公开(公告)号：DE102006009540A1

公开(公告)日：2007-02-08

申请号：DE102006009540

申请日：2006-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  NOCKE KERSTIN ,  GRASSME OLIVER ,  BENDER CARSTEN ,  PARK SOO GIL ,  PFEIFFER FRANK

IPC: H01L23/14 ,  H01L23/48

公开(公告)号：DE102005001590A1

公开(公告)日：2006-07-20

申请号：DE102005001590

申请日：2005-01-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  BENDER CARSTEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA MINKA ,  SAVIGNAC DOMINIQUE

IPC: H01L23/50 ,  H01L25/065

Abstract: Package has a silicon chip, fixed with its active side to a substrate (12), including a core having copper wires (15.1, 15.2) on both sides. Build-up layers (16.1, 16.2) with copper wire (17.1, 17.2) are found on the copper wires (15.1, 15.2). Build-up layers are structured on ball side by pressure and back etching process, so that the copper wires (17.1, 17.2) on the substrate is directly accessible in canal for wire bonds.

公开(公告)号：DE10341206A1

公开(公告)日：2005-04-14

申请号：DE10341206

申请日：2003-09-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN

IPC: H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  H01L23/50

Abstract: Appliance for improving reliability of BGA solder connections between substrate (1) of BGA-component, whose contact pads (7) are fitted with solder balls or bumps (2) in asymmetric layout, and contacts of circuit board (5).Selected contact pads on substrate and/or contact faces (4) on circuit board and/or solder ball or bumps (9) of each BGA component have larger dimensions. Preferably larger contacts or solder balls or bumps (7-9) are fitted in corner positions of ball layout, with layout containing at least one larger solder ball or bump, with larger solder balls etc. located in possible increased stress.