-
公开(公告)号:KR1020130075698A
公开(公告)日:2013-07-05
申请号:KR1020120153222
申请日:2012-12-26
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/318
CPC classification number: H01L21/31 , C23C8/34 , C23C16/24 , C23C16/56 , C23C28/04 , C23C28/42 , H01L21/02126 , H01L21/022
Abstract: PURPOSE: A method for forming a silicon oxycarbonitride layer is provided to improve workability by improving dry etching resistance and wet etching resistance. CONSTITUTION: A silicon oxycarbonitride layer is formed on a base. A silicon carbonitride layer is laminated on the base (step 1). The silicon oxynitride layer is laminated on the base to form a silicon oxycarbonitride layer (step 2). The formation of the silicon carbonitride layer and the formation of the silicon oxycarbonitride layer are repeated. [Reference numerals] (1) Silicon carbonitride layer is formed; (2) Silicon oxycarbonitride layer is formed; (3) Setting number ?; (AA) Start; (BB) No; (CC) Yes; (DD) End
Abstract translation: 目的:提供一种形成硅碳氮氧化物层的方法,通过提高耐干蚀刻性和耐湿蚀刻性来提高加工性。 构成:在基底上形成硅碳氮氧化物层。 将碳氮化硅层层叠在基材上(步骤1)。 将氧氮化硅层层压在基材上以形成碳氮氧化硅层(步骤2)。 重复碳氮化硅层的形成和碳氧氮化硅层的形成。 (附图标记)(1)形成碳氮化硅层; (2)形成碳氮氧化硅层; (3)设定号? (AA)开始; (BB)否; (CC)是; (DD)结束
-
12.
公开(公告)号:KR1020110009624A
公开(公告)日:2011-01-28
申请号:KR1020100069986
申请日:2010-07-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/31 , H01L21/205
CPC classification number: C23C16/402 , C23C16/45525 , C23C16/45557 , H01L21/02164 , H01L21/0228 , H01L21/3141 , H01L21/31608
Abstract: PURPOSE: An arrangement CVD method, an apparatus thereof, and a computer readable record medium for processing semiconductor are provided to improve the property on layer quality, throughput, and raw material gas consumption. CONSTITUTION: An exhaust system(78) comprises a discharging valve for adjusting the amount of discharge. A controller(84) controls the operation of the apparatus. The controller is configured in advance to implement the arrangement CVD method.
Abstract translation: 目的:提供一种排列CVD方法,其装置和用于处理半导体的计算机可读记录介质,以改善层质量,生产量和原料气体消耗的性质。 构成:排气系统(78)包括用于调节排放量的排放阀。 控制器(84)控制设备的操作。 预先配置控制器以实现排列CVD方法。
-