公开(公告)号：WO1990015422A1

公开(公告)日：1990-12-13

申请号：PCT/US1990003175

申请日：1990-06-05

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  MILLER, Terry, L. ,  ZDANISM, William, R., Jr. ,  WOERNER, Graham, A. ,  HORN, Allen, F., III

IPC: H01B03/00

CPC classification number: H01B11/1834 ,  H01B3/445 ,  H01B7/292 ,  Y10T428/252

Abstract: A ceramic filled fluoropolymer composite coaxial cable insulation (14) and the coaxial cable (10) made therefrom is presented. In accordance with the present invention, the coaxial cable insulation is comprised of 60-25 % fluoropolymer that is fibrillatable, 40-75 % ceramic filler and a void content which is effective to provide a dielectric constant of approximately less than 2.30. In a preferred embodiment of the present invention, the coaxial cable insulative composite comprises approximately 40 weight percent PTFE, 60 weight percent fused amorphus silica and a void volume percent of between 30 and 60. Also in certain preferred embodiments, the composite may include 1-4 % by weight of microfiberglass filler and the ceramic filler may be coated with a silane coating. The provision of the void volume is an important feature of the present invention and acts to substantially lower the overall dielectric constant of the insulative composite. Still another important feature of this invention is the provision of an effective amount of ceramic filler (silica) so as to reduce the coefficient of thermal expansion (CTE) to a CTE approximating that of copper. This results in a coaxial cable having electrical properties which are more temperature stable than the prior art; and coaxial cable assemblies having improved thermomechanical stability relative to the prior art.

公开(公告)号：WO1990001783A1

公开(公告)日：1990-02-22

申请号：PCT/US1989003195

申请日：1989-07-24

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HERNANDEZ, Jorge, M. ,  ALCAZAR, Antonia

IPC: H01G04/20

CPC classification number: H01G4/258 ,  H01G4/20 ,  Y10T29/435

Abstract: The temperature characteristics of each of the layers (20, 22, and 24) in a multilayer ceramic capacitor are adjusted (through chemical doping of the basic dielectric material) to thereby stagger the temperature characteristics (e.g. curie points). As a result, the composite temperature characteristic of the multilayer structure will be much more stable than that of any individual layer. The temperature characteristics of the individual layers will combine in an additive manner thereby achieving the objective of high capacitance and uniform temperature stability for materials which have high dielectric constant but poor temperature stability. Thus, by properly formulating the composition of the layers of a multilayer ceramic chip capacitor, relative temperature stability of capacitance and high volumetric capacitance efficiency will be achieved.

公开(公告)号：WO1989011114A1

公开(公告)日：1989-11-16

申请号：PCT/US1989001802

申请日：1989-04-28

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  BRONNENBERG, David, L.

IPC: G03C05/00

CPC classification number: H05K3/4691 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/4076 ,  H05K3/427 ,  H05K2201/0355

Abstract: A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which has no exposed adhesive. The method comprises the formation of a diclad laminate comprised of an adhesiveless flex circuit (e.g. conductive foil directly on non-conductive flexible carrier film) which is adhered to a second conductive layer using a suitable adhesive. Next, through-holes (58) are formed in the laminate followed by electroless deposition of metal (60) on the through-hole sidewalls. The laminate then undergoes conventional etching processing using photo resist followed by lamination thereof to an adhesive coated polymeric cover film (66, 68) over exposed conductive areas so as to define a dynamic flex region in the area between the through-holes (58).

Abstract translation: 一种多层柔性直通接触电路和制造这种电路的方法，其在折叠区具有完全对称的叠层结构并且不包括任何可见的粘合剂。 该制造方法包括形成包含没有粘合剂的双镀柔性电路（例如，导电片直接设置在非导电柔性基板的薄膜），其被使用固定到第二导电层的层叠体 适当的粘合剂 然后在金属（60）无电沉积在通孔的侧壁上之前在层压体中形成通孔（58）。 然后将层叠体进行使用用于应用光致抗蚀剂剂的聚合物覆盖膜（66，68）传统的蚀刻工艺中，暴露的导电部分涂覆有粘合剂，以 在通孔（58）之间的部分中限定动态弯曲区域。

公开(公告)号：WO1987007471A1

公开(公告)日：1987-12-03

申请号：PCT/US1987001151

申请日：1987-05-19

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GORDON, Herman, B. ,  KOSA, Bruce, G. ,  SIMPSON, Scott, S.

