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公开(公告)号：KR1020130072049A
公开(公告)日：2013-07-01
申请号：KR1020110139594
申请日：2011-12-21
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J163/00 , C09J7/02 , H01L21/02
CPC classification number: C09D133/08 , C09J7/10 , C09J133/068 , C09J163/00 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13147 , H01L2224/2919 , H01L2224/81203 , H01L2224/83 , H01L2924/01327 , H01L2924/07802 , H01L2924/00 , H01L2924/00014 , C09J133/04 , C09J7/22 , C09J7/30 , C09J7/35 , C09J2201/622 , C09J2203/326 , C09J2205/10 , C09J2205/102 , H01L21/02002 , H01L21/6836
Abstract: PURPOSE: An adhesive composition for a semiconductor is provided to control curing of a flux function and insulating adhesive layer, thereby preventing foam void by having sufficient low temperature flowability, thereby obtaining a sufficient gap filling. CONSTITUTION: An adhesive composition for a semiconductor comprises an acrylic resin, epoxy-based resin, flux-active hardener, and imidazole compound. The adhesive composition for the semiconductor has a melt viscosity at 60 °C is 1×10^4 - 15 ×10^4 P. Curing reside rate at 260 °C after 10 seconds curing, represented by formula 1: Hc/Hi ×100 is 5% or less. In formula 1, Hi is an initial heating amount after film manufacturing; and Hc is a heating amount after 10 seconds curing at 260 °C.
Abstract translation: 目的：提供用于半导体的粘合剂组合物以控制助焊剂功能的固化和绝缘粘合剂层，从而通过具有足够的低温流动性来防止泡沫空隙，从而获得足够的间隙填充。 构成：半导体用粘合剂组合物包括丙烯酸树脂，环氧类树脂，助熔剂固化剂和咪唑化合物。 用于半导体的粘合剂组合物在60℃下的熔融粘度为1×10 ^ 4-15×10 ^ 4P。10秒固化后固化速率为260℃，由式1表示：Hc / Hi×100 为5％以下。 在公式1中，Hi是膜制造后的初始加热量; Hc是在260℃下固化10秒后的加热量。
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公开(公告)号：KR1020120077639A
公开(公告)日：2012-07-10
申请号：KR1020100139675
申请日：2010-12-30
Applicant: 제일모직주식회사
IPC: C09J133/14 , C09J183/04 , C09J7/02 , H01L21/58
CPC classification number: C09J133/14 , C09J7/22 , C09J7/30 , C09J7/385 , C09J183/04 , C09J2201/606 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive composition and a dicing die bonding film using the same are provided to reduce inconvenience of semiconductor manufacturing process and increase viscosity for ring frames. CONSTITUTION: An adhesive composition comprises acrylic copolymer and a hardener. The acrylic copolymer has one or more alkyl groups, one or more -OHs and one or more silane groups. The acrylic copolymer is manufactured by reacting a base binder and a compound having one or more silane groups. The base binder is manufactured by copolymerizing (meta) acrylate having one or more -OHs and (meta)acrylate having one or more alkyl groups. The compound having the silane group is united with -OH of the (meta)acrylate having -OH. The compound having silane group is one or more selected from a group consisting of 3-isocyanatepropyltriethoxysilane, 3-isocyanatepropyl trimethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane and vinylethoxysilane.
Abstract translation: 目的：提供使用其的粘合剂组合物和切割芯片接合膜，以减少半导体制造工艺的不便，并增加环形框架的粘度。 构成：粘合剂组合物包含丙烯酸共聚物和硬化剂。 丙烯酸共聚物具有一个或多个烷基，一个或多个-OH和一个或多个硅烷基团。 丙烯酸共聚物通过使基础粘合剂和具有一个或多个硅烷基团的化合物反应来制造。 基础粘合剂通过共聚具有一个或多个-OH的（甲基）丙烯酸酯和具有一个或多个烷基的（甲基）丙烯酸酯而制备。 具有硅烷基的化合物与具有-OH的（甲基）丙烯酸酯的-OH结合。 具有硅烷基的化合物是选自3-异氰酸酯基丙基三乙氧基硅烷，3-异氰酸酯基丙基三甲氧基硅烷，乙烯基三氯硅烷，乙烯基三甲氧基硅烷和乙烯基三乙氧基硅烷中的一种或多种。
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公开(公告)号：KR1020140121235A
公开(公告)日：2014-10-15
申请号：KR1020130037760
申请日：2013-04-05
Applicant: 제일모직주식회사
IPC: C09J7/00 , C09J133/04 , H01L51/50
CPC classification number: H01L51/5246 , C09J7/00 , C09J133/04 , H01L51/0043 , H01L51/5237 , H01L51/56
Abstract: 본 발명은 유리전이온도가 -10℃ 내지 10℃인 (메타)아크릴계 바인더, 광중합성 단량체 및 개시제를 포함하는 유기발광소자 충진제용 접착필름, 이의 경화물을 포함하는 유기발광장치에 관한 것이다.
