公开(公告)号：KR1020130000211A

公开(公告)日：2013-01-02

申请号：KR1020110060782

申请日：2011-06-22

Applicant: 삼성전자주식회사

Inventor： 안정석 ,  박상욱 ,  이충선 ,  김일환 ,  최광철 ,  김정환

IPC: H01L21/301 ,  H01L23/12

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/13025 ,  H01L2224/13101 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A substrate processing method is provided to omit UV or laser irradiation, thereby preventing damage to a wafer. CONSTITUTION: An intermediate layer(500) is formed between a substrate(100) and a carrier(300). The intermediate layer is adhered to the carrier. The intermediate layer includes a glue layer(200) and a release film(400). The carrier is combined with the substrate. A thin substrate is formed. The carrier and the intermediate layer are removed.

Abstract translation: 目的：提供基板处理方法以省略UV或激光照射，从而防止损坏晶片。 构成：在基板（100）和载体（300）之间形成中间层（500）。 中间层粘附到载体上。 中间层包括胶层（200）和脱模膜（400）。 载体与基底结合。 形成薄的衬底。 载体和中间层被去除。

公开(公告)号：KR1020120100299A

公开(公告)日：2012-09-12

申请号：KR1020110019099

申请日：2011-03-03

Applicant: 삼성전자주식회사

Inventor： 지영근 ,  황지환 ,  최광철 ,  김정환 ,  민태홍

IPC: H01L23/48 ,  H01L21/60

CPC classification number: B23K35/262 ,  B23K35/3013 ,  B23K35/3033 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PURPOSE: A semiconductor package equipped with a connecting member is provided to prevent the destruction of the connecting member by controlling a content ratio of gold of the connecting member which electrically interlinks a base substrate and a semiconductor chip, or semiconductor chips. CONSTITUTION: A bottom pad(13) is placed on the bottom(11) of a base substrate(10). A first semiconductor chip(20) is placed on the base substrate. The first semiconductor chip is sealed by a molding member(50). A first connecting member(30) provides an electrical connecting path between the base substrate and the first semiconductor chip. The first connecting member comprises a bottom pillar(32), a top pillar(34), and a first junction portion(36). The first junction portion has a first gold content ratio. A range of the first gold content ratio is 0.001at% to 24.3at%.

Abstract translation: 目的：提供一种配备有连接构件的半导体封装，通过控制连接构件的与金属基底基板和半导体芯片或半导体芯片电连接的金的含量比来防止连接构件的破坏。 构成：将底垫（13）放置在基底（10）的底部（11）上。 第一半导体芯片（20）被放置在基底基板上。 第一半导体芯片由模制构件（50）密封。 第一连接构件（30）提供在基底基板和第一半导体芯片之间的电连接路径。 第一连接构件包括底柱（32），顶柱（34）和第一接合部分（36）。 第一接合部分具有第一金含量比。 第一金含量范围为0.001at％至24.3at％。

公开(公告)号：KR1020120060665A

公开(公告)日：2012-06-12

申请号：KR1020100122280

申请日：2010-12-02

Applicant: 삼성전자주식회사

Inventor： 진정기 ,  임윤혁 ,  이충선 ,  김정환 ,  민태홍

IPC: H01L23/28 ,  H01L23/12

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/30519 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1435 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PURPOSE: A semiconductor package is provided to improve adhesion between a first molding unit and a second molding unit by arranging an adhesion unit between the first molding unit and the second molding unit. CONSTITUTION: A module board(20) is electrically connected to a semiconductor package(10). A first connection pattern(150) is arranged between a circuit board(140) and the module board. A connection substrate(108) includes a semiconductor substrate(100) and an interlayer insulation layer(102). A second connection pattern(110) electrically connects the circuit board and the connection substrate. A third connection pattern(132) electrically connects a semiconductor chip(130) and the connection substrate.

Abstract translation: 目的：提供半导体封装以通过在第一模塑单元和第二模塑单元之间布置粘合单元来改善第一模塑单元和第二模塑单元之间的粘附。 构成：模块板（20）电连接到半导体封装（10）。 第一连接图案（150）布置在电路板（140）和模块板之间。 连接衬底（108）包括半导体衬底（100）和层间绝缘层（102）。 第二连接图案（110）电连接电路板和连接基板。 第三连接图案（132）电连接半导体芯片（130）和连接基板。

公开(公告)号：KR1020110086352A

公开(公告)日：2011-07-28

申请号：KR1020100006034

申请日：2010-01-22

Applicant: 삼성전자주식회사

Inventor： 장형선 ,  권운성 ,  조태제 ,  강운병 ,  김정환

IPC: H01L27/146

CPC classification number: H01L31/18 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/13

Abstract: PURPOSE: A semiconductor package and a manufacturing method thereof are provided to form a second bonding pattern between a semiconductor chip and a transparent substrate, thereby reducing physical stress applied to the semiconductor chip. CONSTITUTION: A semiconductor chip comprises a first surface(11), a second surface, and a pixel area(PA). The semiconductor chip comprises an edge area(EA) that surrounds the pixel area. A first adhesive pattern(21) is located on the first surface of the semiconductor chip. A second adhesive pattern(31) is located between the first adhesive pattern and the pixel area. A conductive pad(41) is formed on the edge area of the first surface.

