公开(公告)号：CN106997845A

公开(公告)日：2017-08-01

申请号：CN201710032252.6

申请日：2017-01-16

Applicant: 财团法人工业技术研究院

Inventor： 王朝仁 ,  何家充

IPC: H01L21/02 ,  H01L23/13 ,  H01L23/14

CPC classification number: H05K1/0281 ,  B29C37/0082 ,  B29C73/02 ,  B29K2995/0092 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/28 ,  H05K13/08 ,  H05K2201/0104 ,  H05K2203/16 ,  H01L23/14 ,  H01L21/02 ,  H01L23/13

Abstract: 本发明提供一种柔性衬底修补结构、制造方法及检测修补方法。柔性衬底修补结构包括柔性衬底与至少一修补层。柔性衬底具有规则凹陷。至少一修补层位于柔性衬底上且填满规则凹陷，其中至少一修补层的材料包括具有以下化学式(1)所示单元的聚硅氮烷化合物，其中Rx、Ry及Rz分别为氢原子或碳数为1～10的经取代的烷基、未经取代的烷基、烯基或芳香基。通过修补层的形成以避免或减少柔性衬底上的膜层产生裂纹或是断裂等问题。

公开(公告)号：CN106471035A

公开(公告)日：2017-03-01

申请号：CN201580036182.0

申请日：2015-07-01

Applicant: DIC株式会社

Inventor： 葭本泰代 ,  木下宏司

IPC: C08G59/32 ,  C08K3/00 ,  C08K7/02 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC classification number: C08G59/3218 ,  C08G59/32 ,  C08G59/5073 ,  C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K7/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/295 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/04541 ,  H01L2924/0463 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/0542 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/186 ,  H05K1/0203 ,  H05K1/0373 ,  H05K2201/0104

Abstract: 本发明提供一种电子材料用环氧树脂组合物，其含有为三缩水甘油基氧基联苯或四缩水甘油基氧基联苯的多官能联苯型环氧树脂和固化剂或固化促进剂中的至少一种。另外，本发明提供电子材料用环氧树脂组合物，其进一步含有填料特别是导热性填料。另外，本发明提供其使该电子材料用环氧树脂组合物固化而得到的固化物及含有该固化物的电子构件。

公开(公告)号：CN104517952A

公开(公告)日：2015-04-15

申请号：CN201410495957.8

申请日：2014-09-24

Applicant: 英飞凌科技股份有限公司

Inventor： A·阿伦斯 ,  J·赫格尔 ,  M·霍伊

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/055 ,  H01L21/60

CPC classification number: H05K1/111 ,  H01L21/56 ,  H01L23/3121 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K1/0256 ,  H05K1/144 ,  H05K1/181 ,  H05K3/28 ,  H05K3/284 ,  H05K7/1432 ,  H05K2201/0104 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: 本发明涉及一种功率半导体模块。根据本发明的一个示例该功率半导体模块具有电路板，该电路板具有布置在电路板的顶面上的结构化的第一金属结构和至少一个第二金属结构。在电路板的顶面上布置至少一个无壳体的半导体芯片，半导体芯片具有多个接触电极，这些接触电极又通过焊线与第一金属结构的相应的接触片在电路板的顶面上相连接。接触电极和相应的接触片的第一部分在运行时是高电压接通的。所有高电压接通的接触片通过内层连接与第二金属结构导电地连接。绝缘层完全覆盖芯片和围绕该芯片的电路板的分隔区域，其中所有高电压接通的接触片和内层连接被该绝缘层完全覆盖。多个接触电极和相应的接触片的第二部分在运行时处于低电压。

公开(公告)号：EP3035778B1

公开(公告)日：2018-10-03

申请号：EP14836058.9

申请日：2014-08-12

Applicant: Denka Company Limited

Inventor： HIROTSURU, Hideki ,  NONAKA, Shuhei ,  MITSUNAGA, Toshikatsu ,  IKARASHI, Koki ,  MIYATA, Kouji ,  NISHI, Taiki ,  INOUE, Saori ,  KOBAYASHI, Fumiya

IPC: H05K1/03 ,  C04B35/583 ,  C04B41/83 ,  H05K1/02

CPC classification number: H05K1/0271 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/004 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/38 ,  H05K2201/0104 ,  H05K2201/066

Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume% of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50µm, and 70 to 15 volume% of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150°C (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150°C (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

公开(公告)号：WO2013130418A1

公开(公告)日：2013-09-06

申请号：PCT/US2013/027717

申请日：2013-02-26

Applicant: APPLIED NANOTECH HOLDINGS, INC. ,  JIANG, Nan ,  YANIV, Zvi

Inventor： JIANG, Nan ,  YANIV, Zvi

IPC: B32B7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K7/20 ,  H01L23/373

CPC classification number: H05K1/053 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/181 ,  H05K3/12 ,  H05K2201/0104 ,  H05K2201/0137 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/10106 ,  H01L2924/00 ,  C04B35/522 ,  C04B41/4539 ,  C04B41/5001 ,  C04B41/5031 ,  C04B41/5089 ,  C04B41/5059 ,  C04B41/5092 ,  C04B41/522 ,  C04B41/5063 ,  C04B41/5064 ,  C04B41/4535 ,  C04B41/4572 ,  C04B41/5127

Abstract: Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.

