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公开(公告)号：KR1020140082523A
公开(公告)日：2014-07-02
申请号：KR1020120152614
申请日：2012-12-24
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08K3/34 , C08K5/3472 , H01L23/29
CPC classification number: C08L63/00 , C08K3/34 , C08K3/36 , C08K5/3472 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and an additive; and to a semiconductor device sealed by using the same, wherein the inorganic filler comprises eucryptite; the eucryptite is 20 to 30 parts by weight of 100 parts by weight of the resin composition; and the additive comprises at least one azole compound of chemical formula 1 or 2.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包含环氧树脂，固化剂，固化促进剂，无机填料和添加剂; 以及使用该半导体器件密封的半导体器件，其中所述无机填料包括堇青石; 堇青石为20〜30重量份，100重量份的树脂组合物; 并且添加剂包含至少一种化学式1或2的唑化合物。
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公开(公告)号：KR1020130093742A
公开(公告)日：2013-08-23
申请号：KR1020110142833
申请日：2011-12-26
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08K5/5415 , C08K5/5455 , H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: An epoxy resin composition is provided to improve storage stability at room temperature and low temperature, to have excellent adhesion without generating internal pore in plastic leaded chip carrier, and to improve adhesion with photo image-able solder resist mask (PSR) layer of PCB. CONSTITUTION: An epoxy resin composition for sealing semiconductor device compirses: epoxy resin, curing agent, inorganic filling, siloxane compound, and tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane. The siloxane compound comprises: octamethylcyclotetrasiloxane; and amine-modified siloxane indicated as the chemical formula 1. In the formula 1, R1 and R2 are C1-4 alkyl group or C6-12 aryl group independently, and n is a fixed number of 1-4.
Abstract translation: 目的：提供环氧树脂组合物，以提高室温和低温下的储存稳定性，具有优异的粘附性，而不会在塑料引线芯片载体中产生内孔，并提高与可光成像的阻焊掩模（PSR）层的粘附性 PCB。 构成：用于密封半导体器件的环氧树脂组合物：环氧树脂，固化剂，无机填充物，硅氧烷化合物和四[亚甲基-3-（3,5-二叔丁基-4-羟基苯基）丙酸酯]甲烷。 硅氧烷化合物包括：八甲基环四硅氧烷; 在化学式1中表示的胺改性的硅氧烷。在式1中，R 1和R 2分别是C 1-4烷基或C 6-12芳基，n是1-4的固定数。
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公开(公告)号：KR1020110079037A
公开(公告)日：2011-07-07
申请号：KR1020090135989
申请日：2009-12-31
Applicant: 제일모직주식회사
CPC classification number: C08K5/375 , C08K3/36 , C08K5/01 , C08K5/17 , C08K5/3445 , C08L63/00 , C08L2312/04 , H01L23/293
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device package using the same are provided to improve the contamination of a semiconductor device and a mold and to improve the reliability of the semiconductor device package. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resins, hardeners, curing accelerators, inorganic filler, and additives prepared by melt-blending a compound represented by chemical formula 1 and a compound represented by chemical formula 2 in a ratio of 4:1~6:1. In chemical formula 1, n is an integer of 30 ~ 450. In chemical formula 2, R is a t-butyl group.
Abstract translation: 目的：提供一种用于封装半导体器件的环氧树脂组合物和使用其的半导体器件封装，以改善半导体器件和模具的污染并提高半导体器件封装的可靠性。 构成：用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料和通过以化学式1表示的化合物和化学式2表示的化合物以4的比例熔融共混而制备的添加剂 ：1〜6：1。 在化学式1中，n为30〜450的整数。在化学式2中，R为叔丁基。
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公开(公告)号：KR1020110078407A
公开(公告)日：2011-07-07
申请号：KR1020090135211
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to maintain fluidity, moldability and fire retardancy, to ensure excellent adhesive force to various lead frames and cracking resistance. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator, inorganic filler, coupling agent, and 4-tert-butylphenol of chemical formula 1. The 4-tert-butylphenol is used in the amount of 0.01-2 weight% based on the total weight of the epoxy resin composition. The epoxy resin comprises one or more of a phenolaralkyl type epoxy resin represented by chemical formula 2 and a biphenyl type epoxy resin represented by chemical formula 3.
