Abstract:
PROBLEM TO BE SOLVED: To provide a detection circuit and a method for detecting silicon well voltage or current indicating collision of an alpha particle or a cosmic ray to the silicon well in silicon substrate. SOLUTION: An effective application of the detection circuit is use in redundancy repair latches used for an SRAM. In the redundancy repair latches, normally writing is once performed when power is on in order to register wrong latch data, though writing is not performed again usually. When either state of these latches is altered by SER phenomena (soft error rate: collision of the alpha particle or the cosmic ray, and the like), the recovery data for the redundant latch of the SRAM is mapped incorrectly. In this detection circuit and the method, whether the SER phenomenon occurs in these latches is monitored, when occurring, reloading the recovery data is performed to the redundancy repair latches. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a memory architecture, in which coupling noise between bit lines is small at CMOS intersection coupling sensing operation, and which operates at a high speed. SOLUTION: In a single bit-line direct sensing architecture, a sense amplifier circuit, having four transistors arranged for each memory array, is used. In this circuit, the transistor functions so that a data bit from a true bit-line of a pair of bit line or an auxiliary bit line is transferred selective to a data line. The data line is preferably arranged on a plurality of memory arrays, and the data line may not be required, to share in read operation and write operation. Furthermore, digital sensing scheme function is performed, by charging a data line during read-out operation using one more current source detecting the ratio of a current source, driving by a bit line of a corresponding array and resistance of a transistor. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain a circuit which is improved in the timing between input and output pulse trains. SOLUTION: This circuit is equipped with a delay lock loop 32 which has a receiver 33, a pulse generator 36, a logic network 50, and a variable delay line 34, and extract two pulse trains having side edges of the same type from the leading and trailing edges of the input pulse train, selects the time delay degree of the variable delay line, and generates a combined output pulse train which has a predetermined phase relation with the input pulse train.
Abstract:
In a memory system comprising a plurality of memory units (10) each of which possesses unit-level error correction capabilities (20) and each of which are tied to a system level error correction function (30), memory reliability is enhanced by providing means for fixing the output of one of the memory units at a fixed value in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach to the generation of forced hard errors nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.
Abstract:
A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.
Abstract:
A DRAM having on-chip ECC and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section, and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry is optimized to reduce the access delays introduced by-carrying out on-chip error correction. The ECC block provides both the corrected data bits and the check bits to an SRAM. Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.
Abstract:
A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.
Abstract:
FAULT TOLERANT COMPUTER MEMORY SYSTEMS AND COMPONENTS EMPLOYING DUAL LEVEL ERROR CORRECTION AND DETECTION WITH LOCK-UP FEATURE In a memory system comprising a plurality of memory units each of which possesses unit-level error correction capabilities and each of which are tied to a system level error correction function, memory reliability is enhanced by providing means for fixing the output of one of the memory units at a fixed value in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach to the generation of forced hard errors nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.
Abstract:
FAULT TOLERANT COMPUTER MEMORY SYSTEMS AND COMPONENTS EMPLOYING DUAL LEVEL ERROR CORRECTION AND DETECTION WITH DISABLEMENT FEATURE In a memory system comprising a plurality of memory units each of which possesses unit-level error correction capabilities and each of which are tied to a system level error correction function, memory reliability is enhanced by providing means for disabling the unit-level error correction capability, for example, in response to the occurrence of an uncorrectable error in one of the memory units. This counter-intuitive approach which disables an error correction function nonetheless enhances overall memory system reliability since it enables the employment of the complement/recomplement algorithm which depends upon the presence of reproducible errors for proper operation. Thus, chip level error correction systems, which are increasingly desirable at high packaging densities, are employed in a way which does not interfere with system level error correction methods.