Abstract translation: 本发明涉及一种用于有机发光二极管的填充剂的粘合剂膜和包括其的有机发光装置。 更具体地说，本发明涉及包含玻璃化转变温度为-10℃至10℃的（金属）丙烯酸粘合剂，可光聚合单体和引发剂的有机发光二极管的填充剂用粘合剂膜 ; 以及包括其固化产物的有机发光装置。 根据本发明的实施方案，用于填充剂的粘合剂膜有效地减少黑点的产生。
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公开(公告)号：KR1020140112886A
公开(公告)日：2014-09-24
申请号：KR1020130027540
申请日：2013-03-14
Applicant: 제일모직주식회사
Abstract: The present invention relates to a method for encapsulating an organic light emitting device comprising a step of: reducing and dehydrating a filler for encapsulating the organic light emitting device including copper oxide and a binder; and sealing the filler for encapsulating the organic light emitting device and the organic light emitting device, and to an organic light emitting device encapsulated thereby.
Abstract translation: 本发明涉及一种封装有机发光器件的方法，包括以下步骤：还原和脱水用于封装包括氧化铜和粘合剂的有机发光器件的填料; 并密封用于封装有机发光器件和有机发光器件的填料，以及封装在其中的有机发光器件。
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公开(公告)号：KR1020130134878A
公开(公告)日：2013-12-10
申请号：KR1020120058742
申请日：2012-05-31
Applicant: 제일모직주식회사
CPC classification number: H01L51/5246 , C08L2203/206 , C09J4/00 , C09J7/385 , H05B33/04 , C09J7/00 , H01L51/5203 , H01L51/56
Abstract: The present invention relates to an organic light emitting device and an attaching film for the organic light emitting device and, more particularly, to an organic light emitting device including a first substrate, an organic light emitting diode deposited on the first substrate, a second substrate facing the first substrate, and a filler covering the organic light emitting device and filling a gap between the first and second substrates and an attaching film including an acrylic binder. The filter includes the acrylic binder.
Abstract translation: 本发明涉及一种有机发光器件和有机发光器件的贴膜，更具体地，涉及一种有机发光器件，其包括第一衬底，沉积在第一衬底上的有机发光二极管，第二衬底 面向第一基板和覆盖有机发光器件并填充第一和第二基板之间的间隙的填充物和包括丙烯酸粘合剂的附着膜。 过滤器包括丙烯酸粘合剂。
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Patent Agency Ranking
公开(公告)号：KR1020120068453A
公开(公告)日：2012-06-27
申请号：KR1020100130084
申请日：2010-12-17
Applicant: 제일모직주식회사
IPC: C09J7/02 , C09J9/00 , C09J133/04 , H01L21/58
CPC classification number: C09J7/0217 , C08K5/0025 , C08K5/54 , C08L2312/08 , C09J7/20 , C09J133/04 , C09J133/14 , C09J143/04 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/8385 , H01L2224/83862 , H01L2224/94 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01077 , H01L2924/0665 , Y10T428/264 , Y10T428/2848 , Y10T428/2852 , H01L2924/3512 , H01L2924/00 , H01L2224/27 , H01L2924/00012 , H01L2924/0635 , C09J7/38 , C09J7/35 , C09J7/385 , C09J9/00 , C09J2201/622
Abstract: PURPOSE: A pressure-sensitive dicing die bonding film is provide to comprise adhesive layers having different adhesion each other to an adhesive layer and a ring frame, thereby having frame stability, and high pick-up success rate. CONSTITUTION: A pressure-sensitive dicing die bonding film comprises a base film(4), a tackifying layer(5) formed on the base film, and an adhesive layer formed on the top of the adhesive layer. The adhesive force between the tackifying layer and the ring frame(B) is B/A>=1.1. The slid distance of the tackifying layer is 0-0.1 mm, when applying force to the tackifying layer by 10 gf per unit area 1mm^2. The tackifying layer is a monolayer, the thickness of the tackifying layer is 3-40 micron, and the tackifying layer comprises silane coupling agent.
