公开(公告)号：US11715715B2

公开(公告)日：2023-08-01

申请号：US17200922

申请日：2021-03-15

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Ming-Ru Chen ,  Cheng-Chung Lo ,  Chin-Sheng Wang ,  Wen-Sen Tang

IPC: H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L25/0753 ,  H01L27/1214 ,  H01L33/62 ,  H01L2224/03312 ,  H01L2224/03552 ,  H01L2224/0401 ,  H01L2224/0518 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05193 ,  H01L2224/11464 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2933/0066

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

公开(公告)号：US11445596B2

公开(公告)日：2022-09-13

申请号：US17153856

申请日：2021-01-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Pei-Chang Huang

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00

Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

公开(公告)号：US20220238471A1

公开(公告)日：2022-07-28

申请号：US17200922

申请日：2021-03-15

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Ming-Ru Chen ,  Cheng-Chung Lo ,  Chin-Sheng Wang ,  Wen-Sen Tang

IPC: H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

公开(公告)号：US10515870B1

公开(公告)日：2019-12-24

申请号：US16029659

申请日：2018-07-09

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Pei-Chang Huang ,  Ra-Min Tain

IPC: H01L23/367 ,  H01L23/467 ,  H01L23/498

Abstract: A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.

公开(公告)号：US20190371704A1

公开(公告)日：2019-12-05

申请号：US16029659

申请日：2018-07-09

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Pei-Chang Huang ,  Ra-Min Tain

IPC: H01L23/467 ,  H01L23/498 ,  H01L23/367

Abstract: A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-peiuieable structure.

公开(公告)号：US20250149426A1

公开(公告)日：2025-05-08

申请号：US18895309

申请日：2024-09-24

Applicant: Unimicron Technology Corp.

Inventor： An-Sheng Lee ,  Chen-Hao Lin ,  Kai-Ming Yang ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Chin-Sheng Wang ,  Tzyy-Jang Tseng

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

Abstract: A package structure includes a package substrate, an organic interposer and an electronic unit. The package substrate includes a plurality of first pads. The organic interposer is disposed on the package substrate and includes a plurality of second pads. The second pads are directly connected to the first pads to electrically connected the organic interposer to the package substrate. At least one of each of the first pads and each of the second pads includes a pad portion and a plurality of contact portions connecting the pad portion. A first extension direction of the pad portion is different from a second extension direction of the contact portions. The electronic unit is disposed on the organic interposer, wherein the electronic unit is electrically connected to the package substrate through the organic interposer.

公开(公告)号：US12200861B2

公开(公告)日：2025-01-14

申请号：US17979754

申请日：2022-11-02

Applicant: Unimicron Technology Corp.

Inventor： Guang-Hwa Ma ,  Chin-Sheng Wang ,  Ra-Min Tain

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02

Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.

公开(公告)号：US11943877B2

公开(公告)日：2024-03-26

申请号：US17684421

申请日：2022-03-02

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Chin-Sheng Wang ,  Guang-Hwa Ma ,  Tzyy-Jang Tseng

IPC: H05K3/24 ,  H01L21/56 ,  H01L23/15 ,  H01L23/31 ,  H01L23/488 ,  H01L23/544 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K3/467 ,  H05K1/112 ,  H05K2201/0191

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

公开(公告)号：US20230335506A1

公开(公告)日：2023-10-19

申请号：US18338273

申请日：2023-06-20

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan

IPC: H01L23/552 ,  H01L23/66 ,  H01L21/52 ,  H01Q1/22 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/4817 ,  H01L21/52 ,  H01L23/66 ,  H01Q1/2283 ,  H01L23/49822

Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

公开(公告)号：US20200083142A1

公开(公告)日：2020-03-12

申请号：US16683266

申请日：2019-11-14

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Pei-Chang Huang

IPC: H01L23/42 ,  H01L23/498 ,  H01L23/18 ,  H01L23/367 ,  H01L23/467 ,  H01L23/14 ,  H01L21/48

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.