公开(公告)号：EP1375416B1

公开(公告)日：2007-10-24

申请号：EP02425407.0

申请日：2002-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno ,  Ferrari, Paolo ,  Sassolini, Simone

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  H02N1/006

公开(公告)号：EP1069552B1

公开(公告)日：2006-09-27

申请号：EP99830449.7

申请日：1999-07-15

Applicant: STMicroelectronics S.r.l.

Inventor： Mastromatteo, Ubaldo ,  Zerbini, Sarah ,  Sassolini, Simone ,  Vigna, Benedetto

IPC: G11B5/55 ,  G11B21/08 ,  H01L21/20 ,  H01L21/304

CPC classification number: G11B5/56 ,  B81C1/00896 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1624284A1

公开(公告)日：2006-02-08

申请号：EP04425573.5

申请日：2004-07-29

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  del Sarto, Marco ,  Baldo, Lorenzo ,  Marchi, Mauro

IPC: G01C19/56

CPC classification number: G01C19/5755 ,  G01C19/5769

Abstract: The semiconductor inertial sensor (30) is formed by a rotor element (38) and a stator element (39) electrostatically coupled together. The rotor element (38) is formed by a suspended mass (40) and by a plurality of mobile electrodes (41) extending from the suspended mass (40). The stator element (39) is formed by a plurality of fixed electrodes (42) facing respective mobile electrodes (41). The suspended mass (40) is supported by elastic suspension elements (45). The suspended mass (40) has a first, larger, thickness (t1 + t2), and the elastic suspension elements (45) have a second thickness (t1), smaller than the first thickness.

Abstract translation: 半导体惯性传感器（30）由静电耦合在一起的转子元件（38）和定子元件（39）形成。 转子元件（38）由悬挂质量块（40）和从悬浮块（40）延伸的多个可移动电极（41）形成。 定子元件（39）由面对各自的可动电极（41）的多个固定电极（42）形成。 悬挂质量（40）由弹性悬挂元件（45）支撑。 悬挂质量（40）具有第一，较大的厚度（t1 + t2），并且弹性悬挂元件（45）具有小于第一厚度的第二厚度（t1）。

公开(公告)号：EP1617178A1

公开(公告)日：2006-01-18

申请号：EP04425514.9

申请日：2004-07-12

Applicant: STMicroelectronics S.r.l.

Inventor： Spinola Durante, Guido ,  Sassolini, Simone ,  Ferrera, Marco ,  Marchi, Mauro

IPC: G01C19/56

CPC classification number: G01C19/5769

Abstract: Micro-electro-mechanical structure formed by a substrate (41) of semiconductor material and a suspended mass (10, 20) extending above the substrate (41) and separated therefrom by an air gap (55). An insulating region (23, 24) of a first electrically insulating material extends through the suspended mass (10, 20) and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region (10a, 10b, 20a, 20b). A plug element (46) of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region (23, 24) and constitutes a barrier between the insulating region and the air gap (55) for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.

Abstract translation: 由半导体材料与悬挂质量（10，20）的基板（41）形成的微机电结构的基片（41）和从通过在空气间隙（55）隔开有上方延伸。 一个第一电绝缘材料制成的绝缘区域（23，24）通过所述悬挂质量（10，20）延伸，并且它分成至少一个第一电绝缘的悬浮区域和至少一个第二电绝缘的悬浮区域（10A，10B，20A， 20B）。 从第一电绝缘材料不同的第二电绝缘材料制成的插头元件（46）被形成在所述绝缘区下面（23，24）和用于防止去除的构成绝缘区域和所述空气间隙（55）之间的阻挡 制造中，当蚀刻剂用于去除牺牲层和形成空气间隙期间绝缘区域。

公开(公告)号：EP1443018A1

公开(公告)日：2004-08-04

申请号：EP03425015.9

申请日：2003-01-15

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Baldo, Lorenzo

IPC: B81B5/00 ,  G11B5/55 ,  G01C19/56

CPC classification number: H02N1/008 ,  G01C19/5656 ,  G11B5/4826 ,  G11B5/5552 ,  G11B5/596

Abstract: A rotational micro-electro-mechanical structure includes a stator (21), having a plurality of stator electrodes (33, 34), and a rotor (23), which is rotatable with respect to the stator (21) about an axis of relative rotation (A) and has a plurality of rotor electrodes (30), the stator electrodes (33, 34) and the rotor electrodes (30) being comb-fingered; moreover, at least a first group (20a) of stator electrodes (33, 34) and rotor electrodes (30) are parallel to a first plane (P 1 ) that includes the axis of relative rotation (A).