Abstract translation: 目的：提供一种压敏切片模接合薄膜，其包括对粘合剂层和环形框架具有不同粘附性的粘合剂层，从而具有框架稳定性和高的拾取成功率。 构成：压敏切割芯片接合膜包括基膜（4），形成在基膜上的增粘层（5）和形成在粘合剂层顶部上的粘合剂层。 增粘层与环框架（B）之间的粘合力为B / A> = 1.1。 增粘层的滑动距离为0-0.1mm，当对单位面积1mm ^ 2施加力至增粘层10gf时。 增粘层为单层，增粘层的厚度为3-40微米，增粘层为硅烷偶联剂。
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公开(公告)号：KR1020120062517A
公开(公告)日：2012-06-14
申请号：KR1020100123810
申请日：2010-12-06
Applicant: 제일모직주식회사
IPC: C08J5/18 , C09J7/02 , C09J133/08 , C09J163/00
CPC classification number: C09J7/0217 , B32B7/06 , B32B27/08 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/30 , B32B2405/00 , C08G18/6254 , C08G59/08 , C08G2170/40 , C08L2312/08 , C09J7/22 , C09J7/385 , C09J163/00 , C09J175/04 , C09J2201/606 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/29084 , H01L2224/2919 , H01L2224/2929 , H01L2224/29388 , H01L2224/32145 , H01L2224/83191 , H01L2224/94 , H01L2924/00013 , H01L2924/061 , H01L2924/0615 , H01L2924/0635 , H01L2924/0665 , H01L2924/0675 , H01L2924/068 , H01L2924/07025 , H01L2924/0705 , Y10T428/28 , Y10T428/31515 , H01L2224/27 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00 , C08J5/18 , C09J7/29 , C09J7/38 , C09J133/08 , C09J2201/622
Abstract: PURPOSE: A base material film and an adhesive film for semiconductor using thereof are provided to prevent a collapse phenomenon and defects in post semiconductor packing process. CONSTITUTION: An adhesive film for semiconductor(110) includes a base film and a tackifier layer(114) which is coated in one side of the base material film. A coefficient of linear expansion at 0-5 deg. Celsius of the base material film is 50-150 microns/m*deg. Celsius, and a thermal shrinkage ratio at 5 deg. Celsius after 120 hours is greater than 0 and less than 0.1%. The tackifier layer is a UV-curable adhesive layer. The adhesion layer comprises a binder, a thermosetting material, and a photo initiator. The adhesive film additionally includes an adhesive layer(116) and a protection film(118) which are successively laminated in one side of the adhesion layer.
Abstract translation: 目的：提供基材薄膜和使用其的半导体用粘合膜，以防止后半导体封装工艺中的塌陷现象和缺陷。 构成：半导体用粘合膜（110）包括基材膜和涂布在基材膜一侧的增粘层（114）。 线性膨胀系数为0-5度 基材膜的摄氏度为50-150微米/ m *度。 摄氏度和5度的热收缩率。 120小时后的摄氏度大于0且小于0.1％。 增粘剂层是可UV固化的粘合剂层。 粘合层包括粘合剂，热固性材料和光引发剂。 粘合膜另外包括粘附层（116）和保护膜（118），它们被连续层压在粘合层的一侧。
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公开(公告)号：KR101033043B1
公开(公告)日：2011-05-09
申请号：KR1020080135837
申请日：2008-12-29
Applicant: 제일모직주식회사
IPC: H01L21/027
Abstract: 본 발명은 반도체용 다이싱 필름 및 다이싱 다이본딩 필름에 관한 것으로, 자외선 경화형 웨이퍼 가공용 다이싱 필름 또는 다이 접착용 접착필름층을 갖는 다이싱 다이본딩 필름에 있어서, 종래에는 UV조사기의 오작동에 의해서 자외선 노광 유무를 작업자가 일일이 수작업으로 웨이퍼 한장 한장을 확인해야 했는데, 이와 같은 불편함을 해결하기 위하여 UV조사기의 오작동에 의해 자외선 노광 유무를 자외선의 광량에 따라 변색되는 광변색성 염료(photochromic dye)를 다이싱 필름 또는 다이싱 다이본딩 필름에 적용함으로써, 자외선 노광 유무를 육안으로 용이하게 확인할 수 있도록 하는 발명에 관한 것이다.
