公开(公告)号：CA2743110C

公开(公告)日：2018-10-16

申请号：CA2743110

申请日：2010-05-11

Applicant: IBM

Inventor： SIMONS ROBERT ,  CAMPBELL LEVI ,  CHU RICHARD ,  IYENGAR MADHUSUDAN ,  ELLSWORTH MICHAEL

IPC: H05K7/20

Abstract: Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.

公开(公告)号：DE112012004136T5

公开(公告)日：2014-06-26

申请号：DE112012004136

申请日：2012-10-23

Applicant: IBM

Inventor： SIMONS ROBERT ,  ELLSWORTH MICHAEL ,  CAMPBELL LEVI ,  DAVID MILNES PAUL ,  IYENGAR MADHUSUDAN ,  CHU RICHARD

IPC: G06F1/20 ,  H01L23/34 ,  H01L23/46 ,  H01L23/473 ,  H05K7/20

Abstract: Es wird eine Kühleinheit (500) bereitgestellt, die Kühlung eines Kühlmittels ermöglicht, das durch einen Kühlmittelkreislauf (501) hindurchfließt. Die Kühleinheit (500) weist eine oder mehrere Wärmeabführeinheiten (510a, 510b) und einen erhöht angeordneten Kühlmittelbehälter (520) auf. Die Wärmeabführeinheiten (510a, 510b) führen Wärme von dem Kühlmittel, das durch den Kühlmittelkreislauf (501) hindurchfließt, und dabei durch die Wärmeabführeinheiten (510a, 510b) hindurchfließt, an die Luft ab. Die Wärmeabführeinheit (510a, 510b) weist eine oder mehrere Wärmetauscherbaugruppen (600) auf, die mit dem Kühlmittelkreislauf (501) verbunden sind, so dass wenigstens ein Teil des Kühlmittels durch die eine oder die mehreren Wärmetauscherbaugruppen (600) hindurchfließen kann. Der erhöht angeordnete Kühlmittelbehälter (520), der über wenigstens einem Abschnitt des Kühlmittelkreislaufes (501) erhöht angeordnet ist, ist mittels Flüssigkeitsübertragung mit der einen oder den mehreren Wärmetauscherbaugruppen (600) der Wärmeabführeinheit (510a, 510b) verbunden und ermöglicht Rückführen von Kühlmittel an den Kühlmittelkreislauf (501) bei einem im Wesentlichen konstanten Druck.

公开(公告)号：GB2496251B

公开(公告)日：2014-06-11

申请号：GB201216992

申请日：2012-09-24

Applicant: IBM

Inventor： IYENGAR MADHUSUDAN ,  SIMONS ROBERT

IPC: H05K7/20

Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

公开(公告)号：GB2497191B

公开(公告)日：2014-02-26

申请号：GB201221080

申请日：2012-11-23

Applicant: IBM

Inventor： ELLSWORTH MICHAEL ,  CHU RICHARD ,  SIMONS ROBERT ,  CAMPBELL LEVI ,  IYENGAR MADHUSUDAN ,  MILNES DAVID PAUL

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/02

Abstract: A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

公开(公告)号：GB2500966A

公开(公告)日：2013-10-09

申请号：GB201301549

申请日：2013-01-29

Applicant: IBM

Inventor： PARIDA PRITISH RANJAN ,  CHAINER TIMOTHY JOSEPH ,  IYENGAR MADHUSUDAN ,  MILNES DAVID PAUL ,  SIMONS ROBERT

IPC: G06F1/20 ,  F24F11/00 ,  F24F11/02 ,  G05D23/19 ,  H05K7/20

Abstract: A cooling system such as an intra-rack cooling system 500 of a data centre comprises: one or more nodes, such as servers 300, each node having at least one temperature sensor to monitor a temperature of the node components; an air-to-liquid heat exchanger 402 configured to accept a liquid coolant input, preferably via a first shut-off valve 504, to provide cooled air to the one or more nodes; and a temperature sensor to monitor a temperature of air Tai provided by the heat exchanger. The cooling system also comprises a direct liquid cooling apparatus to provide liquid coolant to components of the one or more nodes, preferably an inlet plenum 404, i.e. manifold, and an outlet plenum 406. The apparatus supplies cold input coolant 412, preferably via a second shut-off valve 506, to the one or more nodes and ejects warm coolant 410. A valve, ideally a three-way valve 502, is configured to control a proportion of the coolant flow directed to the heat exchanger and the one or more nodes based upon the monitored temperatures. A flow rate of coolant is also controlled based upon the monitored temperatures, preferably by varying the pump strength of a pump 401.

公开(公告)号：GB2497191A

公开(公告)日：2013-06-05

申请号：GB201221080

申请日：2012-11-23

Applicant: IBM

Inventor： ELLSWORTH MICHAEL ,  CHU RICHARD ,  SIMONS ROBERT ,  CAMPBELL LEVI ,  IYENGAR MADHUSUDAN ,  MILNES DAVID PAUL

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/02

Abstract: Cooling apparatus associated with one or more electronic racks 910 in a data center 900 includes a coolant-cooled heat exchanger 920, such as a door mounted air-to-liquid heat exchanger for facilitating dissipation of heat generated within the electronics rack 910, and a coolant control apparatus 930. The coolant control apparatus includes at least one coolant recirculation conduit 931 coupled in fluid communication between a facility coolant supply conduit 921 and return conduit 922, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) 932 associated with the recirculation conduits and a controller 935 which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a room dew point temperature. The coolant control apparatus may be shared between multiple electronics racks (Figs. 9 A and B) or separate coolant control apparatus may be associated with each electronics rack (See Fig. 10).

公开(公告)号：DE602005005859T2

公开(公告)日：2009-05-20

申请号：DE602005005859

申请日：2005-12-07

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

IPC: H05K7/20 ,  F25D23/12 ,  H01L23/473

Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.

公开(公告)号：DE2231597A1

公开(公告)日：1973-01-18

申请号：DE2231597

申请日：1972-06-28

Applicant: IBM

Inventor： AAKALU NANDA KUMAR G ,  CHU RICHARD C ,  SIMONS ROBERT

IPC: H01L23/427 ,  H05K7/20 ,  F28D5/00

公开(公告)号：GB2509675B

公开(公告)日：2014-12-10

申请号：GB201407967

申请日：2012-10-25

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  DAVID MILNES P ,  ELLSWORTH MICHAEL ,  MCKEEVER ERIC ,  SIMONS ROBERT ,  IYENGAR MADHUSUDAN

IPC: H05K7/20

公开(公告)号：GB2509675A

公开(公告)日：2014-07-09

申请号：GB201407967

申请日：2012-10-25

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  DAVID MILNES P ,  ELLSWORTH MICHAEL ,  MCKEEVER ERIC ,  SIMONS ROBERT ,  IYENGAR MADHUSUDAN

IPC: H05K7/20

Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant- cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.