公开(公告)号：KR101054493B1

公开(公告)日：2011-08-05

申请号：KR1020110006654

申请日：2011-01-24

Applicant: 주식회사 폴리사이언텍 ,  제일모직주식회사

Inventor： 전승호 ,  박종 ,  이종성 ,  송기태 ,  황민규 ,  김지호

IPC: C09J7/02 ,  C08J5/18 ,  B32B27/32 ,  H01L21/58

CPC classification number: C09J7/241 ,  B32B27/327 ,  C08J5/18 ,  C09J7/243 ,  C09J7/38 ,  C09J2201/60 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2423/00 ,  H01L21/6836 ,  H01L2221/68327

Abstract: PURPOSE: A dicing die bonding film for a semiconductor wafer is provided to suppress the generation of fibrous burrs in the dicing process of a semiconductor wafer and to ensure excellent pick-up property of a chip, expandability and uniformity in an expanding process. CONSTITUTION: A dicing die bonding film for a semiconductor wafer comprises a base film and a monolayered or multilayered adhesive layer formed on one side thereof. The base film comprises an ethylene-α-olefin block copolymer in which a melting point is 80°C or greater and ethylene content is 60 mole% or greater. The ethylene-α-olefin block copolymer is included in the amount of 50-100 weight%. The base film further includes a hydrophilic functional group-containing polyethylene copolymer.

Abstract translation: 目的：提供一种用于半导体晶片的切割芯片接合膜，以抑制半导体晶片的切割工艺中的纤维毛刺的产生，并且确保芯片的优良的拾取性能，扩展性以及扩展过程中的均匀性。 构成：用于半导体晶片的切割芯片接合膜包括基膜和在其一侧上形成的单层或多层粘合剂层。 基膜包含熔点为80℃以上，乙烯含量为60摩尔％以上的乙烯-α-烯烃嵌段共聚物。 乙烯-α-烯烃嵌段共聚物的含量为50-100重量％。 基膜还包含含亲水性官能团的聚乙烯共聚物。

公开(公告)号：KR101019756B1

公开(公告)日：2011-03-09

申请号：KR1020090131248

申请日：2009-12-24

Applicant: 제일모직주식회사

Inventor： 박백성 ,  황민규 ,  김지호

IPC: C09J7/02 ,  H01L21/58 ,  C09J5/00

CPC classification number: H01L24/29 ,  H01L21/6836 ,  H01L24/27 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/1092 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/2809 ,  H01L2924/00 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/10

Abstract: PURPOSE: A non-UV type die attach film is provided to lower an adhesion between a dicing film layer and an adhesive layer to strippability required for chip picup while maintaining the adhesion of the edge portion of the dicing film layer. CONSTITUTION: A method for manufacturing a die attach film comprises the steps of: introducing an adhesive layer(120) and a dicing film layer(110) of a photo-curable adhesive including an adhesive layer portion(113) and a ring frame portion(114); and irradiating ultraviolet ray to a back side of the dicing film layer and inducing the inflow of oxygen as a radical scavenger to an upper side of the exposed ring frame portion to suppress the photo-curing of the ring frame portion, and inducing the photo-curing of the adhesive layer portion in which the inflow of the oxygen is blocked by the adhesive layer.

Abstract translation: 目的：提供非UV型贴片膜，以降低切割膜层和粘合剂层之间的粘附性，同时保持切割膜层的边缘部分的粘附性，从而切片切片所需的剥离性。 构成：用于制造管芯附着膜的方法包括以下步骤：引入包含粘合剂层部分（113）和环形框架部分（113）的光固化粘合剂的粘合剂层（120）和切割膜层（110） 114）; 并且将紫外线照射到切割膜层的背面并引起作为自由基清除剂的氧气流入暴露的环形框架部分的上侧，以抑制环形框架部分的光固化， 粘合层部分的固化，其中氧气的流入被粘合剂层阻挡。

公开(公告)号：KR1020100073033A

公开(公告)日：2010-07-01

申请号：KR1020080131611

申请日：2008-12-22

Applicant: 제일모직주식회사

Inventor： 황민규 ,  하경진 ,  김지호 ,  송기태

IPC: C09J183/00 ,  C09J133/08

CPC classification number: C09J11/08 ,  C08L33/08 ,  C08L83/04 ,  C09J9/00 ,  C09J133/00 ,  C09J2203/326