Abstract translation: 目的：提供用于封装半导体器件的环氧树脂组合物以保持流动性，成型性和阻燃性，以确保对各种引线框具有优异的粘合力和抗开裂性。 构成：用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料，偶联剂和化学式1的4-叔丁基苯酚。4-叔丁基苯酚的用量为 0.01-2重量％，基于环氧树脂组合物的总重量。 环氧树脂包含一种或多种由化学式2表示的酚烷基型环氧树脂和由化学式3表示的联苯型环氧树脂。
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公开(公告)号：KR1020090068440A
公开(公告)日：2009-06-29
申请号：KR1020070136050
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same are provided to improve adhesive property of various elements, such as semiconductor chip and lead frame, and crack resistance. An epoxy resin composition for encapsulating semiconductor device comprises: an epoxy resin, hardener, hardening promoter, 0.01-2 wieght% of thioester based compound of the chemical formula 1 as an adhesive improver, and inorganic filler. The epoxy resin comprises phenol aralkyl epoxy resin of the chemical formula 2 or biphenyl epoxy resin of the chemical formula 3. In the chemical formuls 2, the mean of n is 1-7. In the chemical formula 3, the mean of n is 0-7.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物和使用其的半导体器件，以改善诸如半导体芯片和引线框架的各种元件的粘合性能和抗裂纹性。 用于封装半导体器件的环氧树脂组合物包括：环氧树脂，硬化剂，硬化促进剂，0.01-2重量％的作为粘合剂改进剂的化学式1的硫酯类化合物和无机填料。 环氧树脂包括化学式2的苯酚芳烷基环氧树脂或化学式3的联苯环氧树脂。在化学式2中，n的平均值为1-7。 在化学式3中，n的平均值为0-7。
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Patent Agency Ranking
公开(公告)号：KR100655129B1
公开(公告)日：2006-12-08
申请号：KR1020050135913
申请日：2005-12-30
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for packaging a semiconductor device which is improved in soldering resistance and the adhesive strength with a copper lead frame and a pre-plated copper lead frame. The epoxy resin composition comprises 0.01-1 wt% of a silane coupling agent having a thiocyanato group represented by NCS(CH2)6Si-(R1)3, wherein R1 is a C1-C3 alkoxy group. Optionally the composition comprises further at least one coupling agent selected from the group consisting of an epoxy silane coupling agent, a mercaptosilane coupling agent, an amine-based silane coupling agent and a methyltrimethoxysilane coupling agent, and the total content of the coupling agent is 0.01-1 wt%. Preferably the composition comprises further 82-92 wt% of an inorganic filler.
Abstract translation: 本发明提供一种用于封装半导体装置的环氧树脂组合物，其具有改进的耐焊性和与铜引线框架和预镀铜引线框架的粘合强度。 所述环氧树脂组合物包含0.01-1重量％的由NCS（CH2）6Si-（R1）3表示的具有硫氰酸根基团的硅烷偶联剂，其中R1为C1-C3烷氧基。 任选地，组合物还包含至少一种选自环氧硅烷偶联剂，巯基硅烷偶联剂，胺基硅烷偶联剂和甲基三甲氧基硅烷偶联剂的偶联剂，并且偶联剂的总含量为0.01 -1重量％。 优选地，该组合物还包含82-92重量％的无机填料。
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公开(公告)号：KR1020040061558A
公开(公告)日：2004-07-07
申请号：KR1020020087829
申请日：2002-12-31
Applicant: 제일모직주식회사
Inventor： 김조균
IPC: C08G59/06
Abstract: PURPOSE: An epoxy resin composition for a semiconductor packaging material is provided to improve the adhesive strength to a lead frame and to reduce hygroscopicity, thereby suppressing effectively the generation of crack in solder reflow process at 260 deg.C. CONSTITUTION: The epoxy resin composition comprises 3.5-10.0 wt% of an epoxy resin represented by the formula 1 as a base resin; 2.0-10.0 wt% of a curing agent; 0.1-0.35 wt% of a curing accelerator; 80-89 wt% of an inorganic filler; and 10-25 parts by weight of a benzothiophene indene oligomer represented by the formula 2 as an adhesive strength improver based on 100 parts by weight of the epoxy resin of the formula 1, wherein m and n are independently an integer of 1-3. Preferably the epoxy resin has an epoxy equivalence of 205-215.
