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公开(公告)号:DE2057843A1
公开(公告)日:1971-07-01
申请号:DE2057843
申请日:1970-11-24
Applicant: IBM
Inventor: REVITZ MARTIN , EDWARD TURENE FRANCIS
IPC: H01L23/482 , H01L23/532 , H01L
Abstract: An inclination sensor provides means for detection of dangerous attitudes of vehicles, such as road and off-road vehicles including farm tractors, earth-moving equipment, and the like, whether caused by negligence on the part of the operator or by accident. The sensor provides a warning signal or automatically controls the vehicle so that it does not upset thereby endangering the life of the operator or others in its vicinity.
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公开(公告)号:CA1238118A
公开(公告)日:1988-06-14
申请号:CA501735
申请日:1986-02-12
Applicant: IBM
Inventor: AHLGREN DAVID C , MA WILLIAM H , REVITZ MARTIN
IPC: H01L21/033 , H01L21/28 , H01L21/314 , H01L21/318 , H01L21/425
Abstract: A method, useful in fabricating semiconductor integrated circuits, for passivating an undercut formed by etch-back of a silicon dioxide layer under a diverse insulator film is disclosed. The method includes the step of coating the device with a thin, conformal film to a thickness sufficient only to line, without refilling, the lateral walls of the undercut region.
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公开(公告)号:DE3171252D1
公开(公告)日:1985-08-08
申请号:DE3171252
申请日:1981-10-29
Applicant: IBM
Inventor: BARTHOLOMEW ROBERT FORBELL , GARBARINO PAUL LOUIS , GARDINER JAMES ROBERT , REVITZ MARTIN , SHEPARD JOSEPH FRANCIS
IPC: H01L21/28 , H01L21/285 , H01L29/78 , H01L21/60
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公开(公告)号:DE3165364D1
公开(公告)日:1984-09-13
申请号:DE3165364
申请日:1981-05-12
Applicant: IBM
Inventor: GARDINER JAMES ROBERT , MAKAREWICZ STANLEY RICHARD , REVITZ MARTIN , SHEPARD JOSEPH FRANCIS
IPC: H01L27/10 , H01L21/28 , H01L21/3213 , H01L21/8242 , H01L23/532 , H01L27/108 , H01L29/43 , H01L29/78 , H01L23/52 , H01L21/90
Abstract: In double polysilicon devices direct shorts between overlying polysilicon conductors (3,7) due to a "polysilicon void phenomenon" are prevented by patterning an appropriate etch stop (5) between the conductors.
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公开(公告)号:CA1115856A
公开(公告)日:1982-01-05
申请号:CA322415
申请日:1979-02-27
Applicant: IBM
Inventor: GARBARINO PAUL L , REVITZ MARTIN , SHEPARD JOSEPH F
IPC: H01L29/78 , H01L21/3105 , H01L21/321 , H01L21/339 , H01L21/8234 , H01L29/762 , H01L21/225
Abstract: In a field effect device such as a charge coupled device or field effect transistor in which at least two levels of polycrystalline silicon conductors are used; these two levels of polycrystalline silicon are isolated from one another with a dielectric layer. Disclosed is a dielectric layer of reflowed phosphosilicate glass (PSG) on top surface of a polycrystalline silicon layer which may be doped by phosphorous impurities diffusing from PSG.
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