Abstract:
A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.
Abstract:
1. An i-ray sensitive positive resist composition: which (A) comprises an alkali-soluble novolak resin obtained by subjecting (a) a phenolic mixture of 5 to 95 mol% of 2,3-xylenol with 95 to 5 mol% of a phenol selected from mon-, di- and tri-methyl phenols other than 2,3-xylenol or (b) a phenolic mixture of 5 to 50 mol% of 3,4-xylenol with 95 to 50 mol% of a phenol selected from mono-, di- and trimethyl phenols other than 3,4-xylenol to polycondensation together with an aldehyde, and a 1,2-quinonediazide compound, and (B) which has sensitivity to i-ray. There is also provided a method of forming a pattern, which comprises: (1) applying the i-ray sensitive positive resist composition to a wafer to form a photosensitive layer, (2) irradiating the photosensitive layer with i-ray through a predetermined pattern, and (3) developing the pattern with a developer.
Abstract:
A radiation-sensitive resin composition comprising: (A) an acid-dissociable group-containing resin, insoluble or scarcely soluble in alkali but becoming soluble in alkali when the acid-dissociable group dissociates, and containing recurring units with specific structures and (B) a photoacid generator of the formula (3), wherein R represents a monovalent aromatic hydrocarbon group, m is 1-8, and n is 0-5. The resin composition is suitable as a chemically-amplified resist responsive to deep ultraviolet rays such as a KrF excimer laser and ArF excimer laser, exhibits high transparency, excellent resolution, dry etching resistance, and sensitivity, produces good pattern shapes, and well adheres to substrates.
Abstract:
A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.
Abstract:
A radiation-sensitive resin composition comprising (A) a resin containing an acid-dissociable group which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, comprising the following recurring unit (I), recurring unit (II), and at least one of the recurring units (III-1) and (III-2), and (B) a photoacid generator. The radiation-sensitive resin composition is suitable for use as a chemically-amplified resist showing sensitivity to active radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser, exhibiting superior dry etching resistance without being affected by types of etching gas, having high radiation transmittance, exhibiting excellent basic characteristics as a resist such as sensitivity, resolution, and pattern shape, possessing excellent storage stability as a composition, and exhibiting sufficient adhesion to substrates.
Abstract:
A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition for forming a color layer, which forms a fine pattern without causing chipping in a pattern edge or undercut even when the luminous energy of exposure is low, without generating an undissolved substance remaining during development or scum on a pattern edge, and forms a color filter with high color purity and a black matrix having high light-shielding property. SOLUTION: The radiation-sensitive composition contains (A) a colorant, (B) an alkali-soluble resin, (C) a polyfunctional monomer, and (D) a specific photopolymerization initiator represented by a compound No.1. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which is suitably used to form a color filter protective film having excellent adhesiveness to an ITO film even under high temperature and high humidity, high in transparency and surface hardness, and excellent in various resistances such as sputtering resistance. SOLUTION: The thermosetting resin composition comprises: [A] a polymer having a repeating unit derived from a polymerizable unsaturated compound having an oxiranyl group or oxetanyl group; and [B] a calixarene compound having a specific structure. COPYRIGHT: (C)2009,JPO&INPIT