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    Printed circuit board laminate
    194.
    发明专利
    Printed circuit board laminate 有权
    印刷电路板层压板

    公开(公告)号：JP2014138126A

    公开(公告)日：2014-07-28

    申请号：JP2013006760

    申请日：2013-01-17

    Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    Inventor： SEOK WEN-CHIEH

    IPC: H05K1/14 ,  H02G3/16

    CPC classification number: H05K1/144 ,  H01R12/523 ,  H05K7/026 ,  H05K2201/042 ,  H05K2201/10181 ,  H05K2201/10295 ,  H05K2201/10303

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board laminate of novel structure which allows for connection of the printed wires on printed circuit boards, arranged to face each other across a gap, with enhanced workability and connection stability.SOLUTION: In a first printed circuit board 18 and a second printed circuit board 20 arranged to face each other across a gap, a first tuning fork terminal 26 soldered to a printed wire 32 is stood on the first printed circuit board 18, and a second tuning fork terminal 34 soldered to a printed wire 36 is stood on the second printed circuit board 20. The printed wire 32 of the first printed circuit board 18, and the printed wire 36 of the second printed circuit board 20 are brought into conduction via a conduction member 56 including a pair of connections 57, 57 that are pressed between pressure contact blades 28, 28 of the first and second tuning fork terminal 26, 34.

    Abstract translation: 要解决的问题：提供一种新颖结构的印刷电路板层压板，其允许连接印刷电路板上的印刷电线，布置成跨越间隙彼此面对，具有增强的可加工性和连接稳定性。解决方案：在第一印刷 电路板18和布置成跨越间隙彼此相对的第二印刷电路板20，将焊接到印刷线32的第一音叉端子26放置在第一印刷电路板18上，并且将第二音叉端子34焊接到 印刷线36被放置在第二印刷电路板20上。第一印刷电路板18的印刷线32和第二印刷电路板20的印刷线36经由包括一对的导电部件56导通 连接件57,57被压在第一和第二音叉端子26,34的压力接触片28,28之间。

    Heat radiator
    196.
    发明专利
    Heat radiator 有权
    散热器

    公开(公告)号：JP2012256714A

    公开(公告)日：2012-12-27

    申请号：JP2011128830

    申请日：2011-06-09

    Applicant: Toyota Industries Corp ,  株式会社豊田自動織機

    Inventor： SATO SHINYA ,  FUKASAKU HIROSHI

    IPC: H05K7/20 ,  H01L23/12 ,  H05K9/00

    CPC classification number: H05K1/0204 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K2201/10303 ,  H05K2201/10409 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a heat radiator which radiates heat of a power source layer that is an inner layer of a multi-layer printed board and shields electromagnetic noise that may be emitted as the heat is radiated.SOLUTION: A heat radiator includes: a heat radiation member connecting with a power source layer, which is an inner layer of a multi-layer printed board on which electronic components are mounted, so as to conduct heat and also electrically connecting therewith; and a multi-layer printed board for heat radiation which has a heat radiation layer connecting with the heat radiation member so as to conduct heat and also electrically connecting therewith and a shield layer shielding electromagnetic noise emitted from the heat radiation layer and further has a structure where the heat radiation layer is electrically insulated from the shield layer and the heat radiation member is electrically insulated from the shield layer when the heat radiation member connects with the heat radiation layer. The shield layer electrically connects with a grounded housing, and the heat radiation layer connects with the housing through an insulation body so as to conduct heat.

    Abstract translation: 要解决的问题：提供散热作为多层印刷电路板的内层的电源层的热量的散热器，并且屏蔽当散热时可能发射的电磁噪声。 解决方案：散热器包括：与电源层连接的散热构件，电源层是电子部件安装在其上的多层印刷电路板的内层，以便传导热量并与其电连接 ; 以及用于散热的多层印刷电路板，其具有与散热构件连接以散热并且与其电连接的散热层，屏蔽层屏蔽从散热层发射的电磁噪声，并且还具有结构 其中当散热构件与散热层连接时，散热层与屏蔽层电绝缘，并且散热构件与屏蔽层电绝缘。 屏蔽层与接地壳体电连接，并且散热层通过绝缘体与壳体连接以便传导热量。 版权所有（C）2013，JPO＆INPIT

    Substrate for terminal
    197.
    发明专利
    Substrate for terminal 审中-公开
    板端子

