公开(公告)号：DE102005002812A1

公开(公告)日：2006-08-03

申请号：DE102005002812

申请日：2005-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LUCKNER UWE ,  ERNST GEORG ,  CARMONA MANUEL ,  FINK MARKUS

IPC: H01L23/34 ,  F28F21/08 ,  G06F1/20 ,  G11C7/04 ,  H01L23/40 ,  H05K7/20

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

公开(公告)号：DE102004029765A1

公开(公告)日：2006-03-16

申请号：DE102004029765

申请日：2004-06-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  KROEHNERT STEFFEN ,  BENDER CARSTEN

IPC: H01L23/04 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

公开(公告)号：DE102004031889A1

公开(公告)日：2006-01-26

申请号：DE102004031889

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/427

公开(公告)号：DE102004031888A1

公开(公告)日：2005-10-20

申请号：DE102004031888

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34

Abstract: Semiconductor component with outer contacts (1) in the form of solder beads (2) including a housing with a semiconductor chip (3) and a wiring substrate (8), with the chip on its upper side and the solder beads on its lower side, where at least one of the solder beads is fixed to a flexible membrane (3), which covers an opening (4) with a suspended membrane region (5) and the flat extent of membrane region (5) is greater than the diameter of the solder bead fixed on it. An independent claim is included for production of the component as described above.

公开(公告)号：DE102005015036A1

公开(公告)日：2006-02-16

申请号：DE102005015036

申请日：2005-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  GRAFE JUERGEN ,  LEGEN ANTON ,  CARMONA MANUEL

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/50

Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

公开(公告)号：DE102004029586A1

公开(公告)日：2006-01-12

申请号：DE102004029586

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  NOCKE KERSTIN

IPC: H01L23/04

Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

公开(公告)号：DE102004029584A1

公开(公告)日：2006-01-12

申请号：DE102004029584

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  BENDER CARSTEN

IPC: H01L21/44 ,  H01L23/04 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/28 ,  H05K3/34

Abstract: An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.