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    Flip chip heat sink package and method
    11.
    发明公开
    Flip chip heat sink package and method 审中-公开
    FlipchipKühlgehäuseund Methode

    公开(公告)号：EP1523040A2

    公开(公告)日：2005-04-13

    申请号：EP04077702.1

    申请日：2004-09-30

    Applicant: Delphi Technologies, Inc.

    Inventor： Chengalva, Suresh K. ,  Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W.

    IPC: H01L25/065 ,  H01L23/367

    CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

    Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).

    Abstract translation: 提供具有增强的散热的电子封装（10），其在相反的方向上呈现出双重传导热路（40,42）。 封装（10）包括其上具有电导体的衬底（16）和安装到衬底（16）的倒装芯片（12）。 倒装芯片（12）具有第一表面，第一表面上的焊料凸块（14）和与第一表面相对设置的第二表面。 倒装芯片（12）安装到基板（16），使得焊料凸块（14）与基板（16）上的导体对准。 封装（10）还包括与倒装芯片（12）的第二表面传热关系的冲压金属散热器（30）。 散热器（30）包括与包含导热材料（34）的倒装芯片（12）相邻形成的空腔（32）。

    Circuit board surface mount package
    15.
    发明公开
    Circuit board surface mount package 审中-公开
    OberflächenmontiertePackung einer Leiterplatte

    公开(公告)号：EP1565047A1

    公开(公告)日：2005-08-17

    申请号：EP05075212.0

    申请日：2005-01-27

    Applicant: Delphi Technologies, Inc.

    Inventor： Post, Scott E. ,  Cheok, Cheng Gek, c/o 700 Lorong 1-Toa Payoh ,  Stillabower, Morris D. ,  Nah, Chih Kai ,  Mandel, Larry M. ,  Yong, Sim Ying

    IPC: H05K3/34

    CPC classification number: H05K1/112 ,  H05K3/3442 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic package (10) is provided having a surface mount electronic device (40) connected to a circuit board (12). The package (10) includes a circuit board (12) and a surface mount electronic device (40). A mounting pad (28) is formed on the circuit board (12). A plurality of vias (30) are formed each having an opening extending into the circuit board (12) and extending through the mounting pad (28). The package (10) further includes a solder joint (32) connecting a contact terminal (42) of the surface mount device (40) to the mounting pad (28) on the circuit board (12). The solder joint (32) extends at least partially into the openings in each of the plurality of vias (30) to support the arrangement of the surface mount device (40) on the circuit board (12).

    Abstract translation: 提供具有连接到电路板（12）的表面安装电子装置（40）的电子封装（10）。 封装（10）包括电路板（12）和表面贴装电子器件（40）。 在电路板（12）上形成安装垫（28）。 形成多个通孔（30），每个通孔具有延伸到电路板（12）中并延伸穿过安装垫（28）的开口。 封装（10）还包括将表面安装器件（40）的接触端子（42）连接到电路板（12）上的安装焊盘（28）的焊接接头（32）。 焊接接头（32）至少部分地延伸到多个通孔（30）中的每一个中的开口中，以支撑表面安装器件（40）在电路板（12）上的布置。

    Semiconductor device heat sink package and method
    16.
    发明公开
    Semiconductor device heat sink package and method 审中-公开
    Halbleiter-Kühlgehäuseund Methode

    公开(公告)号：EP1523036A2

    公开(公告)日：2005-04-13

    申请号：EP04077669.2

    申请日：2004-09-28

    Applicant: Delphi Technologies, Inc.

    Inventor： Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W. ,  Chengalva, Suresh K.

    IPC: H01L23/367 ,  H01L25/065

    CPC classification number: H01L23/42 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (18) and a semiconductor device (12) mounted to the substrate (18). The semiconductor device (12) has electrical circuitry a first surface, and a second surface oppositely disposed from the first surface. A thermally conductive heat sink (30) is assembled over the semiconductor device (12) such that a cavity (32) is formed between the semiconductor device (12) and the heat sink (30). A thermally conductive and electrically insulative material (36) is disposed in the cavity (32) between the semiconductor device (12) and the heat sink (30).

    Abstract translation: 提供具有增强的散热的电子封装（10），其在相反的方向上呈现出双重传导热路（40,42）。 封装（10）包括衬底（18）和安装到衬底（18）的半导体器件（12）。 半导体器件（12）具有电路，第一表面和与第一表面相对设置的第二表面。 导热散热器（30）组装在半导体器件（12）上，使得在半导体器件（12）和散热器（30）之间形成空腔（32）。 导热和电绝缘材料（36）设置在半导体器件（12）和散热器（30）之间的空腔（32）中。

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