公开(公告)号：WO1996016440A1

公开(公告)日：1996-05-30

申请号：PCT/US1995014843

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01L23/02

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (220) (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (210). A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (210). The elongate element (216) may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element (210) to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts.

Abstract translation: 通过将软材料（例如金）的细长元件（芯）（216）成形为具有弹性形状来形成用于电子部件的用于显示期望的机械特性（例如弹性，用于形成压力接触）的互连元件（210） （包括悬臂梁，S形，U形），并用硬质材料（220）（例如镍及其合金）涂覆成形的细长元件，以赋予所得复合互连件所需的弹簧（弹性）特性 元件（210）。 可以对复合互连元件（210）施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 细长元件（216）可以由导线或从片材（例如，金属箔）形成。 所形成的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外涂层材料将复合互连元件（210）锚定到电子部件上的端子等）上， 可以安装到支撑基板上以用作插入件，并且可以安装到用作探针卡或探针卡插入件的基板。

公开(公告)号：WO2006037056A2

公开(公告)日：2006-04-06

申请号：PCT/US2005/034861

申请日：2005-09-26

Applicant: FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MILLER, Charles, A. ,  BARBARA, Bruce, J. ,  VASQUEZ, Barbara

Inventor： KHANDROS, Igor, Y. ,  MILLER, Charles, A. ,  BARBARA, Bruce, J. ,  VASQUEZ, Barbara

IPC: H01L23/02 ,  H01L23/52

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85186 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor dies are stacked offset from one another so that terminals located along two edges of each die are exposed. The two edges of the dies having terminals may be oriented in the same direction. Electrical connections may connect terminals on one die with terminals on another die, and the stack may be disposed on a wiring substrate to which the terminals of the dies may be electrically connected.

Abstract translation: 半导体管芯彼此堆叠地堆叠，使得沿着每个管芯的两个边缘定位的端子被暴露。 具有端子的模具的两个边缘可以沿相同的方向定向。 电连接可以将一个管芯上的端子与另一个管芯上的端子连接，并且堆叠可以布置在可以电连接管芯的端子的布线基板上。

公开(公告)号：WO1998001906A1

公开(公告)日：1998-01-15

申请号：PCT/US1997012541

申请日：1997-07-03

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  TAYLOR, Sheldon, A.

IPC: H01L23/48

CPC classification number: G01R1/07307 ,  G01R1/07342 ,  G01R1/07371 ,  H01H1/0036 ,  H01L23/49811 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: Ends (202b) of elongate interconnection elements, such as spring contact elements (202), effecting pressure connections to terminals of electronic components such as semiconductor devices resident on a semiconductor wafer are protected from adverse effects of undesired lateral forces by a "floating" lateral support element (220). The floating lateral support (220) is a planar member which has a plurality of holes (208) through which the free ends (202b) of the elongate interconnection elements (202) extend, and permits a small (constrained) amount of independent lateral deflection for each interconnection element (202). When an individual interconnection element (212a) exceeds the permitted amount of lateral deflection, it "bumps" into the sidewall of the respective hole in the floating lateral support (220) through which it extends, and further lateral deflection of the interconnection element is resisted by the floating lateral support (220) moving laterally with the laterally-deflected interconnection element (212a) and coming into contact with the remaining interconnection elements (212b, 212c, 212d), which will restrain further lateral movement of the laterally-deflected interconnection element (212a). Additional lateral displacement is prevented by a separate stop mechanism (330) located peripheral to the floating lateral support (320).

Abstract translation: 细长互连元件（例如弹簧接触元件（202））的端部（202b）被保护以防止驻留在半导体晶片上的诸如半导体器件的电子部件的端子的压力连接被“浮动”侧向 支撑元件（220）。 浮动横向支撑件（220）是平面构件，其具有多个孔（208），细长互连元件（202）的自由端（202b）延伸穿过该孔，并允许小的（约束的）量的独立横向偏转 对于每个互连元件（202）。 当单个互连元件（212a）超过允许的横向偏转量时，其“凸起”到浮动侧向支撑件（220）中的相应孔的侧壁中，通过该横向支撑件延伸，互连元件的进一步侧向偏转被抵抗 通过横向偏转的互连元件（212a）横向移动并与剩余的互连元件（212b，212c，212d）接触的浮动横向支撑件（220），这将限制横向偏转的互连元件 （212A）。 通过位于浮动侧向支撑件（320）周边的单独的止动机构（330）来防止额外的横向位移。

公开(公告)号：WO1997043653A1

公开(公告)日：1997-11-20

申请号：PCT/US1997008606

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  DOZIER, Thomas, H. ,  TAYLOR, Sheldon, A.

IPC: G01R01/067

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively "perfect" contact tip structures ("tips") and joining them to relatively "imperfect" interconnection elements to improve the overall capabilities of resulting "tipped" interconnection elements.

