公开(公告)号：CA865850A

公开(公告)日：1971-03-09

申请号：CA865850D

Applicant: IBM

Inventor： NEFF GORDON W ,  SAMBUCETTI CARLOS J

公开(公告)号：CA1332885C

公开(公告)日：1994-11-08

申请号：CA581531

申请日：1988-10-27

Applicant: IBM

Inventor： JOHNSON ROBERT W ,  LAWRENCE WILLIAM H ,  LEMON GARY K ,  MAGNUSON ROY H ,  MARKOVICH VOYA R ,  PARSONS RALPH E ,  SAMBUCETTI CARLOS J

IPC: C23C18/18 ,  C23C18/28 ,  C23C18/30 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  C23C18/16

Abstract: A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

公开(公告)号：CA1191745A

公开(公告)日：1985-08-13

申请号：CA428750

申请日：1983-05-24

Applicant: IBM

Inventor： BUPP JAMES R ,  MARKOVICH VOYA ,  NAPP TRACY E ,  SAMBUCETTI CARLOS J

IPC: H05K3/18 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/38

Abstract: CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. The copolymer material contains at least two ionic moieties of a charge opposite from the charge associated with catalyst particles to be subsequently applied prior to the deposition of the conductive metal.

公开(公告)号：CA1175883A

公开(公告)日：1984-10-09

申请号：CA374662

申请日：1981-04-03

Applicant: IBM

Inventor： MITCHELL JOSEPH W ,  SHAFER MERRILL W ,  SAMBUCETTI CARLOS J

IPC: C23C14/08 ,  B41J2/32 ,  B41J2/385 ,  B41J2/395 ,  B41J2/425 ,  C25D7/00 ,  G01D15/06 ,  C25B11/10 ,  C25B11/08

Abstract: YO979-092 ELECTROLYTIC PRINTING ELECTRODE The present invention provides an improved electrode for use in electrolytic printers. The electrode has a region which is an oxide of a metal from the group of ruthenium, iridium, platinum or an alloy thereof. The oxide region is at the extremity of the electrode which during the printing is in close proximity to the printing medium. This oxide region provides an increase in wear resistance of about two orders of magnitude over non-oxidized electrodes. Method for fabricating the described electrode is also set forth.

公开(公告)号：CA1152934A

公开(公告)日：1983-08-30

申请号：CA347654

申请日：1980-03-14

Applicant: IBM

Inventor： SAMBUCETTI CARLOS J

IPC: C09K9/00 ,  B41M3/06 ,  B41M5/20 ,  C09D11/00 ,  C09D11/02 ,  G01D15/34 ,  G02F1/15

Abstract: ELECTROCHROMIC PRINTING SYSTEM An improved electrolytic print fluid is described. The printing fluid is comprised of a bromide agent for the catalyzation of the electro-oxidation of a color forming iodide agent therein. The fluid may include an agent which can form a clathrate complex with the color forming agent, as well as an agent which prevents discoloring of the paper when said fluid is coated on the same. The coated paper is subjected to an electrolytic print method using non-consumable electrode. YO9-78-061

公开(公告)号：GB2365622A

公开(公告)日：2002-02-20

申请号：GB0103577

申请日：2001-02-14

Applicant: IBM

Inventor： SAMBUCETTI CARLOS J ,  EDELSTEIN DANIEL C ,  GAUDIELLO JOHN G ,  RUBINO JUDITH M ,  WALKER GEORGE

IPC: H05K3/34 ,  C23C18/16 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K13/06

Abstract: A copper pad surface 14 of an IC chip is first prepared, e.g. cleaned by an acid solution, a protection layer 16 of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer 18 of a noble metal is deposited on top of the protection layer. The protection layer 16 may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co- W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B. A suitable thickness for the protection layer is between about 1,000 Ñ and about 10,000 Ñ, and preferably between about 3,000 Ñ and about 7,000 Ñ. The adhesion layer 18 can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Ñ and about 4,000 Ñ, and preferably between about 1,000 Ñ and about 2,000 Ñ. A nucleation layer of Pd may be deposited between the copper conductive pad surface 14 and the protection layer 16 prior to the electroless deposition of the protection layer. An additional noble metal layer may be deposited on top of the adhesion layer 18 by an electroless Au deposition process to increase the thickness of the final noble metal layer to about 2,000 Ñ 12,000 Ñ, and preferably between about 4,000 Ñ and about 6,000 Ñ. The pad is suitable for a wireband or solder bump connection