Abstract translation: 目的：提供一种用于半导体封装材料的环氧树脂组合物，以提高对引线框架的粘合强度并降低吸湿性，从而有效地抑制260℃回流焊过程中的裂纹产生。 构成：环氧树脂组合物含有3.5-10.0重量％的由式1表示的环氧树脂作为基础树脂; 2.0-10.0重量％的固化剂; 0.1-0.35重量％的固化促进剂; 80-89重量％的无机填料; 和10-25重量份由式2表示的苯并噻吩茚低聚物作为粘合强度改进剂，基于100重量份式1的环氧树脂，其中m和n独立地为1-3的整数。 优选环氧树脂的环氧当量为205-215。
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公开(公告)号：KR1020020037115A
公开(公告)日：2002-05-18
申请号：KR1020000067109
申请日：2000-11-13
Applicant: 제일모직주식회사
IPC: H01L23/29
Abstract: PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided to improve reliability of a semiconductor device by improving a composition of an epoxy resin. CONSTITUTION: An epoxy resin composition is formed with a mixture of an ortho-cresol-novolac-based epoxy resin formed by the first chemical reaction formula and a hetero-bi-functional epoxy resin of 3.0 to 12 weight percents formed by the second chemical reaction formula, a hardener of 2.0 to 6.5 weight percents formed by the third chemical reaction formula, an accelerator of 0.1 to 0.3 weight percent, an amine denatured silicon oil of 0.1 to 10 weight percent, an inorganic absorbing agent of 82 to 90 weight percents. A mixed weight ratio of the mixture of the ortho-cresol-novolac-based epoxy resin and the hetero-bi-functional epoxy resin is 2 to 8 or 6 to 4.
Abstract translation: 目的：提供用于密封半导体器件的环氧树脂组合物，以通过改善环氧树脂的组成来改善半导体器件的可靠性。 构成：通过第一化学反应式形成的邻甲酚 - 酚醛清漆型环氧树脂和通过第二化学反应形成的3.0-12重量％的异双官能环氧树脂的混合物形成环氧树脂组合物 配方，由第三化学反应式形成的2.0〜6.5重量％的硬化剂，0.1〜0.3重量％的促进剂，0.1〜10重量％的胺改性硅油，82〜90重量％的无机吸收剂。 邻甲酚 - 酚醛清漆型环氧树脂和异双官能环氧树脂的混合物的混合重量比为2〜8或6〜4。
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公开(公告)号：KR100201708B1
公开(公告)日：1999-06-15
申请号：KR1019970024870
申请日：1997-06-16
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: 본 발명은 반도체용 리드프레임, 특히 구리 리드프레임과의 접착강도가 우수하고 수분 흡습률이 낮아 반도체 패케이지의 크랙 발생을 억제할 수 있는 우수한 에폭시 수지 조성물에 관한 것이로써, 에폭시 수지, 경화제, 경화촉진제, 무기 충전제 및 2-멜캅토벤지미다졸(2-mercaptobenzimidazole)을 필수 성분으로 하며, MBI의 함량이 에폭시 100중량부에 대해 0.5~3.0중량부를 포함하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다. 본 발명을 이용하여 48리드의 QFP 반도체 패케이지를 성형한 후 접착강도, 흡습률 및 크랙 발생률을 측정한 결과, MBI를 적용하게 되면 크랙 발생률이 감소하였으며, 구리 리드 프레임의 경우에 그 효과가 더욱 크다는 것을 밝힐 수 있었다.
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