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公开(公告)号：SG11202109828YA
公开(公告)日：2021-10-28
申请号：SG11202109828Y
申请日：2020-03-19
Applicant: IBM
Inventor： HART SEAN , GUMANN PATRYK
IPC: G06N10/00
Abstract: A superconducting coupling device includes a resonator structure. The resonator structure has a first end configured to be coupled to a first device and a second end configured to be coupled to a second device. A gate is positioned proximal to a portion of the resonator structure. The gate is configured to receive a gate voltage and vary a kinetic inductance of the portion of the resonator based upon the gate voltage. The varying of the kinetic inductance induces the resonator structure to vary a strength of coupling between the first superconducting device and the second superconducting device.
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公开(公告)号：MX2021012009A
公开(公告)日：2021-10-22
申请号：MX2021012009
申请日：2020-03-18
Applicant: IBM
Inventor： HART SEAN , GAMBETTA JAY MICHAEL , GUMANN PATRYK
IPC: H01L29/15 , H01L29/16 , H01L29/165 , H01L29/205 , H10N60/01 , H10N60/80 , H10N69/00
Abstract: Un dispositivo de acoplamiento superconductor incluye una estructura de resonador. La estructura de resonador tiene un primer extremo configurado para acoplarse a un primer dispositivo y un segundo extremo configurado para acoplarse a un segundo dispositivo. El dispositivo incluye además un sistema de electrones acoplado a la estructura de resonador y una compuerta colocada proximal a una porción del sistema de electrones. El sistema de electrones y la compuerta se configuran para interrumpir la estructura de resonador en una o más ubicaciones predeterminadas formando un conmutador. La puerta se configura para recibir un voltaje de compuerta y variar una inductancia del sistema de electrones con base en el voltaje de compuerta. La variación de la inductancia induce que la estructura de resonador varíe la fuerza de acoplamiento entre el primer dispositivo y el segundo dispositivo.
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公开(公告)号：CA3143377A1
公开(公告)日：2020-12-30
申请号：CA3143377
申请日：2020-06-23
Applicant: IBM
Inventor： BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
IPC: G06N10/40
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
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公开(公告)号：AU2024202949A1
公开(公告)日：2024-05-23
申请号：AU2024202949
申请日：2024-05-03
Applicant: IBM
Inventor： GUMANN PATRYK , CROSS ANDREW , HART SEAN , GAMBETTA JAY
Abstract: A quantum system comprises a qubit array comprising a plurality of qubits. A bus resonator is coupled between at least one pair of qubits of the plurality of qubits in the qubit array. A switch is coupled between the at least one qubit pair of qubits. The qubit array is part of a plurality of qubit arrays in a first layer and the plurality of qubit arrays of the first layer are each isolated by one or more additional switches.
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公开(公告)号：AU2021417882A9
公开(公告)日：2024-04-18
申请号：AU2021417882
申请日：2021-12-30
Applicant: IBM
Inventor： CHOW JERRY , GUMANN PATRYK
Abstract: Techniques facilitating transfer port systems for cryogenic environments are provided. In one example, an outer vacuum chamber of a cryostat can comprise a sidewall encompassing an inner chamber comprising a sample mounting surface. The sidewall can comprise a feedthrough port providing access to the sample mounting surface from a region external to the outer vacuum chamber.
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Patent Agency Ranking
公开(公告)号：AU2021290959B2
公开(公告)日：2024-02-15
申请号：AU2021290959
申请日：2021-06-15
Applicant: IBM
Inventor： GUMANN PATRYK , CROSS ANDREW , HART SEAN , GAMBETTA JAY
Abstract: A quantum system includes a qubit array comprising a plurality of qubits. A bus resonator is coupled between at least one pair of qubits in the qubit array. A switch is coupled between the at least one qubit pair of qubits.
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公开(公告)号：ES2924845T3
公开(公告)日：2022-10-11
申请号：ES19765712
申请日：2019-09-06
Applicant: IBM
Inventor： GUMANN PATRYK , OLIVADESE SALVATORE
Abstract: Se proporciona una arquitectura y técnicas para fabricar un filtro de microondas criogénico que tiene una resistencia Kapitza reducida. En algunas realizaciones, el filtro de microondas criogénico puede comprender un sustrato y una línea conductora. El sustrato puede estar formado por un material que tenga una propiedad de conductividad térmica que reduzca suficientemente la resistencia Kapitza en el entorno criogénico. La línea conductora se puede formar en un rebaje del sustrato y facilitar una operación de filtro en una señal de microondas propagada en un entorno criogénico. En algunas realizaciones, la línea conductora se puede formar según una técnica de sinterización que puede reducir la resistencia Kapitza. (Traducción automática con Google Translate, sin valor legal)
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18.发明专利
公开(公告)号：AU2020384653A1
公开(公告)日：2022-04-21
申请号：AU2020384653
申请日：2020-11-10
Applicant: IBM
Inventor： HOLMES STEVEN , BEDELL STEPHEN , HART SEAN , SADANA DEVENDRA , LI NING , GUMANN PATRYK
Abstract: A quantum computing device is fabricated by forming, on a superconductor layer (410), a first resist pattern defining a device region and a sensing region within the device region. The superconductor layer within the sensing region is removed, exposing a region of a first surface of an underlying semiconductor layer (340) outside the device region. The exposed region of the semiconductor layer is implanted, forming an isolation region surrounding the device region. The sensing region and a portion of the device of the superconductor layer are exposed. A sensing region contact (202) is formed by coupling the first surface of the semiconductor layer with a first metal layer. A nanorod contact (206, 212) using the first metal within the portion of the device region outside the sensing region is formed. By depositing a second metal layer on a second surface of the semiconductor layer within the sensing region, a tunnel junction gate (204) is formed.
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19.发明专利
公开(公告)号：BR112021025662A2
公开(公告)日：2022-02-08
申请号：BR112021025662
申请日：2020-05-21
Applicant: IBM
Inventor： BOGORIN DANIELA , BRONN NICHOLAS , GUMANN PATRYK , OLIVADESE SALVATORE , HART SEAN
Abstract: interpositor supercondutor para a transmissão de informações quânticas para correção de erro quântico. um sistema para transmissão de informação quântica para correção de erro quântico inclui um chip de ancilla qubit incluindo uma pluralidade de ancilla qubits e um chip de qubit de dados espaçado do chip de ancilla qubit, o chip de qubit de dados incluindo uma pluralidade de qubits de dados. o sistema inclui um intermediário acoplado ao chip ancilla qubit e ao chip de qubit de dados, o intermediário incluindo um material dielétrico e uma pluralidade de estruturas supercondutoras formadas no material dielétrico. as estruturas supercondutoras permitem a transmissão de informações quânticas entre a pluralidade de qubits de dados no chip de qubit de dados e a pluralidade de ancilla qubits no chip de ancilla qubit por meio de fótons virtuais para correção de erro quântico.
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公开(公告)号：AU2020304788A1
公开(公告)日：2021-10-14
申请号：AU2020304788
申请日：2020-06-23
Applicant: IBM
Inventor： BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
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