公开(公告)号：DE10310842A1

公开(公告)日：2004-09-30

申请号：DE10310842

申请日：2003-03-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAGEN ROBERT ,  JEREBIC SIMON

IPC: H01L21/56 ,  H01L23/31 ,  H01L29/06 ,  H01L23/28 ,  H01L23/04

Abstract: The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.

公开(公告)号：DE102004009742B4

公开(公告)日：2010-03-04

申请号：DE102004009742

申请日：2004-02-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  VILSMEIER HERMANN ,  GROENINGER HORST ,  BAUER MICHAEL

IPC: H01L21/301 ,  H01L21/78

公开(公告)号：DE502005006946D1

公开(公告)日：2009-05-07

申请号：DE502005006946

申请日：2005-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  BEMMERL THOMAS ,  FUERGUT EDWARD ,  JEREBIC SIMON ,  VILSMEIER HERMANN

IPC: H05K13/00 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H05K3/22 ,  H05K3/34

Abstract: A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.

公开(公告)号：DE10310842B4

公开(公告)日：2007-04-05

申请号：DE10310842

申请日：2003-03-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAGEN ROBERT ,  JEREBIC SIMON

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/04 ,  H01L23/31 ,  H01L29/06

Abstract: The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.

公开(公告)号：DE102005005749A1

公开(公告)日：2006-08-17

申请号：DE102005005749

申请日：2005-02-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JEREBIC SIMON ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD

IPC: H01L23/488 ,  H01L23/50

Abstract: The component has surface-mountable external contacts (1) arranged on external contact connecting surfaces in its lower side. The connecting surfaces consist of a recess in its respective middle area, where the recess consists of a dovetail profile. Surface extension of the recess is smaller than a maximum cross section of external contacts. The recess has a circular form edges in the connecting surfaces. An independent claim is also included for a method for manufacturing a semiconductor component.

公开(公告)号：DE10340129B4

公开(公告)日：2006-07-13

申请号：DE10340129

申请日：2003-08-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  WOERNER HOLGER ,  FUERGUT EDWARD ,  POHL JENS ,  STROBEL PETER ,  JEREBIC SIMON ,  HAGEN ROBERT

IPC: H01L23/50 ,  H01L21/50 ,  H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Semiconductor chip (3) has rear (4), sides (5,7) and contact faces (9) on active top side (10). Module body is card-shaped, containing chip and plastics mass (12), in which chip rear and sides are embbeded, with card forming combined surface (13) of plastics and chip top side.On combined surface are fitted plug contacts (2) linked to chip contact faces by wiring lines (14) of single wiring layer (16) on combined surface. Insulating cover film (17) is deposited on contact faces, leaving plug contacts exposed. Independent claims are included for wafer manufacturing utensil and its production and for manufacture of electronic module.

公开(公告)号：DE102005021653A1

公开(公告)日：2006-07-13

申请号：DE102005021653

申请日：2005-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL ,  ESCHER-POEPPEL IRMGARD

IPC: H01L21/58 ,  H01L21/60

Abstract: Surface mounted semiconductor components (1) comprises plastics housing (2) and solder balls (3) as outer contacts (4) on its underside (5), which contains layer (6) of soft solder (7) in edge region (8) of semiconductor component underside.Preferably, soft solder layer is mounting spacer of solder balls of component during its fitting on circuit board. Typically, soft solder layer is shaped like through ring (9) surrounding solder balls. Independent claims are included for circuit board and manufacturing method of surface mounted semiconductor component.

公开(公告)号：DE102004058876B3

公开(公告)日：2006-05-24

申请号：DE102004058876

申请日：2004-12-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  VILSMEIER HERMANN ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L21/58

Abstract: The method involves applying a supporting and a transporting foil on an adhesive layer (1) applied on rear side of semiconductor chips (2). A protective foil is removed from an active top side (8) of the chips. The coated semiconductor chips with the adhesive layer are taken off from a non-hardened adhesive (10) of the foil under forcing a bond bridge (4) of a semiconductor wafer material along separation slots.

公开(公告)号：DE102004054147A1

公开(公告)日：2006-02-23

申请号：DE102004054147

申请日：2004-11-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  JEREBIC SIMON

IPC: H01L21/304 ,  H01L21/58 ,  H01L21/78

Abstract: The semi conductor chips [2] are first located on a protective foil and an adhesive foil [4] placed in position together with a transport foil [9]. The adhesive is of a type that can be hardened by exposure to radiation. The gap [11] between the chips is not hardened and allows separation of the individual chips.

公开(公告)号：DE102004022884A1

公开(公告)日：2005-12-08

申请号：DE102004022884

申请日：2004-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FUERGUT EDWARD ,  WOERNER HOLGER ,  JEREBIC SIMON ,  BAUER MICHAEL

IPC: H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/50