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公开(公告)号：KR1020150037164A
公开(公告)日：2015-04-08
申请号：KR1020130116505
申请日：2013-09-30
Applicant: 제일모직주식회사
IPC: C09J11/08 , C09J163/00 , C09J201/00 , C09J7/02 , H01L21/60
CPC classification number: C09J11/08 , C09J7/22 , C09J7/35 , C09J163/00 , C09J201/00 , C09J2201/61 , C09J2203/326 , C09J2205/102 , H01L21/67132 , H01L21/6836 , H01L2221/68327
Abstract: 본발명은전이금속이온이동을억제하는포화탄화수소화합물을포함하는반도체용접착조성물, 접착필름및 상기필름에의해접속된반도체장치에관한것이다.
Abstract translation: 本发明涉及一种半导体器件用粘合剂组合物，其包括抑制过渡金属离子的移动的粘合剂和粘合膜连接的半导体器件的饱和烃化合物。 粘合剂组合物包含基于总重量的0.01至10重量％的饱和烃化合物。
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公开(公告)号：KR1020140139212A
公开(公告)日：2014-12-05
申请号：KR1020130059564
申请日：2013-05-27
Applicant: 제일모직주식회사
IPC: H01L21/301
CPC classification number: H01L21/6836 , C09J7/20
Abstract: 본 발명은,
접착제층; 및 상기 접착제층에 접한 점착제층을 포함하며,
상기 점착제층의 ASTM D2979-71에 따라 측정된 자외선 조사 전(A
0 )과 자외선 조사 후(A
1 )의 점착력의 비(A
0 /A
1 )가 11 이상이고,
상기 점착제층의 자외선 조사 후 25 ℃에서의 저장탄성율이 0.5 x 10
6 Pa 내지 5 x 10
8 Pa 범위인, 다이싱 다이본딩 필름에 관한 것이다.Abstract translation: 本发明包括粘合层; 以及接触粘合剂层的粘合剂层。 根据粘合剂层的ASTM D2979-71，在紫外线辐射（A0）至紫外线辐射后（A1）之前的粘附比（A0 / A1）为11以上。 在粘合剂层的紫外线辐射之后的25℃下的储能模量在0.5×10 -6 Pa至5×10 8 Pa的范围内。
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公开(公告)号：KR101340544B1
公开(公告)日：2013-12-11
申请号：KR1020100131856
申请日：2010-12-21
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J7/02 , C09J9/00
Abstract: 본 발명은 아크릴계 수지, 에폭시계 수지, 방향족 아민계 경화제, 실란 커플링제 및 충진제를 특정 함량으로 포함시켜, 경화 속도를 늦춤으로써 경화 후에도 낮은 용융 점도와 높은 잔존 경화율을 유지하여 EMC 몰딩 과정에서도 보이드를 제거함으로써 높은 신뢰성을 확보하도록 하는 반도체 접착 필름용 조성물에 관한 것이다.
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公开(公告)号：KR1020130063155A
公开(公告)日：2013-06-14
申请号：KR1020110129522
申请日：2011-12-06
Applicant: 제일모직주식회사
IPC: C09J201/00 , C09J11/00 , C09J7/02 , H01L21/02
CPC classification number: C08L63/00 , C08G59/5033 , C08G59/56 , C08G59/621 , C09J163/00 , H01L21/56 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/2929 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/92247 , H01L2225/06506 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , C09J201/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/00 , C09J2203/326 , H01L21/02002
Abstract: PURPOSE: An adhesive composition is provided to reduce process time by not generating reliability loss due to a quick curing rate even when reducing or excluding a semi-curing process after adhesion. CONSTITUTION: An adhesive composition comprises 60-80 wt% of a thermoplastic resin, based on total solid weight of the adhesive composition, and comprises a phenol hardener and an amine hardener. The storage elasticity after 20 minutes at 150 °C is 2 MPa or more. The reaction curing rate of the adhesive composition is 50% or more. The void after 120 seconds molding at 175 °C is 10% or less. The weight ratio of the phenol hardener and amine curing agent is 3:1-1:11. The adhesive composition additionally includes the adhesive composition.