Abstract translation: 旋转微电子机械结构包括具有多个定子电极（33,34）的定子（21）和可相对于定子（21）围绕相对轴线旋转的转子（23） 旋转（A）并且具有多个转子电极（30），定子电极（33,34）和转子电极（30）被梳齿指定; 此外，定子电极（33,34）和转子电极（30）的至少第一组（20a）平行于包括相对旋转轴线（A）的第一平面（P1）。

公开(公告)号：EP1375416A1

公开(公告)日：2004-01-02

申请号：EP02425407.0

申请日：2002-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： Mastromatteo, Ubaldo ,  Murari, Bruno ,  Ferrari, Paolo ,  Sassolini, Simone

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  H02N1/006

Abstract: A micro-electro-mechanical device (20) formed by a body (4) of semiconductor material having a thickness and defining a mobile part (23, 24, 31) and a fixed part (3, 25, 30). The mobile part is formed by a mobile platform (23), supporting arms (31) extending from the mobile platform to the fixed part (3, 25, 30), and by mobile electrodes (24) fixed to the mobile platform. The fixed part has fixed electrodes (25) facing the mobile electrodes (24), a first biasing region (3) fixed to the fixed electrodes, a second biasing region (30) fixed to the supporting arms (31), and an insulation region (6) of insulating material extending through the entire thickness of the body (4). The insulation region (6) insulates electrically at least one between the first and the second biasing regions (3, 30) from the rest of the fixed part.

Abstract translation: 通过具有一定厚度和一个移动限定部分（23，24，31）和固定部件（3，25，30）的半导体材料的本体（4）形成的微机电装置（20）。 移动部分由可移动平台（23）而形成，支持从移动平台延伸到所述固定部件（3，25，30）臂（31），并且通过可移动电极（24）固定到所述移动平台。 固定部分具有固定的电极（25）的面向所述移动电极（24），第一偏置区域（3）固定到所述固定电极，固定在所述支撑臂（31）的第二偏置区域（30），并在绝缘区域 （6）绝缘材料穿过所述主体（4）的整个厚度延伸的。 绝缘区域（6）电绝缘所述第一，并从固定部分的其余部分的第二偏置区域（3，30）之间的至少一个。

公开(公告)号：EP1359569A1

公开(公告)日：2003-11-05

申请号：EP02425276.9

申请日：2002-05-03

Applicant: STMicroelectronics S.r.l.

Inventor： Del Sarto, Marco ,  Marchi, Mauro ,  Baldo, Lorenzo ,  Sassolini, Simone

IPC: G11B5/48

CPC classification number: G11B5/4826

Abstract: A read/write assembly for magnetic hard disks includes at least: one supporting element (5, 8); one read/write (R/W) transducer (6); one micro-actuator (10), set between the R/W transducer (6) and the supporting element (5, 8); one electrical-connection structure (11) for connection to a remote device carried by the supporting element (5,8) and connected to the R/W transducer (6) and to the micro-actuator (10) In addition, a protective structure (15), set so as to cover the micro-actuator (10) is made of a single piece with the electrical-connection structure (11).

Abstract translation: 用于磁性硬盘的读/写组件至少包括：一个支撑元件（5,8）; 一个读/写（R / W）传感器（6）; 设置在R / W换能器（6）和支撑元件（5,8）之间的一个微致动器（10）; 一个电连接结构（11），用于连接到由支撑元件（5,8）承载并连接到R / W换能器（6）和微致动器（10）的远程设备。另外，保护结构 （15），以覆盖微致动器（10）的方式由具有电连接结构（11）的单件制成。

公开(公告)号：EP1312580A1

公开(公告)日：2003-05-21

申请号：EP01830712.4

申请日：2001-11-16

Applicant: STMicroelectronics S.r.l.

Inventor： Sassolini, Simone ,  Del Sarto, Marco ,  Frezza, Giovanni ,  Baldo, Lorenzo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00333

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body (1) of semiconductor material, at least one microstructure (2) having at least one first portion (3) and one second portion (4) which are relatively mobile with respect to one another and are separated from one another by at least one gap region (14), which is accessible through a face (6) of the body (1); and sealing the gap (14). The sealing step includes depositing on the face (6) of the body (1) a layer (15) of protective material, in such a way as to close the gap region (14), the protective layer being such as to enable relative motion between the first portion (3) and the second portion (4) of the microstructure (2).

