公开(公告)号：US20150124417A1

公开(公告)日：2015-05-07

申请号：US14289932

申请日：2014-05-29

Applicant: SAE Magnetics (H.K.) Ltd.

Inventor： Akio NAKAO ,  Hidenobu TAKEMOTO

IPC: H05K1/18

CPC classification number: H05K3/284 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K9/0024 ,  H05K9/0045 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/2072

Abstract: An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.

Abstract translation: 电子部件封装包括具有至少一个电子电路的基板; 用于密封电子电路的密封树脂，至少一个其上形成有至少一个裂纹的填料被填充在密封中; 以及形成在密封树脂的顶表面上的金属膜，金属膜的根部嵌入在填料上的裂纹中。 电子元件封装可以屏蔽环境电磁噪声，满足集成电路模块的轻量化要求。

公开(公告)号：US20240268021A1

公开(公告)日：2024-08-08

申请号：US18434910

申请日：2024-02-07

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Kiyohiro ISHIKAWA

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/16

CPC classification number: H05K1/05 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2203/0723

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.

公开(公告)号：US20240043654A1

公开(公告)日：2024-02-08

申请号：US18021632

申请日：2021-08-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Byeong Kyun CHOI ,  Min Young HWANG ,  Moo Seong KIM ,  Jin Seok LEE

IPC: C08K3/22 ,  C08K3/34 ,  H05K1/03 ,  H01L23/498

CPC classification number: C08K3/22 ,  C08K3/34 ,  H05K1/036 ,  H05K1/0373 ,  H01L23/49894 ,  H01L23/49822 ,  C08K2003/2244 ,  C08K2003/2241 ,  H05K2201/0242 ,  H05K2201/0209 ,  H05K2201/0269

Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler includes at least one concave portion provided on a surface, wherein a content of the filler has a range of 10 vol. % to 40 vol % of a total volume of the resin composition, and wherein a porosity corresponds to a volume occupied by the concave portion in a total volume of the filler and has a range of 20% to 35%.

公开(公告)号：US20180168036A1

公开(公告)日：2018-06-14

申请号：US15878398

申请日：2018-01-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09706650B1

公开(公告)日：2017-07-11

申请号：US15240133

申请日：2016-08-18

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：JP5905525B2

公开(公告)日：2016-04-20

申请号：JP2014138411

申请日：2014-07-04

Applicant: 新科實業有限公司 ,  SAE Magnetics(H.K.)Ltd.

Inventor： 中尾 彰夫 ,  竹本 秀伸

IPC: H01L21/56 ,  H01L23/28

CPC classification number: H05K3/284 ,  H05K9/0024 ,  H05K9/0045 ,  H05K1/0216 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/2072

公开(公告)号：TWI598402B

公开(公告)日：2017-09-11

申请号：TW105115622

申请日：2016-05-19

Applicant: 廣東生益科技股份有限公司 ,  SHENGYI TECHNOLOGY CO., LTD.

Inventor： 李輝 ,  方克洪 ,  許永靜

IPC: C08L63/00 ,  C08G59/40 ,  C08F222/08 ,  C08G73/06 ,  C08J5/24 ,  B32B27/38 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B15/092 ,  B32B27/38 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K13/02 ,  C08L35/06 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

公开(公告)号：TW201720870A

公开(公告)日：2017-06-16

申请号：TW105115622

申请日：2016-05-19

Applicant: 廣東生益科技股份有限公司 ,  SHENGYI TECHNOLOGY CO., LTD.

Inventor： 李輝 ,  方克洪 ,  許永靜

IPC: C08L63/00 ,  C08G59/40 ,  C08F222/08 ,  C08G73/06 ,  C08J5/24 ,  B32B27/38 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B15/092 ,  B32B27/38 ,  C08G59/40 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/4284 ,  C08G59/5046 ,  C08G59/621 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08K13/02 ,  C08L35/06 ,  C08L63/08 ,  C08L79/04 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0242

Abstract: 本發明係關於一種無鹵環氧樹脂組合物以及含有其之預浸料、層壓板及印刷電路板。前述無鹵環氧樹脂組合物，其包括環氧樹脂和固化劑，以環氧樹脂的環氧基總當量數為1，固化劑中與環氧基團發生反應的活性基團的當量數為0.5~0.95。本發明藉由控制環氧樹脂中環氧基和固化劑中活性基團的當量比為0.5~0.95，在保持低介電常數和低介質損耗的同時，確保了預浸料在不同固化溫度條件下Df值的穩定性。此外，使用該樹脂組合物製備的預浸料及層壓板，具有低介電常數、低介質損耗、優異的阻燃性、耐熱性、黏結性、低的吸水率及優異的耐濕性等綜合性能，適合在無鹵高多層電路板中使用。

Abstract in simplified Chinese: 本发明系关于一种无卤环氧树脂组合物以及含有其之预浸料、层压板及印刷电路板。前述无卤环氧树脂组合物，其包括环氧树脂和固化剂，以环氧树脂的环氧基总当量数为1，固化剂中与环氧基团发生反应的活性基团的当量数为0.5~0.95。本发明借由控制环氧树脂中环氧基和固化剂中活性基团的当量比为0.5~0.95，在保持低介电常数和低介质损耗的同时，确保了预浸料在不同固化温度条件下Df值的稳定性。此外，使用该树脂组合物制备的预浸料及层压板，具有低介电常数、低介质损耗、优异的阻燃性、耐热性、黏结性、低的吸水率及优异的耐湿性等综合性能，适合在无卤高多层电路板中使用。

公开(公告)号：CN203690294U

公开(公告)日：2014-07-02

申请号：CN201320700804.3

申请日：2013-11-07

Applicant: 新科实业有限公司

Inventor： 中尾彰夫 ,  竹本秀伸

IPC: H01L23/552

CPC classification number: H05K3/284 ,  H01L2924/3025 ,  H05K1/0216 ,  H05K9/0024 ,  H05K9/0045 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/2072

Abstract: 本实用新型的电子元件组件包括：具有电子电路的衬底；密封所述电子电路的密封树脂，所述密封树脂内填充有至少一填充物，所述填充物上形成有裂缝；以及金属膜，所述金属膜形成于所述密封树脂之表面，且所述金属膜的根部至少部分嵌入所述填充物的裂缝内。该电子元件组件能屏蔽外部环境的磁场噪音，且符合集成电路模块的薄型轻量化要求。