Abstract: PURPOSE: A photo-curable adhesive composition and an adhesive tape using thereof are provided to improve the material adhesion force before photo-curing, and to secure the low surface energy after photo-curing. CONSTITUTION: A photo-curable adhesive composition contains an acrylic adhesive binder, a photo-initiator, and a thermosetting material. The acrylic adhesive binder is produced by applying a vinyl group to an acrylic monomer obtained by polymerizing liquid silicon modified acrylrate resin and the acrylic monomer. The acrylic adhesive binder contains 3~5 parts of liquid silicon modified acrylrate resin by weight for 100 parts of acrylic monomer by weight. The liquid silicon modified acrylrate resin is mono-methacrylic functional polysiloxan with the water molecular weight of 12,000 grams per mol.

Abstract translation: 目的：提供光固化性粘合剂组合物及其使用的粘合带，以提高光固化前的材料粘合力，并确保光固化后的低表面能。 构成：光固化性粘合剂组合物含有丙烯酸粘合剂粘合剂，光引发剂和热固性材料。 丙烯酸类粘合剂粘合剂通过将乙烯基涂布在通过聚合液体硅改性丙烯酸酯树脂和丙烯酸类单体获得的丙烯酸类单体中而制备。 丙烯酸类粘合剂粘合剂含有3〜5份重量的液态硅改性丙烯酸树脂，用于100份重量的丙烯酸类单体。 液体硅改性丙烯酸树脂是水分子量为12,000克/摩尔的单甲基丙烯酸官能聚硅氧烷。

公开(公告)号：KR1020140139212A

公开(公告)日：2014-12-05

申请号：KR1020130059564

申请日：2013-05-27

Applicant: 제일모직주식회사

Inventor： 유용식 ,  김상진 ,  김지호 ,  김철수 ,  조경래 ,  최재원

IPC: H01L21/301

CPC classification number: H01L21/6836 ,  C09J7/20

Abstract: 본 발명은,
접착제층; 및 상기 접착제층에 접한 점착제층을 포함하며,
상기 점착제층의 ASTM D2979-71에 따라 측정된 자외선 조사 전(A
0 )과 자외선 조사 후(A
1 )의 점착력의 비(A
0 /A
1 )가 11 이상이고,
상기 점착제층의 자외선 조사 후 25 ℃에서의 저장탄성율이 0.5 x 10
6 Pa 내지 5 x 10
8 Pa 범위인, 다이싱 다이본딩 필름에 관한 것이다.

Abstract translation: 本发明包括粘合层; 以及接触粘合剂层的粘合剂层。 根据粘合剂层的ASTM D2979-71，在紫外线辐射（A0）至紫外线辐射后（A1）之前的粘附比（A0 / A1）为11以上。 在粘合剂层的紫外线辐射之后的25℃下的储能模量在0.5×10 -6 Pa至5×10 8 Pa的范围内。

公开(公告)号：KR1020140058075A

公开(公告)日：2014-05-14

申请号：KR1020120124643

申请日：2012-11-06

Applicant: 제일모직주식회사

Inventor： 유용식 ,  김지호 ,  양승용 ,  조경래 ,  최재원

IPC: C09J7/02 ,  H01L21/60 ,  C09J133/04

CPC classification number: C09J7/22 ,  C09J7/30 ,  C09J133/04 ,  C09J2201/12 ,  C09J2203/326 ,  H01L2021/6006

Abstract: The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer to prevent damage to a wafer and a wafer bump formation surface and contamination during the grinding process of a bump non-formation surface of the surface of a semiconductor wafer. More specifically, the present invention relates an adhesive film for protecting the surface of a semiconductor wafer including a base film and an intermediate layer laminated on the base film. The intermediate layer includes an acrylic resin containing an alkyl (meth) acrylate monomer with two or more carbon atoms of an alkyl group. The elongation rate of the base film with laminated intermediate layer is 400 to 900%.

