11.
    发明专利
    未知

    公开(公告)号:DE60329621D1

    公开(公告)日:2009-11-19

    申请号:DE60329621

    申请日:2003-11-14

    Applicant: IBM

    Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

Patent Agency Ranking