公开(公告)号：DE102005003390A1

公开(公告)日：2006-07-27

申请号：DE102005003390

申请日：2005-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  KAHLISCH KNUT ,  WAHRMUND WIELAND

IPC: H01L23/16 ,  H01L23/13 ,  H01L23/31 ,  H01L23/32

Abstract: The substrate has a chip side accommodating a semiconductor chip, and a solder ball side applying solder balls on ball pads. A bond channel (15) is designed as opening between the chip and ball sides for arranging wire straps (11) on the ball side. The channel is lockable with a housing part consisting of a sealing compound. Form closure units for the compound are arranged in the area, in which the part is formed, of the substrate.

公开(公告)号：DE102004029765A1

公开(公告)日：2006-03-16

申请号：DE102004029765

申请日：2004-06-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  KROEHNERT STEFFEN ,  BENDER CARSTEN

IPC: H01L23/04 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

公开(公告)号：DE102004029587A1

公开(公告)日：2006-01-19

申请号：DE102004029587

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  LEGEN ANTON ,  KROEHNERT STEFFEN

IPC: H01L23/04

Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.

公开(公告)号：DE102004029585A1

公开(公告)日：2006-01-19

申请号：DE102004029585

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  NOCKE KERSTIN ,  BENDER CARSTEN ,  KROEHNERT STEFFEN

IPC: H01L21/48 ,  H01L23/053 ,  H01L23/12

Abstract: Chip package comprises a reinforcing layer (2) fixed to a system carrier (1). The reinforcing layer has openings (3) for the chip, in which the openings are as large as the dimensions of the chips. Each chip is surrounded by a reinforced frame and is embedded in the cavity produced.

公开(公告)号：MY134343A

公开(公告)日：2007-12-31

申请号：MYPI20024274

申请日：2002-11-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DOBRITZ STEPHAN ,  KAHLISCH KNUT ,  KROEHNERT STEFFEN

IPC: H01L23/50 ,  B23K31/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/495

Abstract: THE INVENTION PROPOSES A LEADFRAME OF A CONDUCTIVE MATERIAL, HAVING A CENTRAL REGION (14) TO ACCOMMODATE A CHIP, AND A PLURALITY OF CONNECTING FINGERS (12) WHICH EXTEND AT LEAST FROM ONE SIDE IN THE DIRECTION OF THE CENTRAL REGION (14), A CONTACT REGION (34) BEING PROVIDED ADJACENT TO THE CENTRAL REGION (14) ON AT LEAST SOME OF THE CONNECTING FINGERS (12). THE COURSE OF THE CONNECTING FINGERS IS IN THIS CASE SUCH THAT THE SECTIONAL FACE IN AN ARBITRARY IMAGINARY CROSS SECTION AT RIGHT ANGLES TO THE MAIN FACE OF THE LEADFRAME (10) HAS LEADFRAME MATERIAL. IN THIS CASE, IT IS ATTEMPTED TO KEEP CROSS SECTIONS IN A COMPONENT WITHOUT LEADFRAME MATERIAL AS SMALL AS POSSIBLE.

公开(公告)号：DE102005002862A1

公开(公告)日：2006-07-27

申请号：DE102005002862

申请日：2005-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  KAHLISCH KNUT ,  UHLMANN RUEDIGER ,  BENDER CARSTEN

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/498

Abstract: The method involves mounting a semiconductor chip on a chip side of a substrate, and applying solder balls on a solder ball side of the substrate. A lower grouting form (16) is pressed for detection of lower housing part on the ball side. The substrate surface is designed as sealing area on the ball side such that the surface is provided with sealing units, with which the grouting form receives a sealing connection. An independent claim is also included for a substrate for manufacturing of a fine ball grid array component.

公开(公告)号：DE10325029B4

公开(公告)日：2005-06-23

申请号：DE10325029

申请日：2003-06-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  HAIMERL ALFRED ,  KROEHNERT STEFFEN

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/10 ,  H01L23/16 ,  H01L23/28 ,  H01L23/50

Abstract: The invention relates to a substrate-based chip package, comprising a substrate on which a chip is fastened by a die-attach material. The substrate is provided with a solder resist (on both sides) and, on the side that is opposite from the chip, has conductor tracks which are provided with solder balls and are connected to the chip by means of wire bridges which extend through a bonding channel which is sealed with a glob top. The chip and the substrate on the chip side being encapsulated by a molded cap.