Abstract translation: 目的：提供粘合剂组合物，以便即使在粘合后减少或排除半固化过程，也不会由于快速固化速率而产生可靠性损失，从而缩短加工时间。 构成：基于粘合剂组合物的总固体重量，粘合剂组合物包含60-80重量％的热塑性树脂，并且包含酚硬化剂和胺硬化剂。 150℃下20分钟后的储存弹性为2MPa以上。 粘合剂组合物的反应固化速度为50％以上。 在175℃下成型120秒后的空隙为10％以下。 酚类固化剂和胺类固化剂的重量比为3：1-1：11。 粘合剂组合物另外包括粘合剂组合物。
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公开(公告)号：KR1020140086221A
公开(公告)日：2014-07-08
申请号：KR1020120156445
申请日：2012-12-28
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J163/00 , H01L21/60
CPC classification number: H01L2224/83191 , C09J7/35 , C09J7/22 , C09J7/29 , C09J163/00 , C09J2201/16 , C09J2203/326 , H01L21/6836 , H01L24/26 , H01L2021/60015
Abstract: The present invention relates to an adhesive film for a laser dicing having an elongation percentage below 10% before the hardening of the adhesive film at 0°C. The elongation percentage of the adhesive film at 0°C decreases by 65% at 25°C, and the fracture temperature of the adhesive film ranges from -20 to 0°C. The elongation percentage of the adhesive film is 15-50% when hardened at 100°C for 60 minutes. Moreover, the adhesive film includes a first epoxy resin and a second epoxy resin.
Abstract translation: 本发明涉及一种激光切割用粘合膜，其在0℃下硬化粘合膜之前的伸长率低于10％。 粘合剂膜在0℃下的伸长率在25℃下降低65％，粘合膜的断裂温度在-20℃至0℃。 当在100℃下硬化60分钟时，粘合膜的伸长率为15-50％。 此外，粘合膜包括第一环氧树脂和第二环氧树脂。
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Patent Agency Ranking
公开(公告)号：KR1020150037197A
公开(公告)日：2015-04-08
申请号：KR1020130116575
申请日：2013-09-30
Applicant: 제일모직주식회사
IPC: C09J11/06 , C09J163/00 , C09J7/02 , H01L21/60
CPC classification number: C09J11/06 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/61 , C09J2203/326 , H01L21/6836 , H01L2021/60015 , H01L2021/60022 , H01L2021/60277 , H01L2221/68327
Abstract: 본발명은전이금속이온이동억제제로하기화학식 1의화합물을포함하는반도체용접착조성물, 상기조성물로부터형성된반도체용접착필름, 및상기필름에의해접속된반도체장치에관한것이다. [화학식 1] R-X 상기식에서, R은치환되거나치환되지않은알킬기또는시클로알킬기이고, X는수산기, 티올기, 아민기, 카르복실산기, 아마이드기, 술폰산기및 인산기로이루어진군으로부터선택된다.
Abstract translation: 本发明涉及一种用于半导体器件的粘合剂组合物，其包含由化学式1表示的化合物作为过渡金属离子迁移抑制剂，由其制备的半导体粘合剂膜以及与该膜接触的半导体器件。 [化学式1] R-X。 式中，R表示被取代或未取代的烷基或环烷基，X选自羟基，硫醇基，胺基，羧酸基，酰胺基，磺酸基和磷酸酯基 。
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公开(公告)号：KR1020120070338A
公开(公告)日：2012-06-29
申请号：KR1020100131856
申请日：2010-12-21
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J7/02 , C09J9/00
CPC classification number: C09J133/04 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: A composition for semiconductor adhesive film is provided to maintain low melting point and the high residual cure index after a pre-cure process, thereby effectively removing void in epoxy molding compound molding. CONSTITUTION: A composition for semiconductor adhesive film comprises 50-85 weight% of acrylic resin, 5-40 weight% of epoxy-based resin, 2-15 weight% of aromatic amine based hardener, 5-40 weight% of filler, and 0.05-5 weight% of silane coupling agent. The composition for semiconductor adhesive film has a melting point which is measured at 175 deg. Celsius after 2 cycles of curing cycle which consists of 60 minutes at 125 deg. Celsius and 10 minutes at 150 deg. Is 2.0 x 10^6 poise or less. The acrylic resin has a glass transition temperature of (-15)-50 deg. Celsius.
Abstract translation: 目的：提供一种用于半导体粘合剂膜的组合物，用于在预固化过程之后保持低熔点和高残留固化指数，从而有效地除去环氧模塑料成型中的空隙。 构成：半导体粘合膜用组合物含有50〜85重量％的丙烯酸树脂，5-40重量％的环氧类树脂，2-15重量％芳族胺类固化剂，5-40重量％填料和0.05重量％ -5重量％的硅烷偶联剂。 用于半导体粘合剂膜的组合物具有在175℃下测量的熔点。 2周期的固化循环后的摄氏度，其在125度下由60分钟组成。 摄氏150度，10分钟。 是2.0 x 10 ^ 6泊或更少。 丙烯酸树脂的玻璃化转变温度为（-15）-50℃。 摄氏度。
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公开(公告)号：KR101739824B1
公开(公告)日：2017-05-25
申请号：KR1020140081295
申请日：2014-06-30
Applicant: 제일모직주식회사
CPC classification number: C08G77/12 , C08G77/20 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: 규소결합된알케닐기(Si-Vi)를가지는적어도 1 종의제1 실록산화합물, 및규소결합된수소(Si-H)를가지는적어도 1 종의제2 실록산화합물을포함하고, 상기제1 실록산화합물은하기화학식 1로표시되는실록산화합물을포함하는경화형폴리실록산조성물, 상기조성물을경화하여얻은봉지재, 및상기봉지재를포함하는광학기기를제공한다: [화학식 1] (RRRSiO)(RRSiO)(RSiO)(SiO-Y-SiO)(SiO)상기화학식 1에서, R 내지 R, Y, M1, D3, T1, T2, 및 Q1에대한정의는명세서에서정의한것과같다.
