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    CIRCUIT MODULE SYSTEM AND METHOD
    12.
    发明专利
    CIRCUIT MODULE SYSTEM AND METHOD 未知

    公开(公告)号：CA2515714A1

    公开(公告)日：2006-03-03

    申请号：CA2515714

    申请日：2005-08-11

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR

    IPC: H05K1/00 ,  G11C5/00 ,  H01L23/36 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

    Abstract: Flexible circuitry is populated with integrated circuits (ICs) disposed alo ng one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is dispose d about an edge of a rigid, thermally-conductive substrate thus placing the integrat ed circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermall y conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

    MEMORY MODULE SYSTEM AND METHOD
    15.
    发明专利
    MEMORY MODULE SYSTEM AND METHOD 未知

    公开(公告)号：HK1121287A1

    公开(公告)日：2009-04-17

    申请号：HK09100449

    申请日：2009-01-16

    Applicant: STAKTEK GROUP LP

    Inventor： RAPPORT RUSSELL ,  GOODWIN PAUL ,  CADY JAMES W

    IPC: H01L20100101

    Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

    Circuit module for memory expansion
    16.
    发明专利
    Circuit module for memory expansion 未知

    公开(公告)号：GB2452880A

    公开(公告)日：2009-03-18

    申请号：GB0822085

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRELY JAMES DOUGLAS JR

    IPC: H05K1/18 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A circuit module comprises a rigid thermally conductive substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The substrate 14 has a thermal extension 16T, preferably at the edge opposite the contacts, to assist in the dissipation of heat from the CSPs. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer.

    17.
    发明专利
    未知

    公开(公告)号：DE102005038254A1

    公开(公告)日：2006-03-23

    申请号：DE102005038254

    申请日：2005-08-12

    Applicant: STAKTEK GROUP LP

    Inventor： GOODWIN PAUL ,  CADY JAMES W ,  WEHRLY JUN JAMES DOUGLAS

    IPC: G11C5/02 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    Circuit module system and method
    18.
    发明专利
    Circuit module system and method 未知

    公开(公告)号：AU2005203591A1

    公开(公告)日：2006-03-23

    申请号：AU2005203591

    申请日：2005-08-11

    Applicant: STAKTEK GROUP LP

    Inventor： CADY JAMES W ,  WEHRLY JAMES DOUGLAS JR ,  GOODWIN PAUL

    IPC: H05K1/02 ,  G11C5/00 ,  H01L23/538 ,  H01L25/10 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit module comprises a rigid, preferably thermally conductive, substrate 14, a flexible circuit 12 wrapped around an edge of the substrate, a plurality of chip scale packages (CSPs) attached to the flexible circuit and expansion board contacts 20 formed on the flexible circuit adjacent to the edge. The CSPs may be standard memory modules and are connected to the contacts 20 by means of conductive traces in the flexible circuit 16. The contacts 20 are arranged so that the circuit module may be plugged at its edge into a standard circuit board expansion slot in e.g. a computer. The substrate may assist in heat dissipation from the attached CSPs.

    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
    19.
    发明专利
    MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD 未知

    公开(公告)号：AU2003304192A1

    公开(公告)日：2005-01-04

    申请号：AU2003304192

    申请日：2003-09-15

    Applicant: STAKTEK GROUP LP

    Inventor： WEHRLY JAMES DOUGLAS JR ,  BUCHLE JEFF ,  RAPPORT RUSSELL ,  CADY JAMES W ,  WILDER JAMES ,  ROPER DAVID L

    IPC: H01L21/44 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

    Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a two-high CSP stack or module devised in accordance with a preferred embodiment of the present invention, two CSPs are stacked, with one CSP disposed above the other. The two CSPs are connected with flex circuitry. A form standard is disposed between the flex circuitry and a CSP in the stack. The form standard can take many configurations and may be used where flex circuits are used to connect CSPs to one another in stacked modules having two or more constituent CSPs. For example, in stacked modules that include four CSPs, three form standards are employed in preferred embodiments, although fewer may be used. The form standard provides a thermally conductive physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design.

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