公开(公告)号：FR2382486A1

公开(公告)日：1978-09-29

申请号：FR7803455

申请日：1978-02-01

Applicant: IBM

Inventor： KOVAC ZLATA ,  SAMBUCETTI CARLOS J

IPC: C09D11/00 ,  C09C1/24 ,  C09D5/23 ,  H01F1/44 ,  H01F41/16 ,  H01F1/00

Abstract: Water based magnetic colloidal fluids, useable as inks, when prepared by coating chemically precipitated magnetite (Fe3O4) with an adsorption site providing coating agent including certain organic anions, such as sulfates, sulfonates or amino carboxilates, and then dispersing the coated product with non-ionic, anionic or cationic surfactants may exhibit selectably cationic, anionic or non-ionic charge responsiveness.

公开(公告)号：DE2260526A1

公开(公告)日：1973-07-12

申请号：DE2260526

申请日：1972-12-11

Applicant: IBM

Inventor： AMROSIA ALPHONSE ,  SAMBUCETTI CARLOS J

IPC: B41M5/20 ,  G03G17/02 ,  B41M5/00

Abstract: 1369528 Electrolytic recording medium INTERNATIONAL BUSINESS MACHINES CORP 4 Dec 1972 [20 Dec 1971] 55851/72 Heading D2B An electrolytic recording medium comprises a porous medium e.g. paper impregnated with an aqueous solution of NH 4 , Li, Na, or KF. A reducing agent e.g. ascorbic acid, stannous chloride, stannous sulfate, KOH, p-amino phenol, phenylhydrazine, or metal may be included, optionally with a stabilizer e.g. sodium sulfite.

公开(公告)号：CA868011A

公开(公告)日：1971-04-06

申请号：CA868011D

Applicant: IBM

Inventor： DERR DONALD B ,  NEFF GORDON W ,  SAMBUCETTI CARLOS J

公开(公告)号：MY119885A

公开(公告)日：2005-07-29

申请号：MYPI20010427

申请日：2001-01-31

Applicant: IBM

Inventor： SAMBUCETTI CARLOS J ,  EDELSTEIN DANIEL C ,  GAUDIELLO JOHN G ,  RUBINO JUDITH M ,  WALKER GEORGE

IPC: B32B15/00 ,  H05K3/34 ,  B05D5/12 ,  C23C18/16 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K13/06

Abstract: A METHOD FOR PREPARING A COPPER PAD SURFACE FOR ELECTRICAL CONNECTION THAT HAS SUPERIOR DIFFUSION BARRIER AND ADHESION PROPERTIES IS PROVIDED. IN THE METHOD, A COPPER PAD SURFACE (14) IS FIRST PROVIDED THAT HAS BEEN CLEANED BY AN ACID SOLUTION, A PROTECTION LAYER (16) OF A PHOSPHORUS OR BORON-CONTAINING METAL ALLOY IS THEN DEPOSITED ON THE COPPER PAD SURFACE, AND THEN AN ADHESION LAYER (18) OF A NOBLE METAL IS DEPOSITED ON TOP OF THE PROTECTION LAYER. THE PROTECTION LAYER MAY BE A SINGLE LAYER, OR TWO OR MORE LAYERS INTIMATELY JOINED TOGETHER FORMED OF A PHOSPHORUS OR BORON-CONTAINING METAL ALLOY SUCH AS NI-P, CO-P, CO-W-P, CO-SN-P, NI-W-P, CO-B, NI-B, CO-SN-B, CO-W-B AND NI-W-B TO A THICKNESS BETWEEN ABOUT 1,000 Å AND ABOUT 10,000 Å. THE ADHESION LAYER CAN BE FORMED OF A NOBLE METAL SUCH AS AU, PT, PD AND AG TO A THICKNESS BETWEEN ABOUT 500 Å AND ABOUT 4,000 Å.