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公开(公告)号：CA1221832A
公开(公告)日：1987-05-19
申请号：CA467384
申请日：1984-11-08
Applicant: IBM
Inventor： AFZALI-ARDAKANI ALI , COHEN MITCHELL S , PENNINGTON KEITH S , SACHDEV KRISHNA G , SHEN JOHN C S
Abstract: METHOD FOR MAKING DIRECT NEGATIVES AND DIRECT MASTERS BY ELECTRCEROSION RECORDING AND PRODUCTS FORMED THEREBY An electroerosion recording medium for generation of direct negatives or direct masters comprises a conventional support on which is deposited a thin conductive layer, and a protective overlayer comprising a crosslinked binder. The overlayer contains a solid conductive lubricant and optionally a particulate scouring agent to inhibit electrode fouling during writing. Preferably a hard base layer is present between the support and the conductive layer. A method for making the described product is also disclosed.
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12.发明专利
公开(公告)号：CA1220027A
公开(公告)日：1987-04-07
申请号：CA465437
申请日：1984-10-15
Applicant: IBM
Inventor： COHEN MITCHELL S , PENNINGTON KEITH S , SACHDEV KRISHNA G , WEBER WILLIAM D
Abstract: YO983-045 IMPROVED ELECTROEROSION RECORDING MATERIAL WITH POLYORGANOSILOXANE OVERLAYER, AND IMPROVED OVERLAYER COMPOSITIONS For high speed electroerosion recording, this invention provides a polyorganosiloxane overlayer which includes high lubricity solid particles as a filler. The overlayer provides a combination lubricant and protective layer for the thin metal layer which is removed by electroerosion to prevent damage for the areas not removed by electroerosion. The polyorganosiloxane overlayer is preferably crosslinked, and is relatively hard, durable, and especially resistant to thermal degradation by the electroerosion arcing. This is important to avoid debris buildup at the recording electrodes resulting from the high temperature arcing for removal of the overlayer in the areas where recording takes place.
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公开(公告)号：CA1109962A
公开(公告)日：1981-09-29
申请号：CA298878
申请日：1978-03-14
Applicant: IBM
Inventor： BEALL GREGORY W , COHEN MITCHELL S , KRYDER MARK H
Abstract: SLM field access bubble devices which include at least one conductor crossing a bubble propagation path have severely limited operating margins (especially for small bubbles) for the bubble in the vicinity of the conductor. Apparatus and method for operating such a bubble device is disclosed which improves the device operation in this region. The improved apparatus and method provides an additional field source with a sense and magnitude to support the bubble when it reaches the conductor region. Such a field source, as disclosed, includes a current pulse in the conductor.
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公开(公告)号：FR2412912A1
公开(公告)日：1979-07-20
申请号：FR7833625
申请日：1978-11-21
Applicant: IBM
Inventor： AHN KIE Y , COHEN MITCHELL S , POWERS V , TAO LUNG-JO
Abstract: An improved magnetic bubble domain chip and processes for making the chip are described. The chip is comprised of a magnetic bubble domain film in which small bubble domains can be moved, and overlying layers of metallurgy. The layer of metallurgy closest to the bubble film is an electrically conductive layer having apertures (or recesses) therein. This layer is patterned to provide current carrying conductors. The next overlayer is a layer of magnetic material having in-plane magnetization which is patterned to provide the propagation elements used to move the bubble domains. In a particular embodiment, the magnetic layer is comprised of a magnetically soft material, such as permalloy. The chip is characterized by the provision of insulating pedestals located in the apertures of the conductive layer. These insulating pedestals are located in the regions of the chip used for sensing (and/or bubble generation). That is, they take the place of the thick conductive material in those areas of the chip. The sensor and bubble generators are usually portions of the in-plane magnetic layer. If the height of the insulating pedestals is the same as the height of the conductive layer, planarization is achieved and each overlayer lies in a single plane, where the planes are parallel to one another. However, the pedestal can be of any desired height. This chip is particularly advantageous for use with bubble domains having diameters of about 1 micron and less, since the pedestal magnetic chip can be provided by single level masking techniques in which only a single critical masking step is required. The insulating pedestal can be formed prior to deposition of the current carrying conductive layer, or subsequent to deposition of this layer.