Abstract translation: 不同种类的印刷浆料或油墨被用于各种组合以在石墨基材上形成多个陶瓷电介质层，以便产生有效的介电陶瓷层，其与石墨基材和印刷的铜迹线具有良好的粘合性，并具有很强的绝缘性能。 糊剂或油墨可以包含高导热性粉末。

公开(公告)号：EP3289838A1

公开(公告)日：2018-03-07

申请号：EP16770547.4

申请日：2016-04-27

Applicant: Centre National de la Recherche Scientifique ,  Universite d'Aix Marseille

Inventor： ALLONCLE, Anne Patricia Blanche ,  DELAPORTE, Philippe Christian Maurice

IPC: H05K3/02 ,  B41J2/475 ,  H05K3/04

CPC classification number: H05K3/1275 ,  H05K3/025 ,  H05K3/046 ,  H05K3/10 ,  H05K2201/0104 ,  H05K2201/0257 ,  H05K2203/0528 ,  H05K2203/0736 ,  H05K2203/108 ,  H05K2203/128

Abstract: The invention relates to a laser printing method comprising the following steps: (a) providing a receiving substrate (4); (b) providing a target substrate (5) including a transparent substrate (50), one face of which has a coating (51) formed by a solid metal film; (c) locally irradiating the film (51) through the transparent substrate (50) using a first laser (8) in order to reach the melting point of the metal in a target zone of the film that is in liquid form; (d) irradiating the liquid film through the transparent substrate using a second laser on the target zone defined in step (c), in order to form a liquid jet in the target zone and to eject same from the substrate in the form of molten metal; (e) depositing a drop of molten metal on a defined receiving zone of the receiving substrate, said drop solidifying as it cools.

公开(公告)号：EP3258751A1

公开(公告)日：2017-12-20

申请号：EP17176251.1

申请日：2017-06-15

Applicant: Nano Shield Technology Co., Ltd.

Inventor： Cheng Lee, James

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Abstract translation: 提供了一种用于使装置防水的方法和所得到的装置。 该装置包括印刷电路板组件（PCBA），其包括印刷电路板以及布置在印刷电路板上的至少一个电子部件。 诸如聚合物涂层的防水涂层设置在至少一个电子部件的至少一部分上或与其接触。 纳米膜布置在PCBA上。 纳米膜包括内涂层和外涂层。 内涂层设置在印刷电路板上或与防水涂层接触。 内涂层包含具有约5nm至约100nm范围内的粒径的金属氧化物纳米粒子。 外涂层与内涂层接触，并且包含具有0.1nm至10nm范围内的粒径的二氧化硅纳米粒子。

公开(公告)号：US20180220529A1

公开(公告)日：2018-08-02

申请号：US15937692

申请日：2018-03-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki KANBARA

IPC: H05K1/03 ,  C03C8/22 ,  H05K3/46

CPC classification number: H05K1/0306 ,  C03C3/062 ,  C03C3/089 ,  C03C4/04 ,  C03C8/22 ,  C03C8/24 ,  C03C14/006 ,  C03C2214/16 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  H01B3/02 ,  H05K1/03 ,  H05K3/46 ,  H05K2201/0104 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2203/1126

Abstract: A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10−6/° C. to 16×10−6/° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.

公开(公告)号：US20180199433A1

公开(公告)日：2018-07-12

申请号：US15742190

申请日：2016-08-02

Applicant: Soko Kagaku Co., Ltd. ,  Asahi Glass Company, Limited

Inventor： Akira HIRANO ,  Ko AOSAKI

IPC: H05K1/03 ,  H01L33/62 ,  H01L33/32 ,  H05K1/11 ,  H05K1/09 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K1/036 ,  H01L33/32 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2203/0228 ,  H05K2203/0548 ,  H05K2203/0759

Abstract: To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, the present invention provides a base 10 that comprises an insulating base material 11 and two or more metal films 12 and 13 that are formed on one side of the insulating base material 11 and electrically separated from each other. The two or more metal films are formed to include an upper surface and a side wall surface that are covered by gold or a platinum group metal, to be capable of mounting thereon one or more nitride semiconductor light-emitting elements and the like, and to have, as a whole, a predetermined planar view shape including two or more electrode pads. On the one side of the base material 11, along a boundary line between an exposed surface of the base material 11 that is not covered by the metal film 12, 13 and a side wall surface of the metal film 12, 13, at least a first part of the exposed surface of the base material 11 continuous with the boundary line that is sandwiched between two adjacent electrode pads and the side wall surfaces of the metal films 12 and 13 that oppose to each other with the first part interposed therebetween are covered by a fluororesin film 16, and a part of an upper surface of the metal film 12, 13 that composes at least the electrode pad is not covered by the fluororesin film 16.

公开(公告)号：US09986636B2

公开(公告)日：2018-05-29

申请号：US15476235

申请日：2017-03-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K3/02 ,  H05K1/03 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.