IPC: H05K01/00

CPC classification number: H05K7/1053 ,  H05K1/141 ,  H05K3/365

Abstract: An electrical connector arrangement of the solderless type has first and second planar arrays (14, 40) of pad-type contact terminals in face-to-face engagement to provide engaged pairs of contact terminals. Each pad-type contact terminal (112) has a planar contact surface (114) and one pad-type contact terminal of each engaged pair has a series of scraping edges (122) spaced along the length of its planar contact for surface. The connector arrangement further provides for lateral movement of one array of contact terminals relative to the other array in a direction transverse to the scraping edges to cause the plurality of spaced scraping edges of one contact terminal of each pair to engage the planar surface of the other contact terminal of the respective pair in a contact-wiping action for removing surface contamination.

Abstract translation: 无焊型的电连接器布置具有面对面接合的垫型接触端子的第一和第二平面阵列（14,40），以提供接合的接触端子对。 每个焊盘式接触端子（112）具有平面接触表面（114），并且每个接合对中的一个焊盘型接触端子具有沿着其用于表面的平面接触件的长度间隔开的一系列刮削边缘（122）。 连接器装置进一步提供接触端子阵列相对于另一个阵列在横向于刮削边缘的方向上的横向运动，以使每对接触端子的多个间隔的刮削边缘接合另一个的平面表面 用于去除表面污染的接触擦拭动作中的相应对的接触端子。

公开(公告)号：WO1993017860A1

公开(公告)日：1993-09-16

申请号：PCT/US1993002277

申请日：1993-03-12

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GAZIT, Samuel ,  BUSH, Robert, L. ,  OTTO, Jeffrey, B.

IPC: B32B03/00

CPC classification number: B32B15/14 ,  B32B5/022 ,  B32B7/12 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0293 ,  H05K2203/122

Abstract: A new and improved laminated microwave circuit material (10) comprises a non-woven glass web (5 to 20 vol. %) impregnated with a cyanate ester resin (35 to 68 vol. %) and filled with a low dielectric constant (e.g., silica), high dielectric constant (e.g., titania) filler or other suitable ceramic particulate filler (25-55 vol. %). Intermediate values of dielectric constant may be achieved by filler mixtures of silica, titania and other suitable fillers. Preferably, the filler is coated with a material which renders the filler hydrophobic such as silane, titanate or zirconate coatings. This microwave circuit material (10) of the present invention is preferably formulated to be flame retardant and has many features and advantages relative to prior art and microwave materials including prior art cyanate ester/woven glass materials. For example, the combination of resin, non-woven glass web and filler provides a low dissipation factor (Df) of less than 0.008 thereby permitting the material of the present invention to be used in rellatively demanding consumer and commercial applications (and some less demanding military applications).

Abstract translation: 一种新的和改进的层压微波电路材料（10）包括浸渍有氰酸酯树脂（35至68体积％）并填充有低介电常数（例如， 二氧化硅），高介电常数（例如，二氧化钛）填料或其它合适的陶瓷颗粒填料（25-55体积％）。 介电常数的中间值可以通过二氧化硅，二氧化钛和其它合适填料的填料混合物来实现。 优选地，填充剂涂覆有使填料疏水的材料，例如硅烷，钛酸盐或锆酸盐涂层。 本发明的微波回路材料（10）优选配制成阻燃剂，并且相对于包括现有技术的氰酸酯/编织玻璃材料的现有技术和微波材料具有许多特征和优点。 例如，树脂，无纺玻璃纤维网和填料的组合提供小于0.008的低耗散因子（Df），从而允许本发明的材料用于要求苛刻的消费者和商业应用（并且一些要求较低 军事应用）。

公开(公告)号：WO1990010321A1

公开(公告)日：1990-09-07

申请号：PCT/US1990000551

申请日：1990-01-30

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  SIMPSON, Scott, S. ,  KOSA, Bruce, G.

IPC: H01R09/07

CPC classification number: H05K3/4007 ,  H01R12/79 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  Y10T29/49155 ,  Y10T29/49222

Abstract: A process for forming a contact bump (18) in an electrically conductive contact pad (15) having top and bottom surfaces supported on a dielectric substrate (12) that includes the steps of removing a portion of the substrate (12) underlying the contact pad to form an aperture (20) and expose a portion of the bottom surface of the pad; upwardly deforming the pad (16) by applying force to its exposed bottom surface to form the bump (18); and filling the aperture behind the bump with a supporting substance (26).

