公开(公告)号：US20180270957A1

公开(公告)日：2018-09-20

申请号：US15459787

申请日：2017-03-15

Applicant: Intel Corporation

Inventor： Rajasekaran Swaminathan ,  Ram S. Viswanath

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/183 ,  H05K1/0216 ,  H05K1/113 ,  H05K1/141 ,  H05K3/0014 ,  H05K3/303 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10628 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Embodiments of the present disclosure provide techniques for a printed circuit board (PCB) with a recess to accommodate discrete components of a package attachable to the PCB, in accordance with some embodiments. In one embodiment, a PCB may include a recess disposed in at least a portion of the PCB, to receive at least a portion of a package. The package may be attachable to the PCB via a plurality of connectors. The connectors may be disposed on a side of the package that faces the PCB. The portion of the package may include one or more discrete components disposed on the side of the package that faces the PCB. The recess may have a depth to accommodate those discrete components that have a height that is greater than a height of the connectors. Other embodiments may be described and/or claimed.

公开(公告)号：US20180160545A1

公开(公告)日：2018-06-07

申请号：US15673001

申请日：2017-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Dal KIM ,  Oh Hyuck KWON ,  Han Vit KANG ,  Jun Young KIM ,  Moon Kyeong KIM ,  Sang Seob KIM ,  Jung Sik PARK ,  Hee Seok JUNG ,  Sung CHO ,  Heung Sik SHIN ,  Ji Woong OH

IPC: H05K3/36 ,  H04M1/02 ,  G02F1/1333 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/363 ,  A61B5/1172 ,  G02F1/1333 ,  G02F1/13338 ,  G02F1/13452 ,  G06F1/1637 ,  G06K9/00013 ,  G06K9/0004 ,  H04M1/0277 ,  H04M2250/16 ,  H05K1/028 ,  H05K1/147 ,  H05K1/188 ,  H05K1/189 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/056 ,  H05K2201/099 ,  H05K2201/10128 ,  H05K2201/10628

Abstract: An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.

公开(公告)号：US09883582B2

公开(公告)日：2018-01-30

申请号：US14947437

申请日：2015-11-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/15 ,  H01L23/367 ,  H01L23/50 ,  H01L23/498 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  G01R31/04 ,  H05K3/22

CPC classification number: H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.

公开(公告)号：US20170373567A1

公开(公告)日：2017-12-28

申请号：US15629261

申请日：2017-06-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Shinji NISHIZONO ,  Tadashi SHIMIZU ,  Norikazu MOTOHASHI ,  Tomohiro Nishiyama

IPC: H02K11/33 ,  H02H9/02 ,  H05K1/18 ,  H05K7/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H02K11/33 ,  H02H7/08 ,  H02H9/02 ,  H02K7/145 ,  H02M7/003 ,  H02P6/085 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3447 ,  H05K3/429 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10356 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.

公开(公告)号：US20170243801A1

公开(公告)日：2017-08-24

申请号：US15518942

申请日：2015-09-04

Applicant: CALSONIC KANSEI CORPORATION

Inventor： Hideki SUNAGA ,  Yuuzou SHIMAMURA ,  Norio FUJII ,  Yuuji DAIMON

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/34 ,  H01L23/31 ,  H05K1/02 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L23/3675 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20 ,  H05K2201/10628 ,  H05K2201/2081 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic component mounting structure includes a terminal of an electronic component package and a chip heat radiating member. The terminal is soldered on a land of an electronic substrate and the chip heat radiating member is soldered on a back surface of the package. The chip heat radiating member is covered by a packaging resin. The metallic heat radiating pattern integrally includes a pattern extension part that is protruded from the package, such that at least a part of the metallic heat radiating pattern in formed to be larger than the package. The pattern extension part guides excessive solder to outside of the package.

公开(公告)号：US20170154840A1

公开(公告)日：2017-06-01

申请号：US15361144

申请日：2016-11-25

Applicant: Siyang Grande Electronics Co., Ltd.

Inventor： Yunhui Zhong

IPC: H01L23/495 ,  H01L21/66 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L29/861

CPC classification number: H01L23/49562 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L22/10 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49551 ,  H01L23/49579 ,  H01L29/861 ,  H01L2224/32245 ,  H05K3/3426 ,  H05K2201/10174 ,  H05K2201/10628 ,  H05K2201/10651

Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

公开(公告)号：US09554488B2

公开(公告)日：2017-01-24

申请号：US14256108

申请日：2014-04-18

Applicant: Raytheon Company

Inventor： Cary C. Kyhl ,  Scott M. Heston ,  James M. Elliott

IPC: H05K7/20 ,  H05K3/34 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K7/2039 ,  H01L2224/73253 ,  H01L2924/16195 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/1056 ,  H05K2201/10628 ,  H05K2201/10689 ,  Y02P70/613

