公开(公告)号：DE102004003275A1

公开(公告)日：2005-08-25

申请号：DE102004003275

申请日：2004-01-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEGEN ANTON ,  THOMAS JOCHEN ,  WENNEMUTH INGO

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01R12/50 ,  H01R12/02

Abstract: A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.

公开(公告)号：DE102004037610B3

公开(公告)日：2006-03-16

申请号：DE102004037610

申请日：2004-08-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  LEGEN ANTON

IPC: H01L21/58 ,  H01L23/13

Abstract: The method involves planning a flexible intermediate layer (5) on an integrated circuit (1) and or a substrate (10). The flexible layer (5) is structured in raised and lower ranges (5a, 5b). The ranges are structured in such a manner that they have a variable width. The substrate and the integrated circuit are connected by the structured flexible intermediate layer (5). The width of the raised ranges (5a) is selected in such a manner, that it decreases on the basis of a center line CL of the integrated circuit (1) to the edge. The connection directly takes place directly, or indirectly by providing a glue layer (15) lying between them. An independent claim is included for a switching configuration with an integrated circuit and with a substrate.

公开(公告)号：DE102004029765A1

公开(公告)日：2006-03-16

申请号：DE102004029765

申请日：2004-06-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REISS MARTIN ,  LEGEN ANTON ,  CARMONA MANUEL ,  KROEHNERT STEFFEN ,  BENDER CARSTEN

IPC: H01L23/04 ,  H01L23/02 ,  H01L23/13 ,  H01L23/498

Abstract: A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.

公开(公告)号：DE102004031889A1

公开(公告)日：2006-01-26

申请号：DE102004031889

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/427

公开(公告)号：DE102004029587A1

公开(公告)日：2006-01-19

申请号：DE102004029587

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  LEGEN ANTON ,  KROEHNERT STEFFEN

IPC: H01L23/04

Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.

公开(公告)号：DE102004031888A1

公开(公告)日：2005-10-20

申请号：DE102004031888

申请日：2004-06-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： CARMONA MANUEL ,  LEGEN ANTON ,  WENNEMUTH INGO

IPC: H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34

Abstract: Semiconductor component with outer contacts (1) in the form of solder beads (2) including a housing with a semiconductor chip (3) and a wiring substrate (8), with the chip on its upper side and the solder beads on its lower side, where at least one of the solder beads is fixed to a flexible membrane (3), which covers an opening (4) with a suspended membrane region (5) and the flat extent of membrane region (5) is greater than the diameter of the solder bead fixed on it. An independent claim is included for production of the component as described above.

公开(公告)号：DE10259221A1

公开(公告)日：2004-07-15

申请号：DE10259221

申请日：2002-12-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  HETZEL WOLFGANG ,  LEGEN ANTON

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/50 ,  H01L21/50

Abstract: An electronic component comprises a semiconductor chip stack (3,4) on a wiring substrate (11) having external contacts (12). Between the chips is a wiring layer (7) having a through opening (8) and contact regions (9,10). Connections are made through the opening and there is a plastic housing (18,19) for the component. An Independent claim is also included for a production process for the above.