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    MICROETCHING COMPOSITION AND METHOD OF USING THE SAME
    12.
    发明申请
    MICROETCHING COMPOSITION AND METHOD OF USING THE SAME 审中-公开
    微量组合物及其使用方法

    公开(公告)号：WO2007078355A3

    公开(公告)日：2007-11-15

    申请号：PCT/US2006036185

    申请日：2006-09-15

    Applicant: MACDERMID INC

    Inventor： CASTALDI STEVEN A ,  FENG KESHENG ,  KAPADIA NILESH

    IPC: H01L21/306 ,  C09K13/04 ,  C09K13/06

    CPC classification number: C23F1/18 ,  C23F1/16 ,  H01L21/32134 ,  H05K3/383 ,  H05K2203/122

    Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

    Abstract translation: 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其他添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括使铜或铜合金表面与本发明的组合物接触的步骤，然后粘合 聚合物材料到铜或铜合金表面。

    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS.
    13.
    发明公开
    PROCESS FOR PREPARING MULTILAYER PRINTED CIRCUIT BOARDS. 失效
    方法生产多层半导体板。

    公开(公告)号：EP0288507A4

    公开(公告)日：1989-06-13

    申请号：EP87906862

    申请日：1987-09-10

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  FERRIER DONALD R ,  LARSON GARY B ,  GALLEGOS DANIEL ,  CASTALDI STEVEN A

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    CPC classification number: H05K3/181 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10S428/901

    Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

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