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公开(公告)号：DE102006061941A1
公开(公告)日：2008-07-03
申请号：DE102006061941
申请日：2006-12-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL , WINDISCH REINER , ROSE MONIKA
IPC: H01L25/075 , F21K99/00 , H01L33/00 , H05B37/02
Abstract: The optoelectronic arrangement (1) has a power light emitting diode (10). A radiation (SL) is emitted with an emission spectrum (EL) from the power light emitting diode. An adjusting light emitting diode (20) emits another radiation (SE) with another emission spectrum (EE). An overall radiation (SO) of the optoelectronic arrangement has both radiations. An independent claim is also included for a method for operating an opto-electronic arrangement, which involves releasing a radiation with an emission spectrum by a power light emitting diode.
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公开(公告)号：DE10234162B4
公开(公告)日：2008-02-14
申请号：DE10234162
申请日：2002-07-26
Inventor： LOW HONG YEE , GUENTHER EWALD KARL MICHAEL , CHUA SOO JIN
IPC: H01L51/10 , H01L21/50 , H05B33/04 , H01L21/52 , H01L21/58 , H01L23/10 , H01L51/40 , H01L51/50 , H01L51/52 , H05B33/02 , H05B33/10
Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.
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公开(公告)号：DE69936072T2
公开(公告)日：2008-01-10
申请号：DE69936072
申请日：1999-12-17
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GUENTHER EWALD KARL MICHAEL
IPC: G02F1/1339 , H05B33/04 , H01L51/50 , H01L51/52
Abstract: The invention provides for the formation of thin devices having an overall thickness which is less than the width of the sealing frame used to mount the cap. The formation of thin devices is facilitated by the use of spacers in the device region to support the cap.
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公开(公告)号：DE60027021D1
公开(公告)日：2006-05-18
申请号：DE60027021
申请日：2000-09-06
Inventor： GUENTHER EWALD KARL MICHAEL , AUCH MARK DAI JOONG
Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
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公开(公告)号：DE102004021233A1
公开(公告)日：2005-12-01
申请号：DE102004021233
申请日：2004-04-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： STRAUS JOERG , BRUNNER HERBERT , WAITL GUENTER , GUENTHER EWALD KARL MICHAEL
IPC: H01L25/075 , H01L33/50 , H01L33/54 , H01L33/00
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Patent Agency Ranking
公开(公告)号：WO2010025694A9
公开(公告)日：2010-10-28
申请号：PCT/DE2009001103
申请日：2009-08-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH , GUENTHER EWALD KARL MICHAEL , HERRMANN SIEGFRIED , ZEHNDER ULRICH , BRUNNER HERBERT
Inventor： GUENTHER EWALD KARL MICHAEL , HERRMANN SIEGFRIED , ZEHNDER ULRICH , BRUNNER HERBERT
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/645 , H01L2924/0002 , H05B33/0803 , H01L2924/00
Abstract: In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.
Abstract translation: 在光电子器件（1）中的至少一个实施例具有这种在载体（2）具有安装侧（20）和具有至少一个功能元件（3）。 此外，光电子器件（1）包括至少一个无基材，所述光电子半导体芯片（4），其具有一个顶部（44）和相对的底部表面（45），所述上侧（44）和底部上的半导体芯片（4）的电接触 （45），并且其中载体（2）的安装侧（20）的下侧（45）面向。 该至少一个半导体芯片（4）被施加到安装侧（20）。 此外，光电子器件（1）包括至少一个电接触膜（5）上的半导体芯片（1）的上侧（44），其中，所述接触膜（5）被构造。 这种光电子部件（1）具有紧凑的结构并具有良好的热性能。
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公开(公告)号：WO0145140A3
公开(公告)日：2002-01-03
申请号：PCT/SG9900143
申请日：1999-12-17
Inventor： GUENTHER EWALD KARL MICHAEL , HAGEN KLAUSMANN
IPC: H05B33/04 , C09J201/00 , C09K3/10 , H01L25/04 , H01L51/50 , H01L51/52 , H05B33/10 , H01L27/15 , H01L51/20
CPC classification number: H01L51/525 , B81B7/0058 , H01L2251/5338
Abstract: An encapsulation for a device is disclosed. Spacer particles (48) are randomly located in the device region to prevent a cap (660) mounted on the substrate (201) from contacting the active components, thereby protecting them from damage.
