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公开(公告)号:DE3064833D1
公开(公告)日:1983-10-20
申请号:DE3064833
申请日:1980-09-25
Applicant: IBM
Inventor: HOVEL HAROLD JOHN , WOODALL JERRY MCPHERSON
IPC: H01L21/28 , H01L21/285 , H01L21/338 , H01L29/45 , H01L29/47 , H01L29/80 , H01L29/812 , H01L29/872
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公开(公告)号:AU7671881A
公开(公告)日:1982-05-13
申请号:AU7671881
申请日:1981-10-22
Applicant: IBM
Inventor: LANZA CONRAD , WOODALL JERRY MCPHERSON
IPC: H01L31/14 , H01L31/153 , H01L33/00
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公开(公告)号:DE3278605D1
公开(公告)日:1988-07-07
申请号:DE3278605
申请日:1982-10-14
Applicant: IBM
Inventor: CHAPPELL BARBARA ALANE , CHAPPELL TERRY IVAN , WOODALL JERRY MCPHERSON
IPC: H01L29/80 , H01L21/3063 , H01L21/331 , H01L21/338 , H01L27/08 , H01L29/10 , H01L29/205 , H01L29/267 , H01L29/73 , H01L29/812 , H01L29/861 , H01L29/72
Abstract: An intermediate structure for use in the manufacture of semiconductor devices such as field effect transistors, comprises a monocrystalline semiconductor body having a first outer layer (2), a central layer (3) and a second outer layer (4) each of said first and second outer layers being of semiconductor material different from the semiconductor material of the central layer and forming a heterojunction (5, 6) whith the central layer. The thickness of the central layer (3) is of the order of the transport length of a charge carrier in the semiconductor material of that layer. Preferably, at least two adjacent layers of the intermediate structure have substantially equal electron energy work functions. … A vertical field effect transistor is formed in a portion of an intermediate structure by removing areas (30, 31) of the second outer and central layers (4, 3) on each side of the portion, removing an area (32) of the second outer layer (4) at one end of the portion, etching the central layer (3) to form a web (22) connecting the first and second outer layers (2, 4), forming insulation (25, 27) on the exposed surfaces of the first and second outer layers (2, 4), forming a Schottky barrier electrode (23, 24) on the web and providing electrical contacts (35) to the first and second outer layers.
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公开(公告)号:IT1149988B
公开(公告)日:1986-12-10
申请号:IT2302380
申请日:1980-06-26
Applicant: IBM
Inventor: HOVEL HAROLD JOHN , WOODALL JERRY MCPHERSON
IPC: H01L31/04 , H01L31/0216 , H01L
Abstract: Surface recombination in solar cells that is produced by band bending at the surface of the semiconductor which is in turn caused by defect states which pin the Fermi level at the surface, may be improved by applying a surface layer which may be a plasma oxide that has been hydrogen annealed and this layer may also be useful as an antireflecting coating.
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公开(公告)号:DE3167275D1
公开(公告)日:1985-01-03
申请号:DE3167275
申请日:1981-04-10
Applicant: IBM
Inventor: CUOMO JEROME JOHN , DREYFUS RUSSELL WARREN , WOODALL JERRY MCPHERSON
Abstract: A high brightness, essentially monoenergetic electron source is constructed in solid state material by providing a semiconductor body with an electron confinement barrier over most of the surface, the barrier having a relatively small opening exposing the semiconductor body, in the relatively small opening a material is placed in contact with the semiconductor body that has a work function that is lower than the energy of excited electrons in the semiconductor. In this structure electrons from hole-electron pairs generated in the semiconductor are repelled and recombination is inhibited by the barrier except in the relatively small opening where they are injected into the surrounding environment through the lower work function material. The hole-electron pair generation may be by irradiation or by electrical injection. The electron source is useful for such applications as high brightness sources, digital communications, cathode ray tube electron sources and scanning electron microscopes.
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公开(公告)号:DE3166902D1
公开(公告)日:1984-12-06
申请号:DE3166902
申请日:1981-03-31
Applicant: IBM
Inventor: HODGSON RODNEY TREVOR , PETTIT GEORGE DAVID , SEDGWICK THOMAS OLIVER , WOODALL JERRY MCPHERSON
IPC: H01L21/324 , H01L21/314 , H01L21/428 , H01L23/29 , H01L23/31 , H01L23/28
Abstract: A group II-VI compound semiconductor (16) is used as a surface passivator to control recombination of charge carriers at the surface of a group III-V compound semiconductor (12, 14) by a localized heating step. Control of the recombination of the charge carriers is achieved by chemical reaction of the II-VI compound with excess group V element. In particular, a capping layer (16) of laser annealed ZnS is used for passivating a GaAs device (12, 14).
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公开(公告)号:DE3163454D1
公开(公告)日:1984-06-14
申请号:DE3163454
申请日:1981-02-25
Applicant: IBM
Inventor: RUPPRECHT HANS STEPHAN , WOODALL JERRY MCPHERSON
IPC: H01L21/265 , H01L21/324
Abstract: Thermal decomposition is reduced and stoichiometry retained during annealing of a multiple element intermetallic semiconductor material by heating it in an environment with an excess of the most volatile constituent, in particular, when annealing a Si implanted GaAs wafer (58) while in proximity to InAs (50).
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