Abstract:
An electro-optical apparatus comprising an electro-optical panel including a display section, a flexible printed circuit board, and a rigid circuit board. The flexible printed circuit board includes a first terminal connected to the electro-optical panel and a second terminal connected to an external circuit. The rigid circuit board includes a first surface on which electronic components are mounted and a second surface mounted to the flexible printed circuit board. The second surface of the rigid circuit board is opposite to the first surface. An entirety of the rigid circuit board is stacked on the flexible printed circuit board within the flexible printed circuit board. The rigid circuit board is electrically connected to the flexible printed circuit board. The flexible printed circuit board is bent toward the external circuit.
Abstract:
PROBLEM TO BE SOLVED: To provide a memory system where power source supply to a memory module is improved. SOLUTION: This memory system (12) includes the memory module (20) having a circuit board (32) and a memory device (34) connected to the circuit board. The circuit board has an engaging socket contact (90) in a socket interface (80), and a voltage regulator module (VRM) contact (100) in a VRM interface (84). The memory device is electrically connected to the engaging socket contact and the VRM contact. A VRM (30) is coupled to the circuit board through the VRM interface. The VRM has an engaging contact (102) directly connected to the VRM contact. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To manufacture a new memory module, particularly, relatively simply and easily. SOLUTION: The memory module with extended memory capacity, memory module system, and memory module include at least one of memory devices (111a, 111b, 212a, and 212b) and one of connector means (110 and 210) for connecting memory modules (100 and 200) to a computer (1). The memory modules (100 and 200) further include surface-mounted connector means (103a, 103b, 103c, 203a, 203b, and 203c) for connecting the memory modules with extended memory capacity (102 and 202) to the memory modules (100 and 200). In the method for manufacturing the memory modules (100 and 101), at least one of the memory devices (111a, 111b, 212a, and 212b) and at least one of the connector means (103a, 103b, 103c, 203a, 203b, and 203c) are connected to the memory modules (100 and 200) at a single manufacturing step. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.
Abstract:
Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.
Abstract:
A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.
Abstract:
An integrated power module packaging structure includes a housing, a first circuit board, a second circuit board, a first pin, a second pin and a third pin. The housing has a cavity. The second circuit board is located above the first circuit board, and both them are received in the cavity. A switching module is disposed on the first circuit board. A high side current/voltage detecting device and a driving device are disposed on the second circuit board. The first pin, the second pin and the third pin are disposed between the first circuit board and the second circuit board. The first pin connects the high side current/voltage detecting device and the switching module in series. The second pin connects the switching module. The driving device controls the switching module through the third pin.
Abstract:
A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.
Abstract:
In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.