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract translation: 公开了一种表面贴装装置。 表面安装装置可以包括可在电子电路中操作的电子部件。 表面安装装置还可以包括热耦合到电子部件的传热部件。 传热部件可以具有配置成与散热器相接合的传热表面。 此外，表面安装器件可以包括弹性柔性引线，以将电子部件电耦合到电路板。 弹性柔性引线可以被配置为弹性偏转，以促进热传递表面与电路板的可变距离，使得热传递表面和另一类似配置的表面安装器件的平面传热表面能够基本上对准用于接口 与散热器。

公开(公告)号：US20160270238A1

公开(公告)日：2016-09-15

申请号：US15028608

申请日：2014-10-07

Applicant: CONTINENTAL TEVES AG & CO. OHG ,  CONTI TEMIC MICROELECTRONIC GMBH

Inventor： Lars Dalke ,  Jürgen Gilb ,  Michael Weckerle

IPC: H05K3/32 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/328 ,  H05K1/11 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10295 ,  H05K2201/10628 ,  H05K2201/10962

Abstract: An electronic control unit, in particular of a motor vehicle brake system, including at least one circuit carrier for electronic components. At least one electronic component has at least one electrical conductor. The electronic control unit is further distinguished in that the electrical conductor of the electronic component is connected to at least one contact element mechanically and in an electrically conductive manner and the contact element is connected to at least one contact point of the circuit carrier mechanically and in an electrically conductive manner, at least the mechanical and electrically conductive connection of the electrical conductor to the contact element being a connection established by ultrasonic welding. A method for arranging at least one electronic component on and electrically connecting the at least one electronic component to a circuit carrier of an electronic control unit is also disclosed.

Abstract translation: 一种电子控制单元，特别是机动车辆制动系统，包括用于电子部件的至少一个电路载体。 至少一个电子部件具有至少一个电导体。 电子控制单元的进一步区别在于，电子部件的电导体以机械方式和导电的方式连接到至少一个接触元件，并且接触元件机械地连接到电路载体的至少一个接触点 导电方式，电导体与接触元件的至少机械和导电连接是通过超声波焊接建立的连接。 还公开了一种用于在电子控制单元的电路载体上布置至少一个电子部件并将该至少一个电子部件电连接到电子控制单元的电路载体的方法。

公开(公告)号：US20160183384A1

公开(公告)日：2016-06-23

申请号：US15055859

申请日：2016-02-29

Applicant: Presidio Components. Inc.

Inventor： Hung Van Trinh

IPC: H05K3/34 ,  C22C13/00 ,  B23K35/26 ,  H01G2/06 ,  B23K1/00

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US09351422B2

公开(公告)日：2016-05-24

申请号：US14374310

申请日：2013-01-22

Applicant: KYOCERA Corporation

Inventor： Nobuyuki Tanaka ,  Shigenori Takaya

IPC: H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H01L23/04 ,  H01L23/047 ,  H05K1/02 ,  H01L23/36 ,  H01L23/40 ,  H01L23/10 ,  H05K3/30

CPC classification number: H05K7/2039 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/4006 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/303 ,  H05K2201/097 ,  H05K2201/10409 ,  H05K2201/10628 ,  H01L2924/00

Abstract: A package 10 includes a housing 1 in which an electronic component 5 is mounted in a recess 1a having an opening on an upper surface and a screwing section 31 that is fixed on a side face of the housing 1 and extends in a lateral direction. The screwing section 31 includes a thin section 34 which is located on a distal end and is provided with a through hole 36 through which a screw is inserted, a thick section 35 which is located between the thin section 34 and the side face of the housing 1 and has a thickness less than that of the side face of the housing 1 and thicker than that of the thin section 34, and a screw fastening hole 37 which extends in the vertical direction in the thick section 35. Even if the housing 1 has warpage when the package 10 is fixed on the external substrate, heat dissipation from the package to the external substrate can be improved.

Abstract translation: 包装10包括壳体1，其中电子部件5安装在具有在上表面上的开口的凹部1a中，以及固定在壳体1的侧面上并沿横向延伸的螺纹部31。 螺纹部31包括位于远端的薄部34，并且设置有插入螺钉的通孔36，位于薄部34与壳体的侧面之间的厚壁部35 1，其厚度小于壳体1的侧面的厚度，并且厚度小于薄壁部34的厚度，以及在厚部35中在垂直方向上延伸的螺钉紧固孔37.即使壳体1具有 当包装10固定在外部基板上时，翘曲可以改善从封装到外部基板的散热。