    公开(公告)号：JP2011077022A

    公开(公告)日：2011-04-14

    申请号：JP2010085374

    申请日：2010-04-01

    Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    Inventor： GOTO HIDENORI

    IPC: H01R12/51 ,  H01R12/53 ,  H01R12/55

    CPC classification number: H05K3/308 ,  H01R12/58 ,  H01R43/16 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10848

    Abstract: PROBLEM TO BE SOLVED: To provide a board terminal which is easy to handle and capable of preventing occurrence of solder cracks in a state attached to a printed circuit board, and has a novel structure. SOLUTION: By using a cutting wire material 12 of a metal wire material cut in a prescribed length, since recess flattening work parts 16, 16 are formed in the outer peripheral faces 14a, 14b of an intermediate part of a length direction of the cutting wire material 12, a curved part 20 is formed without forming a protruding part extending sideward, and rigidity can be reduced, an elastically deformable part against an exterior force is formed. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种易于处理并能够防止在连接到印刷电路板的状态下发生焊料裂纹的电路板端子，并且具有新颖的结构。 解决方案：通过使用切割成规定长度的金属丝材料的切割线材料12，由于凹部平坦化工件16,16形成在长度方向的中间部分的外周面14a，14b中 切割线材料12，弯曲部分20形成而不形成向侧面延伸的突出部分，并且可以降低刚性，形成抵抗外力的可弹性变形部分。 版权所有（C）2011，JPO＆INPIT

    Part-incorporated printed wiring board, method for manufacturing the wiring board, and electronic apparatus
    198.
    发明专利
    Part-incorporated printed wiring board, method for manufacturing the wiring board, and electronic apparatus 审中-公开
    部件印刷布线板，制造布线板的方法和电子设备

    公开(公告)号：JP2009290021A

    公开(公告)日：2009-12-10

    申请号：JP2008141482

    申请日：2008-05-29

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： SUZUKI DAIGO

    IPC: H05K3/46

    CPC classification number: H05K1/0206 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0959 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10409 ,  Y10T29/49126

    Abstract: PROBLEM TO BE SOLVED: To obtain a part-incorporated printed wiring board which is provided with a heat dissipation metal having an external connection electrode in through structure. SOLUTION: A part-incorporated printed wiring board comprises a heat dissipation metal member 32 which is provided on the outer layer side of a first base 11 through an insulating layer 31 except a fixing portion H, a through-hole Ph which is formed to penetrate the first and second bases 11 and 12 and to communicate with the fixing portion H, and through conductors 16a and 16b of two-layer structures provided on the inner wall of the through-hole Ph. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：获得具有通过结构具有外部连接电极的散热金属的部分合并印刷线路板。 解决方案：一体式印刷电路板包括散热金属部件32，该散热金属部件32通过除了固定部分H之外的绝缘层31设置在第一基体11的外层一侧，通孔Ph是 形成为穿透第一和第二基座11和12并与固定部分H连通，并且穿过设置在通孔Ph的内壁上的两层结构的导体16a和16b。（C ）2010，JPO＆INPIT

    Press-fit pin and substrate structure
    200.
    发明专利
    Press-fit pin and substrate structure 审中-公开
    压接引脚和基板结构

    公开(公告)号：JP2008210974A

    公开(公告)日：2008-09-11

    申请号：JP2007045850

    申请日：2007-02-26

    Applicant: Hitachi Ltd ,  株式会社日立製作所

    Inventor： SUEYOSHI JUNYA

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K3/308 ,  H01R12/585 ,  H05K3/325 ,  H05K2201/092 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10878

    Abstract: PROBLEM TO BE SOLVED: To suppress an electrostatic capacity of a through-hole of a high density/highly-multilayered printed-circuit board for transmitting a high-speed signal. SOLUTION: The through-hole for press fittig a press-fit pin is formed to the printed-circuit board of this invention. The printed-circuit board comprises at least one signal transmission layer, a wiring pattern for signal transmission formed to at least the one signal transmission layer, and an electrode part of the wiring pattern for signal transmission exposing on an inner circumferential surface of the through-hole. The electrode is formed not on the whole inner circumferential surface of the through-hole, but on only a part of it. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 解决的问题：抑制用于传输高速信号的高密度/高度多层印刷电路板的通孔的静电电容。 解决方案：本发明的印刷电路板形成有用于压入压配合销的通孔。 印刷电路板包括至少一个信号传输层，至少形成在一个信号传输层上的用于信号传输的布线图形，以及用于信号传输的布线图案的电极部分，其在通孔的内圆周表面上露出， 孔。 电极不形成在通孔的整个内周面上，而是仅形成在其一部分上。 版权所有（C）2008，JPO＆INPIT

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