Abstract:
PROBLEM TO BE SOLVED: To constitute a refresh cycle as advantageously as possible regarding a required energy demand in a semiconductor memory. SOLUTION: In this semiconductor memory, a refresh logic circuit (8) is started in the case of detecting a prescribed minimum deviation at the time of comparing the feature amount of at least one reference memory cell (10) with a reference value (VREF).
Abstract:
PROBLEM TO BE SOLVED: To improve accuracy of bit line reference voltage to read and write data in a memory capacitor MC in a memory in which a differential sense amplifier SA is connected to a pair of bit lines, for example, a ferroelectric memory to read and write data in a memory capacitor MC. SOLUTION: A main reference bit line/BL0 is connected to reference voltage VREF through a charging switch element TL. The other reference bit line/BLi is connected to the main bit line/BL0 through a balance adjusting switch element TA for electric charges balance adjustment between parasitic capacitance of each reference bit line. At the time, reference voltage VGEN is separated from the main reference bit line/BL0, other reference bit lines /BL1, /BL2, /BL3 are connected to the main reference bit line in parallel. Thereby, balance adjustment of electric charges accumulated in parasitic capacitance CPi of each reference bit line connected in parallel is performed, reference voltage VREF is distributed as equal plural bit line reference voltage V/BLi.
Abstract:
PROBLEM TO BE SOLVED: To provide a current driver arrangement capable of supplying a large current at a low voltage when the area needs to be small. SOLUTION: In a current driver arrangement described in the above, this problem can be solved by configuring a driver of an n-type field effect transistor and a current source connected in series therewith. Concretely, a current driver arrangement for an MRAM is provided comprising a memory cell field having a plurality of memory cells (Z) at the crossing position of a word line (WL) and a bit line (BL), and drivers (T1, T2) supplied to each end of the above word line (WL) and the above bit line (BL), and allocated to the above word line (WL) and the above bit line (BL).
Abstract:
PROBLEM TO BE SOLVED: To reduce power consumption under an area required for column selection line path by connecting each bit line to a sense amplifier to which a bit line belongs through a first switching element, and connecting each bit line to a standby potential through a second switching element. SOLUTION: All column selection lines LCSLK takes a low potential so far as any column is not selected out of plural columns. Consequently, a first transistor A is made non-conduction state, and a second transistor B is conducted. Therefore, bit lines BL , bBL at the edge of cellfield AR are decoupled to a sense amplifier SA, and are in a standby potential VSTB. Consequently, a selection transistor T of a memory cell MC is made a non- conduction state. Thereby, contents of a memory of the memory cell MC is not affected at the time of access.
Abstract:
PROBLEM TO BE SOLVED: To provide an MRAM module structure wherein high packing density of memory cell sections is achieved. SOLUTION: This MRAM module structure is constituted of a plurality of memory cell sections (A, P). The respective memory cell sections (A, P) are constituted of memory arrays (A) having a plurality of memory cells (WML, TL, HML) and peripheral circuits (P) surrounding edges of the memory arrays (A). The peripheral circuits (P) surround the memory arrays (A) in such a manner that the respective memory cell sections (A, P) have a cross structure in a plane, essentially. The memory cell sections (A, P) are so nested in each other that the memory cell sections (A, P) are offset mutually on individual rows (1, 2, 3).
Abstract:
PROBLEM TO BE SOLVED: To reduce the complexity and occupancy area of wirings in a driver circuit for word lines of a memory matrix. SOLUTION: In the electronic driver circuit for the word lines WL in the memory matrix 3, a driver source 2, for example, coded output sides IV0-IV3 of a current/voltage source are connected to selected word lines WLi-2-WLi+1. In this case, the word lines WL are selected for every block by control signals SLNP, SLN1, SLN2, and the outputs of the driver source 2 are applied to them. In that case, each activated word line WLi is selected by the coding of the driver source 2.
Abstract:
PROBLEM TO BE SOLVED: To provide an integrated semiconductor memory constituted so that a redundant memory cell unit can be tested and the circuit configuration therefor is scarcely complexed inevitably. SOLUTION: This memory is provided with a memory cell MC arranged as a normal unit WL being addressable, a memory cell MC arranged as at least one unit RWL1 to replace the normal unit, an address bus 3 to which an address ADR can be applied, a redundant circuit 1 for selecting a redundant unit RWL1 connected to this address bus 3, and a processing unit 2. The processing unit 2 is connected to a terminal A of the address bus 3 at an input side, and connected to an input side of the redundant circuit 1 at an output side. The redundant unit RWL1 can be tested before programming of restoration information in the redundant circuit 1, moreover, the circuit is not made complex so much.
Abstract:
A semiconductor memory, in particular a ferroelectric semiconductor memory, has a differential write/read amplifier which is connected, via transfer transistors, to a bit line pair. The bit line pair includes a bit line and a corresponding reference bit line. The differential write/read amplifier is for reading data from and writing data to the memory capacitor (MC). In order to improve the accuracy of the bit line reference voltage, a main reference bit line is connected, via a charge switching element, to a reference voltage. At least one further reference bit line is connected to the main reference bit line via an equalization switching element for charge equalization between the reference bit lines.
Abstract:
The invention relates to a digital memory circuit with a memory matrix (50), comprising M regular rows and N regular columns and, furthermore, P
Abstract:
The invention relates to an MRAM arrangement, comprising a selection transistor (T), connected to several MTJ memory cells (1) and with an increased channel width.