METHOD TO LABEL SUBSTRATES BASED ON PROCESS PARAMETERS

    公开(公告)号:WO2019206498A1

    公开(公告)日:2019-10-31

    申请号:PCT/EP2019/055262

    申请日:2019-03-04

    Abstract: A method of grouping data associated with substrates undergoing a process step of a manufacturing process is disclosed. The method comprises obtaining first data associated with substrates before being subject to the process step and obtaining a plurality of sets of second data associated with substrates after being subject to the process step, each set of second data being associated with a different value of a characteristic of the first data. A distance metric is determined which describes a measure of distance between the sets of second data; and the second data is grouped based on a property of the distance metric.

    METHOD TO LABEL SUBSTRATES BASED ON PROCESS PARAMETERS

    公开(公告)号:EP3594749A1

    公开(公告)日:2020-01-15

    申请号:EP18182594.4

    申请日:2018-07-10

    Abstract: A method of grouping data associated with substrates undergoing a process step of a manufacturing process is disclosed. The method comprises obtaining first data associated with substrates before being subject to the process step and obtaining a plurality of sets of second data associated with substrates after being subject to the process step, each set of second data being associated with a different value of a characteristic of the first data in common. A distance metric is determined which describes a measure of distance between the sets of second data; and the second data is grouped based on a property of the distance metric.

    METHOD FOR CLASSIFYING SEMICONDUCTOR WAFERS
    20.
    发明公开

    公开(公告)号:EP3945548A1

    公开(公告)日:2022-02-02

    申请号:EP20188698.3

    申请日:2020-07-30

    Abstract: Methods and apparatus for classifying semiconductor wafers. The method comprises: sorting a set of semiconductor wafers, using a model, into a plurality of sub-sets based on parameter data corresponding to one or more parameters of the set of semiconductor wafers, wherein the parameter data for semiconductor wafers in a sub-set include one or more common characteristics; identifying one or more semiconductor wafers within a sub-set based on a probability of the one or more semiconductor wafers being correctly allocated to the sub-set; comparing the parameter data of the one or more identified semiconductor wafers to reference parameter data; and reconfiguring the model based on the comparison. The comparison is undertaken by a human to provide constraints for the model. The apparatus is configured to undertake the method.

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