Abstract translation: 目的：提供半导体封装及其制造方法，以在半导体芯片和透明基板之间形成第二结合图案，从而减少施加到半导体芯片的物理应力。 构成：半导体芯片包括第一表面（11），第二表面和像素区域（PA）。 半导体芯片包括围绕像素区域的边缘区域（EA）。 第一粘合剂图案（21）位于半导体芯片的第一表面上。 第二粘合剂图案（31）位于第一粘合剂图案和像素区域之间。 导电焊盘（41）形成在第一表面的边缘区域上。

公开(公告)号：KR101037934B1

公开(公告)日：2011-05-30

申请号：KR1020040087591

申请日：2004-10-30

Applicant: 삼성전자주식회사

Inventor： 김정환 ,  경명호

IPC: G03G15/06

Abstract: 본 발명에 의한 전자 사진 프린터에서의 칼라 토너 현상농도 보정 방법은 전자사진 칼라 프린터의 벨트에 기준 칼라토너를 형성시킨 후 가시광선에 투사된 상기 기준 토너에 대한 난반사 광출력치를 통해 광센서의 캘리브레이션과 상기 기준 토너의 농도측정 및 농도를 보정하는 과정; 상기 기준 토너의 현상농도의 균일성이 확보되면 보정된 농도로 상기 기준 토너를 형성하고, 상기 기준 토너상에 보정하고자 하는 나머지 각 칼라 토너의 패치를 형성하는 과정; 상기 각 칼라 토너에 대한 농도를 측정하는 과정; 및 상기 각 칼라 토너의 농도치가 사전에 설정된 기준 TRC에 근접할 때까지 농도를 제어하는 과정;을 포함함을 특징으로 한다.
본 발명에 의하면 벨트의 표면손상이나 벨트 교체에 따른 벨트의 반사율 변경에 구애받지 않고 안정되게 현상 농도를 보정할 수 있다.

公开(公告)号：KR1020110039002A

公开(公告)日：2011-04-15

申请号：KR1020090096248

申请日：2009-10-09

Applicant: 삼성전자주식회사

Inventor： 윤장희 ,  김정환 ,  이세라

IPC: G03G15/01

CPC classification number: G03G15/1605 ,  G03G15/0194 ,  G03G2215/0132 ,  G03G2215/1614

Abstract: PURPOSE: An image forming apparatus is provided to efficiently control the toner transfer from a photoconductor to a middle transfer body in order to form a color image. CONSTITUTION: A light scanning unit emits the light modulated according to an image signal, and a photoconductive drum has an electrostatic latent image formed by the light emitted from the plural light scanning units. Plural developers develop the electrostatic latent image formed each photoconductive drum into a toner image. A middle transfer belt(140) transfers the toner images developed by the plural photoconductive drums, and a first transfer roller is installed inside the middle transfer belt to apply transfer voltage for transferring the toner images to the middle transfer belt. A second transfer roller transfers the developed image formed in the middle transfer body onto a paper.

Abstract translation: 目的：提供一种图像形成装置，以有效地控制从感光体到中间转印体的调色剂转印，以形成彩色图像。 构成：光扫描单元发射根据图像信号调制的光，并且感光鼓具有由从多个光扫描单元发射的光形成的静电潜像。 多个显影剂将形成每个感光鼓的静电潜像显影成调色剂图像。 中间转印带（140）转印由多个感光鼓显影的调色剂图像，并且第一转印辊安装在中间转印带内部，以施加用于将调色剂图像转印到中间转印带的转印电压。 第二转印辊将形成在中间转印体中的显影图像转印到纸上。

公开(公告)号：KR1020110038330A

公开(公告)日：2011-04-14

申请号：KR1020090095576

申请日：2009-10-08

Applicant: 삼성전자주식회사

Inventor： 김정환

IPC: G06F17/30 ,  G06F17/00

CPC classification number: G06F17/30902 ,  G06F17/3064 ,  G06F17/30876

Abstract: PURPOSE: A cache utilizing system of a web browser and method thereof are provided to easily search for second network address related to a first network address by using a cache of the web browser. CONSTITUTION: A cache manager(110) searches for a second network address from a browser cache(130). The second network address includes an address which is inputted on an address window. A cache representing unit(140) offers the searched second network address. An input sensor(120) is connected to the first network address and searches for a sibling search. The cache manager searches for the second network address according to a sibling search.

