전기-광학 변조 소자
    11.
    发明公开
    전기-광학 변조 소자 有权
    电光调制装置

    公开(公告)号:KR1020110027549A

    公开(公告)日:2011-03-16

    申请号:KR1020100066675

    申请日:2010-07-12

    CPC classification number: Y02E10/50 H01L31/04 G02B6/10 H01L31/00

    Abstract: PURPOSE: An electro-optic modulating device is provided to form vertical PN junctions or vertical PIN junctions in an optical waveguide, thereby increasing a change of an effective refractive index during a device operation. CONSTITUTION: A semiconductor film(30) configuring an optical waveguide(WG) is arranged on a substrate(10). The optical waveguide comprises the first slab part(SP1), the second slab part(SP2), and a lip part(RP). The lip part includes a thickness thicker than the first and second slab parts. The first and second doping areas(D1,D2) are formed on the first and second slab parts respectively. A vertical doping area(50) configuring a vertical structure is formed in the lip part.

    Abstract translation: 目的:提供电光调制装置以在光波导中形成垂直PN结或垂直PIN结,从而在器件操作期间增加有效折射率的变化。 构成:构成光波导(WG)的半导体膜(30)配置在基板(10)上。 光波导包括第一板坯部(SP1),第二板坯部(SP2)和唇部(RP)。 唇部包括比第一和第二板坯部分厚的厚度。 第一和第二掺杂区域(D1,D2)分别形成在第一和第二平板部件上。 在唇部形成垂直结构的垂直掺杂区域(50)。

    그레이팅 커플러
    13.
    发明公开
    그레이팅 커플러 无效
    镀金联轴器

    公开(公告)号:KR1020130058291A

    公开(公告)日:2013-06-04

    申请号:KR1020110124214

    申请日:2011-11-25

    Inventor: 김도원 김경옥

    CPC classification number: G02B6/34

    Abstract: PURPOSE: A grating coupler is provided to effectively transmit data and to reduce an optical loss. CONSTITUTION: A grating coupler(100) includes an optical waveguide(110) transmitting optical signals and a diffraction grid(120) formed on the upper part of the optical waveguide and containing protrusion parts(130) which are successively formed and have different heights.

    Abstract translation: 目的:提供光栅耦合器以有效地传输数据并减少光损耗。 构成:光栅耦合器(100)包括传输光信号的光波导(110)和形成在光波导的上部的衍射栅格(120),并且包含相继形成且具有不同高度的突出部分(130)。

    광전소자 칩 및 그를 구비하는 광학장치
    14.
    发明公开
    광전소자 칩 및 그를 구비하는 광학장치 有权
    光电芯片和光学设备

    公开(公告)号:KR1020120052046A

    公开(公告)日:2012-05-23

    申请号:KR1020100113495

    申请日:2010-11-15

    CPC classification number: G02B6/4292 G02B6/3644 G02B6/3652 G02B6/3885

    Abstract: PURPOSE: A photoelectric device chip and an optical device including the same are provided to increase optical bonding reliability and optical alignment efficiency. CONSTITUTION: A photoelectric device chip(10) comprises a substrate(12), a plurality of optical waveguides(14), an optical couplers(16), and a plurality of alignment units(20). The optical waveguide is formed on the substrate. The optical coupler is formed on the waveguide. A plurality of alignment units arranges an optical connector which fixes optical fiber combined with the optical coupler on the substrate.

    Abstract translation: 目的:提供光电器件芯片和包括该光电器件芯片的光学器件以提高光学接合可靠性和光学对准效率。 构成:光电器件芯片(10)包括衬底(12),多个光波导(14),光耦合器(16)和多个对准单元(20)。 光波导形成在基板上。 光耦合器形成在波导上。 多个对准单元配置将与光耦合器结合的光纤固定在基板上的光连接器。

    에폭시 수지를 이용한 광 도파로 및 그 제조방법
    15.
    发明公开
    에폭시 수지를 이용한 광 도파로 및 그 제조방법 有权
    使用环氧树脂的光波导及其制备方法

    公开(公告)号:KR1020090042354A

    公开(公告)日:2009-04-30

    申请号:KR1020070108064

    申请日:2007-10-26

    Inventor: 김도원 안승호

    Abstract: An optical waveguide using an epoxy resin and the fabricating methods thereof is provided to make up for the weak points of an epoxy resin by coating high polymer film having a heat-resisting property. In an optical waveguide using an epoxy resin and the fabricating methods thereof, a high polymer film(250,255) is coated on an epoxy resin for a lower clad and a upper clad respectively. The epoxy resin for the lower part and the upper clad and the high polymer film is hardened by using an UV. The lower clad is formed to remove lower PDMS master, and the upper clad is formed to remove upper PDMS. A liquid core epoxy resin is coated on an engrave pattern of the lower clad and is hardened by using UV.

    Abstract translation: 提供使用环氧树脂的光波导及其制造方法,以通过涂覆耐热性高的聚合物膜来弥补环氧树脂的弱点。 在使用环氧树脂的光波导及其制造方法中,高分子膜(250,255)分别涂覆在下包层和上覆层的环氧树脂上。 用于下部的环氧树脂和上部包层和高分子聚合物膜通过使用UV来硬化。 形成下部包层以去除下部PDMS母体,并且形成上部包层以去除上部PDMS。 将液芯环氧树脂涂覆在下包层的雕刻图案上,并通过使用UV进行硬化。

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