Abstract translation: 本发明涉及一种用于保护半导体晶片表面的粘合膜，以防止在半导体晶片的表面的凸块非形成表面的研磨过程期间对晶片和晶片凸块形成表面的损坏和污染。 更具体地说，本发明涉及一种用于保护半导体晶片的表面的粘合膜，该半导体晶片包括基膜和层压在基膜上的中间层。 中间层包括含有具有两个或更多个烷基碳原子的（甲基）丙烯酸烷基酯单体的丙烯酸树脂。 具有层压中间层的基膜的伸长率为400〜900％。

公开(公告)号：KR1020140050793A

公开(公告)日：2014-04-30

申请号：KR1020120117033

申请日：2012-10-22

Applicant: 제일모직주식회사

Inventor： 김지호 ,  양승용 ,  유용식 ,  조경래 ,  최재원

IPC: C09J7/02 ,  C09J133/04 ,  C09J11/00 ,  H01L21/60

CPC classification number: C09J7/385 ,  C09J7/22 ,  C09J7/30 ,  C09J11/00 ,  C09J133/04 ,  C09J2201/60 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2021/60067

Abstract: The present invention relates to an adhesive film including an adhesive layer and a substrate film, and specifically, to an adhesive film for a semiconductor, wherein a ratio (B/A) of an elongation rate of an adhesive film (B) on an elongation rate of a substrate film (A) is 0.7 or less. The thickness of the adhesive layer is 20-40% of the thickness of the substrate film. The adhesive layer contains an isocyanate based hardener. The isocyanate based hardener is an isocyanate trimer.

Abstract translation: 本发明涉及一种粘合剂膜和基材膜，具体地说涉及一种用于半导体的粘合剂膜，其中粘合膜（B）的伸长率与伸长率之比（B / A） 基片（A）的比例为0.7以下。 粘合剂层的厚度为基底膜厚度的20-40％。 粘合剂层含有异氰酸酯类固化剂。 异氰酸酯类固化剂是异氰酸酯三聚体。

公开(公告)号：KR1020120068453A

公开(公告)日：2012-06-27

申请号：KR1020100130084

申请日：2010-12-17

Applicant: 제일모직주식회사

Inventor： 어동선 ,  김지호 ,  황민규 ,  조경래 ,  송기태

IPC: C09J7/02 ,  C09J9/00 ,  C09J133/04 ,  H01L21/58

CPC classification number: C09J7/0217 ,  C08K5/0025 ,  C08K5/54 ,  C08L2312/08 ,  C09J7/20 ,  C09J133/04 ,  C09J133/14 ,  C09J143/04 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/0665 ,  Y10T428/264 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/0635 ,  C09J7/38 ,  C09J7/35 ,  C09J7/385 ,  C09J9/00 ,  C09J2201/622

Abstract: PURPOSE: A pressure-sensitive dicing die bonding film is provide to comprise adhesive layers having different adhesion each other to an adhesive layer and a ring frame, thereby having frame stability, and high pick-up success rate. CONSTITUTION: A pressure-sensitive dicing die bonding film comprises a base film(4), a tackifying layer(5) formed on the base film, and an adhesive layer formed on the top of the adhesive layer. The adhesive force between the tackifying layer and the ring frame(B) is B/A>=1.1. The slid distance of the tackifying layer is 0-0.1 mm, when applying force to the tackifying layer by 10 gf per unit area 1mm^2. The tackifying layer is a monolayer, the thickness of the tackifying layer is 3-40 micron, and the tackifying layer comprises silane coupling agent.

Abstract translation: 目的：提供一种压敏切片模接合薄膜，其包括对粘合剂层和环形框架具有不同粘附性的粘合剂层，从而具有框架稳定性和高的拾取成功率。 构成：压敏切割芯片接合膜包括基膜（4），形成在基膜上的增粘层（5）和形成在粘合剂层顶部上的粘合剂层。 增粘层与环框架（B）之间的粘合力为B / A> = 1.1。 增粘层的滑动距离为0-0.1mm，当对单位面积1mm ^ 2施加力至增粘层10gf时。 增粘层为单层，增粘层的厚度为3-40微米，增粘层为硅烷偶联剂。

