Abstract:
PROBLEM TO BE SOLVED: To reduce nonconforming action caused by overcoupling among the adjacent lines in a memory matrix, comprising a cell field composed of row lines and column lines in which the memory elements are situated at each point, where the row lines and column lines intersect one another, and the column line and/or row lines of the cell field are placed adjacent to each other. SOLUTION: This memory matrix is constituted, such that the order of row lines or column lines are equal in the edges of the memory matrix counterposed to each other regarding changes in the configurational constitution of the lines. As a result of this, additional circuit cost for executing address decoding, namely an additional circuit cost generated when an address line is not assigned correspondingly or it has a different order from the original order is avoided. For the case of MRAM, the connection constitution of the row lines and column lines in both edges of a cell field becomes advantageous. Furthermore, the cell field or its row lines and/or column line is made symmetrical by a mirror image, regarding changes in their arrangement constitution.
Abstract:
PROBLEM TO BE SOLVED: To provide an operation method for integrated memory in which attenuation or damage of information stored in a memory cell is prevented. SOLUTION: Colum lines and substrate lines connected to a selected memory cell have an initial potential before being accessed, and activate row lines connected to the selected memory cell during one access, thereby, switch a selection transistor of the selected memory cell to be in a conduction state, apply a potential being different from a potential of a column line to the substrate line, evaluate and amplify potentials applied to the column lines at a first point of time, successively, apply the initial potential to the substrate line at a second point of time, successively, apply the initial potential to column lines at a third point of time. The first point of time, the second point of time, and the third point of time are selected so that a memory capacitor of the selected memory cell is charged and discharged by the same quantity every time.
Abstract:
PROBLEM TO BE SOLVED: To prevent change of memory contents caused by faulty voltage by connecting a column line and a charging line to a connection terminal 22 of a common power feeding potential GND in a non-active operation mode and in a common read-out amplifier or a driver circuit. SOLUTION: This integrated semiconductor memory is provided with a memory cell field having a ferroelectric memory effect memory cell MC, row lines WL1, and column lines BL1, the memory cell is inserted between one column line and a charging line PL1, the column line is connected to a read-out amplifier 2 from which an output signal S21 is taken, the charging line is connected to the driver circuit 3 connecting the amplifier 2 to a potential V1 and GND. and the column line and the charging line have an activation or a non-activation mode.
Abstract:
PROBLEM TO BE SOLVED: To reduce power consumption under an area required for column selection line path by connecting each bit line to a sense amplifier to which a bit line belongs through a first switching element, and connecting each bit line to a standby potential through a second switching element. SOLUTION: All column selection lines LCSLK takes a low potential so far as any column is not selected out of plural columns. Consequently, a first transistor A is made non-conduction state, and a second transistor B is conducted. Therefore, bit lines BL , bBL at the edge of cellfield AR are decoupled to a sense amplifier SA, and are in a standby potential VSTB. Consequently, a selection transistor T of a memory cell MC is made a non- conduction state. Thereby, contents of a memory of the memory cell MC is not affected at the time of access.
Abstract:
A semiconductor memory, in particular a ferroelectric semiconductor memory, has a differential write/read amplifier which is connected, via transfer transistors, to a bit line pair. The bit line pair includes a bit line and a corresponding reference bit line. The differential write/read amplifier is for reading data from and writing data to the memory capacitor (MC). In order to improve the accuracy of the bit line reference voltage, a main reference bit line is connected, via a charge switching element, to a reference voltage. At least one further reference bit line is connected to the main reference bit line via an equalization switching element for charge equalization between the reference bit lines.
Abstract:
A method for reducing noise coupling in a memory array is disclosed. The memory array includes a plurality memory cells interconnected by wordlines, bitlines, and platelines. The memory cells are arranged in columns having first and second bitlines coupled to a sense amplifier. During a memory access, at least adjacent bitlines pairs are not activated. The selected bitline pair or pairs are provided with a plateline pulse.
Abstract:
A test circuit for testing differential read signals during a memory access is disclosed. The test circuit is coupled to a pair of bitlines. During a read access, a selected memory cell produces a differential read signal on the bitlines. When the test circuit is activated, the magnitude of the differential read signal is varied. This enables easy testing of read signal margins in, for example, memory ICs.
Abstract:
A redundancy unit (204) comprising first (260) and second (270) fuse blocks for programming the redundancy element (220) is disclosed. One fuse block has laser blowable fuses and the other electrical fuses. The redundancy unit can be programmed by either one of the fuse blocks, enabling the redundancy unit to able to be used for defects identified before and after packaging.
Abstract:
The invention relates to an MRAM arrangement, comprising a selection transistor (T), connected to several MTJ memory cells (1) and with an increased channel width.
Abstract:
The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effect into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data. The capacitor connects a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A potential is connected to the first bit line through a third transistor and changes a pre-charge signal level on the first bit line when the third transistor is turned on to reduce the differential read signal.