公开(公告)号：WO1990007785A1

公开(公告)日：1990-07-12

申请号：PCT/US1989005140

申请日：1989-11-14

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HERNANDEZ, Jorge, M.

IPC: H01G04/10

CPC classification number: H01G4/20 ,  H05K1/0298

Abstract: A multilayer capacitor is presented which provides high capacitance and low inductance. The capacitor comprises a plurality of conductive layers (28, 30) each separated from the other and sandwiching therebetween a high capacitance flexible dielectric sheet material. The dielectric sheet material is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets (12) of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive (14) to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces.

公开(公告)号：WO1990001856A1

公开(公告)日：1990-02-22

申请号：PCT/US1989003338

申请日：1989-08-02

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  THOMAS, Alan, C.

IPC: H05B33/10

CPC classification number: H05B33/28 ,  H05B33/10 ,  Y10S428/917

Abstract: An electroluminescent lamp (10) including a phosphor layer (14) disposed between corresponding lamp electrodes (16, 18) that are adapted to apply an excitation potential to cause the phosphor layer (14) to emit light, the front lamp electrode (18) being light-transmissive to radiation from the phosphor layer (14), has an improved front lamp electrode (18) consisting of a thin layer of light-transmissive binder containing a distribution of discrete gallium-doped zinc oxide particles. A method of forming the lamp is also described.

公开(公告)号：WO1990001782A1

公开(公告)日：1990-02-22

申请号：PCT/US1989003177

申请日：1989-07-24

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HERNANDEZ, Jorge, M.

IPC: H01G01/14

CPC classification number: H01G4/228 ,  H01G4/40 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A decoupling capacitor is presented which is particularly useful in conjunction with either pin grid array type IC packages or with plastic leaded chip carrier IC packages. In accordance with the present invention, the multiplicity of elongated conductors of prior art decoupling capacitors are replaced with flat, wide conductive strips (40, 42) termed herein as skirts. These skirts extend outwardly from the top and bottom conductors of the decoupling capacitor and include small leads (44, 46) extending therefrom which are solely for the purpose of either insertion into the circuit board or for connection with a surface pad on the circuit board. Thus, rather than the multiplicity of elongated leads found in the prior art, the present invention utilizes flat strips or skirts having very small leads extending therefrom. This skirt construction provides far lower inductance relative to the elongated leads of the prior art.

公开(公告)号：WO1995015007A1

公开(公告)日：1995-06-01

申请号：PCT/US1994012460

申请日：1994-10-31

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  TRAUT, Robert ,  HOLZ, Gary

IPC: H01L23/02

CPC classification number: H01L21/50 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A method and design for packaging electronic chip devices, especially devices intended for radio frequency (RF) and microwave frequencies above 900 MHz is disclosed. An array of metal leads (100) are bonded between two layers of a sheet polymer composite that have been cut to form frames (40, 130) in such a way that the metal leads (100) extend from outside to inside of the single frame shape formed by a pressure and heat bonding step. The polymer composite frame serves the dual purpose of holding the leads in a desired configuration for later assembly and testing steps both inside and outside of its area, and of providing a microwave quality, low insertion loss, low permittivity and electrical insulation function between leads and ground planes. This dual purpose is provided in a uniquely cost-effective way that makes it of particular value for packaging high frequency electronic components intended for the growing consumer and commercial applications market.

Abstract translation: 公开了用于封装电子芯片器件的方法和设计，特别是用于射频（RF）和高于900MHz的微波频率的器件。 金属引线（100）的阵列结合在已经被切割以形成框架（40,130）的两层片状聚合物复合材料之间，使得金属引线（100）从单个框架的外部延伸到内部 通过压力和热粘合步骤形成的形状。 聚合物复合框架用于将引线保持在所需构型的双重目的，用于其区域内外的稍后的组装和测试步骤，并且提供引线之间的微波质量，低插入损耗，低介电常数和电绝缘功能 地面飞机。 这种双重目的是以独特的成本有效的方式提供的，使其对于旨在用于不断增长的消费者和商业应用市场的高频电子组件的包装特别有价值。