Abstract:
An electromechanical resonator and a manufacturing method thereof are provided to form a vibrator through a fixed electrode and a gap and to form a large region and a narrow region in the gap for obtaining high mechanical strength. An electromechanical resonator comprises a resonating part having a fixed electrode(107) and a vibrator(109) formed through the fixed electrode and a gap. The gap includes first and second regions(113,111). The second region is large enough to ignore capacitance between the fixed electrode and the vibrator. The vibrator has air gaps. The air gaps have a large gap and a narrow gap. Maximum electrostatic force is generated at the narrow gap between the vibrator and the fixed electrode. A first insulating layer(103) is formed on a material substrate(101).
Abstract:
본 발명은 전자 회로와 종방향으로 집적된 음향 공진기를 포함하는 모노리식 장치((monolithic devices)에 관해 개시한다. 일측면에서, 모노리식 집적 장치(150)는 기판(156)과, 기판(156)에 의해 지지되는 전자 회로(154)와, 전자 회로(154) 위의 음향 격리기(acoustic isolator)(158)와, 음향 격리기(158) 위의 음향 공진기(152)를 포함한다. 또한, 모노리식 장치(150)를 제조하는 방법에 대해서도 개시한다.
Abstract:
Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.
Abstract:
In one embodiment, a method of forming an out-of-plane electrode includes forming an oxide layer above an upper surface of a device layer, etching an etch stop perimeter defining trench extending through the oxide layer, forming a first cap layer portion on an upper surface of the oxide layer and within the etch stop perimeter defining trench, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the deposited first material portion, and vapor releasing a portion of the oxide layer with the etch stop portion providing a lateral etch stop.
Abstract:
The invention concerns a micromechanical device and method of manufacturing thereof. The device comprises an oscillating or deflecting element (16) made of semiconductor material comprising n-type doping agent and excitation or sensing means (10, 14) functionally connected to said oscillating or deflecting element (16). According to the invention, the oscillating or deflecting element (16) is essentially homogeneously doped with said n-type doping agent. The invention allows for designing a variety of practical resonators having a low temperature drift.
Abstract:
La présente invention concerne un dispositif résonant à détection dans le plan piézorésistive réalisé en technologies de surfaces sur un substrat, qui comprend un résonateur (10) relié à ce substrat par au moins un encastrement (12), des moyens d'excitation (14) de ce résonateur et des moyens de détection comprenant au moins une jauge de contrainte de type poutre suspendue réalisée en matériau piézorésistif (11), dans lequel chaque jauge de contrainte a un plan commun avec le résonateur, et est relié à ce résonateur (10) en un point situé en dehors de cet au moins un encastrement (12) pour augmenter 1a contrainte vue par cette jauge de contrainte.