Abstract translation: 公开了一种用于装置的封装。 间隔颗粒（48）随机地位于装置区域中以防止安装在基板（201）上的盖（660）与活性组分接触，从而防止其损坏。
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公开(公告)号：WO2006034671A3
公开(公告)日：2006-07-13
申请号：PCT/DE2005001603
申请日：2005-09-13
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH , GUENTHER EWALD KARL MICHAEL , SORG JOERG ERICH , STATH NORBERT
Inventor： GUENTHER EWALD KARL MICHAEL , SORG JOERG ERICH , STATH NORBERT
CPC classification number: H01L33/62 , H01L24/24 , H01L24/82 , H01L33/508 , H01L33/52 , H01L33/54 , H01L2224/24051 , H01L2224/24105 , H01L2224/24226 , H01L2224/24998 , H01L2224/82007 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01058 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/351 , H01L2924/00
Abstract: An optoelectronic component according to the invention contains a semiconductor chip (1) and a supporting body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), this encapsulation layer (3) having two cutouts (11, 12) for exposing a contact surface (6) and a connecting area (8) of the supporting body, and contains an electrically conductive layer (14) leading from the contact surface (6) while passing over a partial area of the encapsulation layer (3) and extending to the electrical connecting area (8) of the supporting body (10) in order to electrically connect the contact surface (6) and the electrical connecting area (8). The radiation emitted from the semiconductor chip (1) in a main emitting direction (13) is decoupled via the encapsulation layer (3) that advantageously contains luminescence conversion substances for converting wavelengths of the emitted radiation.
Abstract translation: 根据本发明的光电子器件包括：半导体芯片（1）和被提供有一个透明的，电绝缘的封装层（3）的载体主体（10），其中所述封装层（3）包括两个凹部（11，12），以暴露的接触表面 （6），并通过所述封装层（3）的部分区域（8），所述支撑体（10）被引导的电连接区域的连接部（8）的承载体，并且在所述接触表面（6）的导电层（14）， 彼此电连接的接触表面（6）与所述电连接区域（8）。 在半导体芯片（1）的主辐射方向（13）发射的辐射通过封装层（3），其有利地含有发光转换材料所发射的辐射的波长转换耦合输出。
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公开(公告)号：WO03030272A3
公开(公告)日：2003-07-17
申请号：PCT/EP0210963
申请日：2002-09-30
Inventor： GUENTHER EWALD KARL MICHAEL , CHUA SOO JIN , AUCH MARK DAI JOONG , FANG LIM SHUANG , LOW BEE LING
CPC classification number: H01L51/5246
Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap (260). Spacer particles (680) are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam (280) provides a sealing region (285) between the edge of the cap (260) and dam (280) in which an adhesive (287) is applied to seal the OLED device. The use of the sealing dam (280) advantageously enables devices to be formed with narrower sealing widths.
Abstract translation: 公开了一种用于有机发光二极管（OLED）器件的封装。 封装包括围绕OLED器件的单元区域以支撑帽（260）的密封阻挡（280）。 间隔颗粒（680）随机位于细胞区域中，以防止帽与活性组分接触，从而防止其损伤。 密封坝（280）在盖（260）的边缘和坝（280）之间提供密封区域（285），其中施加粘合剂（287）以密封OLED装置。 密封坝（280）的使用有利于使装置形成较窄的密封宽度。
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公开(公告)号：DE102008021402A1
公开(公告)日：2009-11-05
申请号：DE102008021402
申请日：2008-04-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： GROETSCH STEFAN , GUENTHER EWALD KARL MICHAEL , WILM ALEXANDER , HERRMANN SIEGFRIED
IPC: H01L25/075
Abstract: The invention relates to a surface-mounted LED module (100) which comprises a carrier substrate (1) on which at least three LED chips (2a, 2b, 2c) are arranged, said LED chips having respective active layers for generating electromagnetic radiation. The carrier substrate (1) comprises at least three first and three second electrical connecting surfaces (8a, 8b). The LED chips (2a, 2b, 2c) comprise respective first contact layers (9b) which are connected to respective first connecting surfaces (8b) in an electrically conductive manner. The LED diode chips (2a, 2b, 2c) have respective second contact layers (9b) which are connected to respective second connecting surfaces (8b) in an electrically conductive manner. A first LED chip (2a) emits radiation in the red spectral range, a second LED chip (2b) emits radiation in the green spectral range, and a third LED chip (2c) emits radiation in the blue spectral range. The LED chips (2a, 2b, 2c) have no respective epitaxial growth substrates. The invention further relates to a method for producing a surface-mounted LED module (100).
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