Abstract translation: 目的：提供利用网络浏览器的缓存及其方法的缓存，通过使用网页浏览器的缓存来容易地搜索与第一网络地址相关的第二网络地址。 构成：缓存管理器（110）从浏览器高速缓存（130）搜索第二网络地址。 第二网络地址包括在地址窗口上输入的地址。 高速缓存表示单元（140）提供搜索到的第二网络地址。 输入传感器（120）连接到第一网络地址并搜索同级搜索。 缓存管理器根据兄弟搜索搜索第二个网络地址。

公开(公告)号：KR1020100023622A

公开(公告)日：2010-03-04

申请号：KR1020080082494

申请日：2008-08-22

Applicant: 삼성전자주식회사

Inventor： 김정환 ,  경명호

IPC: G03G15/00

CPC classification number: G03G15/1605 ,  G03G2215/1623

Abstract: PURPOSE: An image forming apparatus and a control method thereof are provided to reduce an image defect or an image concentration change occurring due to a posture change of a printing medium. CONSTITUTION: An image forming apparatus and a control method thereof include a unit to be transferred(130), a transfer unit(120), a power supply unit and a controller. A visible image is formed on the surface of the unit to be transferred. The transfer unit forms a transfer area nip. The power supply unit supplies power to the transfer unit to form a transfer electric field on the transfer area. The controller controls the power supply unit to supply different first to third power to the transfer unit while the first to third areas of the printing medium pass a transfer area.

Abstract translation: 目的：提供一种图像形成装置及其控制方法，以减少由于打印介质的姿势变化而引起的图像缺陷或图像浓度变化。 构成：图像形成装置及其控制方法包括要传送的单元（130），传送单元（120），电源单元和控制器。 在要传输的单元的表面上形成可见图像。 转印单元形成转印区域压区。 电源单元向传送单元供电以在传送区域上形成传送电场。 控制器控制电源单元向打印介质提供不同的第一至第三功率，同时打印介质的第一至第三区域通过传送区域。

公开(公告)号：KR1020090126133A

公开(公告)日：2009-12-08

申请号：KR1020080052321

申请日：2008-06-03

Applicant: 삼성전자주식회사

Inventor： 김정환 ,  경명호

IPC: G03G15/00

CPC classification number: G03G15/6558 ,  B65H5/36 ,  B65H2301/3121 ,  G03G15/235 ,  G03G2215/00409 ,  G03G2215/00675

Abstract: PURPOSE: A printing medium guide structure and an image forming apparatus using the same are provided to install a separate vibration reducing unit, thereby reducing defects of image quality of an image transferred on a rear part of the printing medium. CONSTITUTION: A guide unit(61) changes the moving direction of a printing medium from a printing medium supply direction to the entry direction of a printing medium. The printing medium is supplied from a medium supply unit in the printing medium supply direction. When the printing medium is separated from the guide unit, a vibration reducing unit(70) reduces shaking and vibrating of a rear part of the printing medium.

Abstract translation: 目的：提供一种打印介质引导结构和使用其的图像形成装置来安装单独的减振单元，从而减少在打印介质的后部传送的图像的图像质量的缺陷。 构成：引导单元（61）将打印介质的移动方向从打印介质供给方向改变到打印介质的输入方向。 打印介质从打印介质供给方向的介质供给单元供给。 当打印介质与引导单元分离时，减振单元减少打印介质的后部的振动和振动。

公开(公告)号：KR1020090089075A

公开(公告)日：2009-08-21

申请号：KR1020080014423

申请日：2008-02-18

Applicant: 삼성전자주식회사

Inventor： 서영일 ,  김효준 ,  김정환 ,  안성준 ,  김영봉 ,  박찬호

IPC: G11C16/04

CPC classification number: G11C16/06 ,  G06F12/0246 ,  G11C11/5628

Abstract: A nonvolatile memory device is provided to control the performance and capacitance according to the purpose of a user by controlling the size of a first logic volume and a second logic volume dynamically. A non-volatile memory device includes a nonvolatile memory cell array, a controller(450), and a user interface(470). The non-volatile memory device includes two bit multi-level cells. The nonvolatile memory cell array is divided into the first logic volume and the second logic volume. The first logic volume uses one bit for writing and reading. The second logic volume uses two bits for writing and reading. The controller dynamically determines the volume of the first and second logic volume according to the selection of the user. The user selects the size of the first and second logic volumes.

Abstract translation: 提供非易失性存储器件，用于通过动态地控制第一逻辑卷和第二逻辑卷的大小来根据用户的目的来控制性能和电容。 非易失性存储器件包括非易失性存储单元阵列，控制器（450）和用户界面（470）。 非易失性存储器件包括两位多电平单元。 非易失性存储单元阵列被分成第一逻辑卷和第二逻辑卷。 第一个逻辑卷使用一个位进行写入和读取。 第二个逻辑卷使用两位写入和读取。 控制器根据用户的选择动态地确定第一和第二逻辑卷的音量。 用户选择第一和第二逻辑卷的大小。