Abstract translation: 接触尖端结构被制造在牺牲衬底上，用于随后连接到包括复合互连元件，单片互连元件，探针卡的钨针，膜探针的接触凸块等的互连元件。 尖端结构之间的空间关系可以光刻地定义为非常接近的公差。 尖端结构的冶金独立于它们所连接的互连元件的冶金，通过钎焊，电镀等。 接触尖端结构容易地具有拓扑（小的，精确的，突出的，非平面的）接触特征，例如以截锥形的形式，以优化随后对电子部件的端子进行的电压连接。 描述了适于用作弹簧接触元件而不需要连接到弹性接触元件的细长接触尖端结构。 通常，本发明旨在制造（预制造）相对“完美”的接触尖端结构（“尖端”）并将它们连接到相对“不完美”互连元件，以改善所产生的“尖端”互连元件的整体能力。

公开(公告)号：WO1996017378A1

公开(公告)日：1996-06-06

申请号：PCT/US1995014909

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire (502) to a substrate (508), configuring the wire (530) into a wire stem (530) having a springable shape, severing the wire stem (530), and overcoating the wire stem (530) with at least one layer of a material (522). In an exemplary embodiment, a free end of a wire stem (530) is bonded to a contact area on a substrate (508), the wire stem (530) is configured to have a springable shape, the wire stem (530) is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (530) (which serves as a falsework) and for the overcoat (540) (which serves as a superstructure over the falsework) are disclosed. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing.

Abstract translation: 通过将线（502）的自由端接合到基底（508）上而形成表现出针对各种电子元件的弹性或顺应性的接触结构，将线（530）配置成具有弹性形状的线杆（530） 切断线杆（530），以及用至少一层材料（522）覆盖线杆（530）。 在示例性实施例中，线杆（530）的自由端结合到基底（508）上的接触区域，线杆（530）构造成具有弹性形状，线杆（530）被切断 通过放电自由地放置，独立的线杆通过电镀覆盖。 公开了用于线杆（530）（其用作脚手架）和外罩（540）（其用作脚手架上的上部结构）的各种材料。 本文所述的弹性接触结构对于进行诸如半导体管芯的电子部件的“临时”（探针）连接是理想的，用于老化和功能测试。

公开(公告)号：WO1996015551A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014842

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  DOZIER, Thomas, H.

IPC: H01L21/60

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as the resilient contact structures and are disposed atop the support substrate. Selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive an LGA-type semiconductor package (304), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate (302). In an embodiment intended to receive a BGA-type semiconductor package (404), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate (402).

Abstract translation: 弹性接触结构从支撑衬底的顶表面延伸，并且焊球（或其它合适的）接触结构设置在支撑衬底的底表面上。 互连元件（110）用作弹性接触结构，并设置在支撑基板的顶部。 通过支撑衬底将支撑衬底上的弹性接触结构中的选定的一个连接到支撑衬底的底表面上的对应的接触结构。 在旨在接收LGA型半导体封装（304）的实施例中，在弹性接触结构和半导体封装的外部连接点之间以与支撑衬底的顶表面大致垂直的接触力进行压力接触（ 302）。 在旨在接收BGA型半导体封装（404）的实施例中，在弹性接触结构和半导体封装的外部连接点之间形成压力接触，该接触力通常平行于支撑衬底的顶表面 402）。

公开(公告)号：EP0839322B1

公开(公告)日：2005-08-10

申请号：EP97926534.5

申请日：1997-05-15

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  GRUBE, Gary, W.

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/45 ,  H01L24/72 ,  H01L2224/04042 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48657 ,  H01L2224/4866 ,  H01L2224/85399

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

公开(公告)号：EP1092338B1

公开(公告)日：2004-12-15

申请号：EP99933638.1

申请日：1999-06-30

Applicant: FormFactor, Inc.

Inventor： PEDERSEN, David, V. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, Y.

IPC: H05K3/32

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

公开(公告)号：EP1023469A1

公开(公告)日：2000-08-02

申请号：EP98930127.0

申请日：1998-06-11

Applicant: FORMFACTOR, INC.

Inventor： CHEN, Jimmy, Kuo-Wei ,  ELDRIDGE, Benjamin, N. ,  DOZIER, Thomas, H. ,  YEH, Junjye, J. ,  HERMAN, Gayle, J. ,  KHANDROS, Igor, Y.

IPC: C25D7/00 ,  H01L23/48

CPC classification number: H01L21/4846 ,  B81B7/0006 ,  C25D7/0614 ,  H01L21/67288 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0231 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 °C. This technique involves depositing a material (206) in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment (106). This moderate heat treatment differs from other commonly employed 'stress relief' heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. For example, coating and heat treating a spring-shaped elongate member provides a resilient, conductive contact (212, 920, 1060) useful for electronic applications.

公开(公告)号：EP0839321A1

公开(公告)日：1998-05-06

申请号：EP97925668.0

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  DOZIER, Thomas, H. ,  TAYLOR, Sheldon, A.

IPC: G01R31 ,  G01R1 ,  H01L21 ,  H01L23 ,  G01R3 ,  H01H1 ,  H05K3

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively 'perfect' contact tip structures ('tips') and joining them to relatively 'imperfect' interconnection elements to improve the overall capabilities of resulting 'tipped' interconnection elements.