开(公告)日:1996-08-21
申请号:CN94193145.5
申请日:1994-08-23
Applicant: 帕利克斯公司
CPC classification number: H05K3/4611 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4691 , H05K2201/0195 , H05K2201/0355 , H05K2201/0358 , Y10S428/901 , Y10T29/49126 , Y10T29/49163 , Y10T428/1438 , Y10T428/24917 , Y10T428/31515 , Y10T428/31522
Abstract: 本发明涉及印刷电路板(10)及其制备方法。印刷电路板(10)包括由导电层(12)构成的第一基板,在该板的第一表面(12a)上涂覆固化粘合剂层(14)。然后在固化粘合剂层(14)上再涂覆半固化粘合剂(16),再在半固化粘合剂层(16)上压放第二基板(18)。
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公开(公告)号:NO852624A
公开(公告)日:1986-01-02
申请号:NO852624
申请日:1985-06-28
Applicant: AKZO NV
Inventor: KUNDINGER ERNST F , KLIMESCH ERICH , ZENGEL HANS G , LASHER JEFFREY D
CPC classification number: B32B27/281 , B05D7/16 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/12 , B32B2250/24 , B32B2307/31 , B32B2307/54 , H05K1/0346 , H05K1/036 , H05K2201/0154 , H05K2201/0358 , H05K2203/066 , Y10T428/265 , Y10T428/2826 , Y10T428/294 , Y10T428/2947 , Y10T428/2967 , Y10T428/31681 , Y10T428/31721
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公开(公告)号:US20240237233A9
公开(公告)日:2024-07-11
申请号:US18271544
申请日:2021-04-26
Applicant: LG INNOTEK CO., LTD.
Inventor: Jong Bae SHIN , Soo Min LEE , Jae Hun JEONG
CPC classification number: H05K3/4688 , H05K1/111 , H05K3/0014 , H05K3/4697 , H05K2201/0358
Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.
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公开(公告)号:US20240023242A1
公开(公告)日:2024-01-18
申请号:US18471816
申请日:2023-09-21
Inventor: Jennifer ADAMCHUK , Gerard T. BUSS , Theresa M. BESOZZI
CPC classification number: H05K1/0373 , H05K1/09 , H05K1/05 , H05K2201/0358
Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
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公开(公告)号:US09888570B2
公开(公告)日:2018-02-06
申请号:US14068655
申请日:2013-10-31
Applicant: International Business Machines Corporation
Inventor: Dylan J. Boday , Joseph Kuczynski
CPC classification number: H05K1/0353 , B32B17/02 , B32B17/064 , C03C25/323 , C08G65/485 , C08L71/00 , C08L71/12 , C08L71/126 , C08L2205/02 , C08L2205/05 , H05K1/0326 , H05K1/0366 , H05K3/025 , H05K2201/0358 , Y10T428/31678 , Y10T442/2992
Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.
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189.
公开(公告)号:US20170349750A1
公开(公告)日:2017-12-07
申请号:US15539467
申请日:2015-06-01
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor: Suwen YE , Guofang TANG
CPC classification number: C08L83/06 , B32B27/04 , B32B38/08 , B32B2307/304 , B32B2307/3065 , C08G77/08 , C08G77/16 , C08G77/18 , C08G77/80 , C08J5/24 , C08K3/013 , C08K3/36 , C08K5/098 , C08L83/04 , C09D183/06 , H05K1/036 , H05K1/0373 , H05K2201/0162 , H05K2201/0358 , H05K2201/068 , C08K5/5415
Abstract: The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.
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190.
公开(公告)号:US20170245358A1
公开(公告)日:2017-08-24
申请号:US15501839
申请日:2015-08-04
Inventor: Elisabeth Kreutzwiesner , Gernot Schulz
IPC: H05K1/02 , H05K1/03 , H05K1/11 , H05K3/22 , C23C16/27 , H01L23/373 , H01L21/48 , C23C14/06 , C23C14/34 , H05K1/09 , H01L23/498
CPC classification number: H05K1/0204 , B32B5/00 , B32B5/02 , B32B5/28 , B32B7/00 , B32B7/02 , B32B7/12 , B32B9/00 , B32B15/00 , B32B15/04 , B32B15/20 , B32B27/06 , B32B27/18 , B32B2264/00 , B32B2264/10 , B32B2264/102 , B32B2307/20 , B32B2307/202 , B32B2307/206 , B32B2307/30 , B32B2307/302 , B32B2457/00 , B32B2457/08 , C23C14/0611 , C23C14/34 , C23C16/276 , H01L21/4846 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H05K1/0203 , H05K1/0206 , H05K1/0313 , H05K1/09 , H05K1/115 , H05K3/022 , H05K3/22 , H05K3/4655 , H05K2201/0179 , H05K2201/0195 , H05K2201/0323 , H05K2201/0358
Abstract: A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.
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