Abstract translation: 一种制造集成保护微结构的器件的方法，包括以下步骤：在半导体材料的本体（1）中形成至少一个具有至少一个第一部分（3）和一个第二部分（3）的微结构（2） 4），它们相对于彼此相对移动并且通过至少一个可通过主体（1）的面（6）接近的间隙区域（14）彼此分离; 并密封间隙（14）。 密封步骤包括在主体（1）的表面（6）上沉积保护材料层（15），以便封闭间隙区域（14），保护层能够进行相对运动 在微结构（2）的第一部分（3）和第二部分（4）之间。

公开(公告)号：EP1128540A1

公开(公告)日：2001-08-29

申请号：EP00830128.5

申请日：2000-02-23

Applicant: STMicroelectronics S.r.l.

Inventor： Murari, Bruno ,  Vigna, Benedetto ,  Sassolini, Simone

IPC: H02N1/00

CPC classification number: H02N1/008

Abstract: The electrical connection structure (15) comprises connection elements (25) which electrically connect a movable part (3) to a fixed part (4) of a microelectromechanical device, for example a microactuator (23). The movable part (3) and fixed part (4) are separated by trenches (6) and are mechanically connected by spring elements (12) which determine the torsional rigidity of the microelectromechanical device, together with the connection elements (25). Each connection element (25) is formed by more sub-arms (26) connected in parallel and having a common movable anchorage region (26a), anchored to the movable part (3), and a common fixed anchorage region (26b), anchored to the fixed part (5), thereby the mechanical resistance of the connection elements (25) is negligible. The sub-arms (26) have a width (W) equal to a submultiple of the width necessary in case of a single connection element for the latter to have a preset electrical resistance, determined in the design; namely, the width of the sub-arms (26) is equal to the width of the single connection element divided by the number of sub-arms.

Abstract translation: 电连接结构（15）包括将可移动部分（3）电连接到微机电装置例如微致动器（23）的固定部分（4）的连接元件（25）。 可移动部分（3）和固定部分（4）由沟槽（6）分开，并通过弹簧元件（12）机械连接，弹簧元件（12）与连接元件（25）一起确定微机电装置的扭转刚度。 每个连接元件（25）由更多的平行连接的子臂（26）形成，并且具有锚固到可动部分（3）的公共可移动锚固区域（26a）和锚固的公共固定锚固区域（26b） 到固定部分（5），因此连接元件（25）的机械阻力可以忽略不计。 子臂（26）的宽度（W）等于在单个连接元件的情况下所需的宽度的倍数，后者具有在设计中确定的预设电阻; 即子臂（26）的宽度等于单个连接元件的宽度除以子臂的数量。

公开(公告)号：EP1083144A1

公开(公告)日：2001-03-14

申请号：EP99830565.0

申请日：1999-09-10

Applicant: STMicroelectronics S.r.l.

Inventor： Zerbini, Sarah ,  Sassolini, Simone ,  Vigna, Benedetto

IPC: B81B5/00 ,  B81B3/00 ,  G01P15/135 ,  G01P15/125 ,  G01P15/08 ,  G01C19/56

CPC classification number: B81B3/0072 ,  B81B2201/0235 ,  B81B2203/0109 ,  G01C19/5684 ,  G01P15/0888 ,  G01P15/125

Abstract: A microelectromechanical structure (40) includes a rotor element (22) having a barycentric axis (G) and suspended regions (25) arranged a distance with respect to the barycentric axis. The rotor element (22) is supported and biased via a suspension structure (30, 45, 49) having a single anchoring portion (49) extending along the barycentric axis (G). The single anchoring portion (49; 73; 92) is integral with a body (41) of semiconductor material on which electric connections (50a) are formed.

Abstract translation: 微机电结构（40）包括具有重心轴线（G）的转子元件（22）和相对于重心轴布置一定距离的悬挂区域（25）。 转子元件（22）通过具有沿着重心轴线（G）延伸的单个锚定部分（49）的悬挂结构（30,45,49）被支撑和偏置。 单个锚固部分（49; 73; 92）与其上形成有电连接（50a）的半导体材料的主体（41）成一体。