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Patent Agency Ranking
公开(公告)号：DE10065034B4
公开(公告)日：2006-01-19
申请号：DE10065034
申请日：2000-12-23
Applicant: IBM
Inventor： CHAN BENSON , COHEN MITCHELL S , FORTIER PAUL F , FREITAG LADD W , HALL RICHARD R , JOHNSON GLEN W , LIN HOW TZU , SHERMAN JOHN H
Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.
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公开(公告)号：DE69128258T2
公开(公告)日：1998-05-28
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
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公开(公告)号：DE69128258D1
公开(公告)日：1998-01-08
申请号：DE69128258
申请日：1991-05-28
Applicant: IBM
Inventor： BREGMAN MARK F , BREWER WILLIAM D , COHEN MITCHELL S , JOHNSON GLEN W , NOYAN ISMAIL C , OPRYSKO MODEST M , RITTER MARK B , ROGERS DENNIS L , TREWHELLA JEANNINE M
Abstract: A direct optical connector (DOC) comprised of first (201) and second members, each including a plurality of light emitting (202, 204) and light detecting (205, 203) locations, operative in combination with energy transfer media (210) to form direct optical connections between the light emitting locations (202, 204) and the light detecting (203, 205) locations, wherein said first (201) and second members are adapted for reclosable connection to each other whereupon the light emitting locations (202) on one member are aligned with the light detecting locations (205) on the other member. The first (201) and second members of the preferred DOC are modular. Alternative forms of energy transfer media (210) are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc., thereby permitting the fabrication and/or use of a connector most suited to meet the requirements of a particular application. A modular half of a DOC can be used in conjunction with a remote optical connector (ROC) to channel light over relatively long distances. The invention also encompasses processes for fabricating ROCs.
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18.发明专利
公开(公告)号：CA1221834A
公开(公告)日：1987-05-19
申请号：CA467385
申请日：1984-11-08
Applicant: IBM
Inventor： AFZALI-ARDAKANI ALI , COHEN MITCHELL S , PENNINGTON KEITH S , SACHDEV KRISHNA G
Abstract: SCRATCH RESISTANT RECORDING MATERIALS FOR ELECTROEROSION PRINTING NOT REQUIRING A LUBICANT OVERCOAT Electroerosion recording materials of superior scratch resistance are provided without the need for a lubricant overcoat by incorporating a hard, luricating hydrophobic polymer layer between the support and the removable, thin conductive layer to reduce plastic deformation of the support under stylus writing pressure. The intermediate polymer layer provides a highly adhering surface for the overlying aluminum film and contains graphite fluoride and/or fluorocarbon resins such as TeflonR and hard particles such as silica. The materials may be used in various printing processes including making directly readable images, direct negatives and wear resistant offset printing masters.
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公开(公告)号：CA1144277A
公开(公告)日：1983-04-05
申请号：CA353816
申请日：1980-06-11
Applicant: IBM
Inventor： COHEN MITCHELL S
Abstract: CONTIGUOUS DISK BUBBLE STORAGE A bubble storage system using contiguous propagation elements is described using magnetically soft drive layers for movement of the bubble domains in a bubble domain film, in response to the reorientation of a magnetic drive field in the plane of the drive layers. In contrast with prior art contiguous element propagation structures, charged walls are not employed for movement of bubble domains. Instead, magnetic poles along the drive layers are used to move the domains. Two drive layers are used, each of which is comprised of a magnetically soft material, such as permalloy. The drive layers are located at different heights with respect to the layer in which the magnetic bubble domains exist, the bottom drive layer being comprised of contiguous propagation elements defining a generally undulating edge along which the magnetic bubble domains move. This layer can be comprised of permalloy contiguous disks, diamonds, etc. The top layer is comprised of magnetically soft elements located over the cusp regions formed along the undulating edges of the underlying drive layer. For propagation around the disks or diamonds, the bottom drive layer is predominant in determining bubble motion. However, in the area of YO979-020 the cusp regions along the undulating edge defined by the bottom drive layer, the magnetic poles produced by the top drive layer are predominant. These elements in the top drive layer produce potential wells at those locations corresponding to cusps along the undulating edge defined by the contiguous propagation elements in the bottom drive layer, and therefore control bubble motion in the cusp regions. This eliminates a serious problem to satisfactory bubble motion along contiguous propagation element devices. A single level masking fabrication process is described where the top and bottom drive layers can be fabricated through the same mask, and a total chip design is shown which provides all functions required in a complete storage chip. YO979-020
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