公开(公告)号：KR1020100073847A

公开(公告)日：2010-07-01

申请号：KR1020080132628

申请日：2008-12-23

Applicant: 제일모직주식회사

Inventor： 김지호 ,  하경진 ,  황민규

IPC: C09J133/08 ,  C09J7/00

CPC classification number: C09J11/08 ,  C08L83/04 ,  C09J133/08 ,  C09J2203/30 ,  C09J2423/006

Abstract: PURPOSE: An acrylate-adhesive composition is provided to obtain improved pick-up performance by revealing heterogeneity of a dimethysiloxane resin after a photocuring process and to be applied to a dicing or an adhesive tape of bonding the dicing. CONSTITUTION: An acrylate-adhesive composition includes 0.01-0.045 parts by weight of a dimethylsiloxane resin based on 100.0 parts by weight of an acrylic binder resin including ethylhexylacrylat. The dimethysiloxane resin is introduced to the backbone of the acrylic binder resin. The binder resin includes 2-ethylhexylacrylat 50-80 parts by weight, isooctylacrylate 20 parts by weight, 2-hydroxymethylmethacrylate 20 parts by weight, 2-hydroxy ethyl acrylate 20 parts by weight, and glycidyl methacrylate monomer 10 parts by weight.

Abstract translation: 目的：提供丙烯酸酯 - 粘合剂组合物，以通过在光固化过程之后揭示二甲硅氧烷树脂的异质性，并将其应用于将切割粘合的切割或粘合带来获得改进的拾取性能。 构成：丙烯酸酯 - 粘合剂组合物包含基于100.0重量份包含乙基己基丙烯酸酯的丙烯酸粘合剂树脂的0.01-0.045重量份的二甲基硅氧烷树脂。 将二甲硅氧烷树脂引入到丙烯酸粘合剂树脂的主链上。 粘合剂树脂包括50-80重量份的2-乙基己基丙烯酸酯，丙烯酸异辛酯20重量份，2-羟甲基甲基丙烯酸酯20重量份，丙烯酸2-羟基乙酯20重量份和甲基丙烯酸缩水甘油酯单体10重量份。

公开(公告)号：KR1020140118378A

公开(公告)日：2014-10-08

申请号：KR1020130034162

申请日：2013-03-29

Applicant: 제일모직주식회사

Inventor： 김지호 ,  양승용 ,  유용식 ,  조경래 ,  최재원

IPC: H01L21/304 ,  H01L21/301

Abstract: A back grinding protection film for protecting a semiconductor wafer is disclosed. The back grinding protection film for protecting a semiconductor wafer, as a back grinding protection film for protecting a semiconductor wafer where a buffer layer and an adhesive layer are stacked on a base material film, features that elastic modulus of indentation of the buffer layer at 25°C can be increased four to eighty times by ultraviolet irradiation.

Abstract translation: 公开了一种用于保护半导体晶片的背面磨削保护膜。 用于保护半导体晶片的背面磨削保护膜作为用于保护半导体晶片的背面研磨保护膜，其中缓冲层和粘合剂层堆叠在基材膜上，其特征在于缓冲层的压缩弹性模量为25 通过紫外线照射可以提高四至八十次。

公开(公告)号：KR1020140069508A

公开(公告)日：2014-06-10

申请号：KR1020120136835

申请日：2012-11-29

Applicant: 제일모직주식회사

Inventor： 양승용 ,  김지호 ,  유용식 ,  조경래 ,  최재원

IPC: C09J7/02 ,  C09J133/04 ,  H01L21/02

CPC classification number: C09J7/29 ,  C09J7/22 ,  C09J7/385 ,  C09J133/04 ,  C09J2201/60 ,  C09J2203/326 ,  H01L21/0201 ,  H01L21/6836

Abstract: The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer including an adhesive layer containing a silane coupling agent, and more specifically, to an adhesive film for protecting the surface of a semiconductor wafer, wherein the increase rate of a void area is 10% or less 12 hours after the film is attached to the bump forming face of the semiconductor wafer.

Abstract translation: 本发明涉及一种用于保护半导体晶片的表面的粘合膜，其包括含有硅烷偶联剂的粘合剂层，更具体地说，涉及一种用于保护半导体晶片表面的粘合膜，其中空隙的增加率 在膜附着到半导体晶片的凸块形成面12小时后，面积为10％以下。