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公开(公告)号：KR1020160002241A
公开(公告)日：2016-01-07
申请号：KR1020140081295
申请日：2014-06-30
Applicant: 제일모직주식회사
CPC classification number: C08G77/12 , C08G77/20 , H01L2224/48091 , H01L2924/181 , C08L83/04 , H01L33/52 , H01L33/56 , H01L2924/00014 , H01L2924/00012
Abstract: 규소결합된알케닐기(Si-Vi)를가지는적어도 1 종의제1 실록산화합물, 및규소결합된수소(Si-H)를가지는적어도 1 종의제2 실록산화합물을포함하고, 상기제1 실록산화합물은하기화학식 1로표시되는실록산화합물을포함하는경화형폴리실록산조성물, 상기조성물을경화하여얻은봉지재, 및상기봉지재를포함하는광학기기를제공한다: [화학식 1] (RRRSiO)(RRSiO)(RSiO)(SiO-Y-SiO)(SiO)상기화학식 1에서, R 내지 R, Y, M1, D3, T1, T2, 및 Q1에대한정의는명세서에서정의한것과같다.
Abstract translation: 提供一种可固化聚硅氧烷组合物，通过固化该组合物获得的密封剂和包含该密封剂的光学仪器。 本发明的可固化聚硅氧烷组合物包括：至少一种具有与硅键合的烯基的第一硅氧烷化合物（Si-Vi）; 和至少一种具有与硅（Si-H）结合的氢的第二硅氧烷化合物。 第一硅氧烷化合物包括由化学式1表示的硅氧烷化合物：（R 1，R 3，R 8 R 9 AlSiO 2/2）_D 3（R 12 SiO 3/2）_T 3（SiO 3/2-Y ^ 3-SiO_3 / 2）_T2（SiO_4 / 2）_Q1。 在化学式1中，R 1至R 12，Y 3，M 1，D 3，T 1，T 2和Q 1与本说明书中所定义相同。
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公开(公告)号：KR1020130075188A
公开(公告)日：2013-07-05
申请号：KR1020110143454
申请日：2011-12-27
Applicant: 제일모직주식회사
IPC: C09J7/00 , C09J201/00 , C09J163/00 , H01L21/02
CPC classification number: C09J163/00 , C08G59/50 , C08G59/621 , C08K5/0025 , C08K5/18 , C08L61/06 , C09J7/10 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2400/22 , C09J2461/00 , C09J2463/00 , H01L24/29 , H01L24/32 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29387 , H01L2224/29388 , H01L2224/32145 , H01L2224/32225 , H01L2224/83851 , H01L2224/83862 , H01L2924/0665 , H01L2924/00014
Abstract: PURPOSE: An adhesive film is provided to remove a PCB baking process and a PCB plasma process by expressing proper adhesive force only with a chip adhering process. CONSTITUTION: A semiconductor adhesive film has die share intensity after adhering a chip greater than 4 kgf/chip at 120 deg. C for 5 seconds, and greater than 2×10^6dyne/cm^2 at 150 deg. C after more than 20 minutes. An adhesive composition for a semiconductor contains 51-80 parts of thermoplastic resin by weight, 5-20 parts of epoxy resin by weight, 2-10 parts of phenol type hardened resin by weight, 2-10 parts of amine-based hardened resin by weight, and 0.1-10 parts of hardening accelerator for 100 parts of solid portion by weight.
Abstract translation: 目的：提供粘合膜，通过仅通过芯片粘附工艺表达适当的粘合力来去除PCB烘烤工艺和PCB等离子体工艺。 构成：半导体粘合膜在120度附着大于4kgf /芯片的芯片后具有芯片共享强度。 在150度下大于2×10 ^ 6dyne / cm 2。 C超过20分钟。 半导体用粘合剂组合物含有51-80重量份热塑性树脂，5-20重量份环氧树脂，2-10重量份苯酚型硬化树脂，2-10份胺基硬化树脂， 重量和0.1-10份硬化促进剂，用于100份固体重量份。
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