다이싱 필름, 점착, 접착필름, 반도체용 접착제, 조성물-
公开(公告)号：KR1020100077795A
公开(公告)日：2010-07-08
申请号：KR1020080135837
申请日：2008-12-29
Applicant: 제일모직주식회사
IPC: H01L21/027
CPC classification number: H01L21/6836 , G03F7/705 , G03F7/70525 , G03F7/70533 , G03F7/7085
Abstract: PURPOSE: A dicing film for a semiconductor and a dicing die-bonding film thereof are provided to easily confirm errors during an ultraviolet exposure process by including an ultraviolet irradiation confirmation part. CONSTITUTION: A dicing film comprises a base film(100) and an adhesive film(120). The adhesive film is formed on the base film. An ultraviolet exposure region(110) is defined between the contour of the base film and the contour of the adhesive film. At least one between the base film and the adhesive film includes an ultraviolet irradiation confirmation part. The ultraviolet irradiation confirmation part is photochromic dye. The photochromic dye is spread on a part of the region of the base film and the adhesive film, or entire region.
Abstract translation: 目的：提供一种半导体用切割薄膜及其切割芯片接合薄膜，以容易地通过包括紫外线照射确认部来确认紫外线曝光过程中的误差。 构成：切割膜包括基膜（100）和粘合膜（120）。 粘合膜形成在基膜上。 在基膜的轮廓和粘合膜的轮廓之间限定紫外线曝光区域（110）。 基膜和粘合剂膜之间的至少一个包括紫外线照射确认部。 紫外线照射确认部是光致变色染料。 光致变色染料铺展在基膜和粘合剂膜的整个区域的一部分上。
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公开(公告)号：KR1020100073847A
公开(公告)日：2010-07-01
申请号：KR1020080132628
申请日：2008-12-23
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J7/00
CPC classification number: C09J11/08 , C08L83/04 , C09J133/08 , C09J2203/30 , C09J2423/006
Abstract: PURPOSE: An acrylate-adhesive composition is provided to obtain improved pick-up performance by revealing heterogeneity of a dimethysiloxane resin after a photocuring process and to be applied to a dicing or an adhesive tape of bonding the dicing. CONSTITUTION: An acrylate-adhesive composition includes 0.01-0.045 parts by weight of a dimethylsiloxane resin based on 100.0 parts by weight of an acrylic binder resin including ethylhexylacrylat. The dimethysiloxane resin is introduced to the backbone of the acrylic binder resin. The binder resin includes 2-ethylhexylacrylat 50-80 parts by weight, isooctylacrylate 20 parts by weight, 2-hydroxymethylmethacrylate 20 parts by weight, 2-hydroxy ethyl acrylate 20 parts by weight, and glycidyl methacrylate monomer 10 parts by weight.
Abstract translation: 目的：提供丙烯酸酯 - 粘合剂组合物，以通过在光固化过程之后揭示二甲硅氧烷树脂的异质性，并将其应用于将切割粘合的切割或粘合带来获得改进的拾取性能。 构成：丙烯酸酯 - 粘合剂组合物包含基于100.0重量份包含乙基己基丙烯酸酯的丙烯酸粘合剂树脂的0.01-0.045重量份的二甲基硅氧烷树脂。 将二甲硅氧烷树脂引入到丙烯酸粘合剂树脂的主链上。 粘合剂树脂包括50-80重量份的2-乙基己基丙烯酸酯，丙烯酸异辛酯20重量份，2-羟甲基甲基丙烯酸酯20重量份，丙烯酸2-羟基乙酯20重量份和甲基丙烯酸缩水甘油酯单体10重量份。
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