公开(公告)号：CN1211914C

公开(公告)日：2005-07-20

申请号：CN02119708.3

申请日：2002-05-10

Applicant: 三星电机株式会社

Inventor： 金亨坤

IPC: H03B5/32 ,  H01L41/08 ,  H01L41/22

CPC classification number: H05K1/141 ,  H03H3/04 ,  H03H9/08 ,  H05K1/0201 ,  H05K2201/049 ,  H05K2201/10075 ,  H05K2201/10515 ,  H05K2201/2018

Abstract: 揭示了一种温度补偿式晶体振荡器，它通过在主板上放置环形盘以在主板上安装温度补偿部件、并在环形盘上放置晶体封装来制造。主板上部件安装区域减小了，因此减小了产品尺寸。至少一个导电焊盘固定在环形盘上以将晶体封装和主板上的某个电路连接。该导电焊盘在矩型环形盘的情况下可以设置在环形盘四角的每一个角上。本发明还提供了一种制造温度补偿式晶体振荡器的方法。

公开(公告)号：CN1209002C

公开(公告)日：2005-06-29

申请号：CN01136390.8

申请日：2001-10-12

Applicant: 矽峰光电科技股份有限公司

Inventor： 丁玉祥

IPC: H05K13/04 ,  H05K3/30 ,  H04N1/028

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/2018 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00

Abstract: 一种影像感测器的对位方法，包含以下步骤：提供一电路基板及一影像感测元件；提供一对位装置，以将该影像感测元件与该电路基板对位；组装该电路基板、该影像感测元件以及该对位装置，以便维持该影像感测元件和该电路基板相结合的准确性和一致性。一种影像感测器的对位装置，包含一具凹座和中央开口的框体，其中该凹座可收纳影像感测元件，且该开口的周缘尺寸小于该影像感测元件的外周缘尺寸，该对位装置可将该影像感测元件精确地组装于电路基板上。

公开(公告)号：CN1607892A

公开(公告)日：2005-04-20

申请号：CN200410087441.6

申请日：2004-06-04

Applicant: 佳能株式会社

Inventor： 平野康二

IPC: H05K1/14

CPC classification number: H05K3/361 ,  H05K3/284 ,  H05K2201/10136 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/0126 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: 本发明涉及增强扁平电缆部件连接的方法及制造图像显示装置的方法，尤其，披露了一种通过增强材料增强基板上形成的导线与扁平电缆部件之间的连接的方法。该方法包括输送液体的步骤，和硬化液体以形成增强材料的步骤。所述输送液体的步骤包括使连接扁平电缆部件的基板靠近夹具、然后将液体输送到增强材料将要形成的区域，同时防止液体流出夹具。

公开(公告)号：CN1543701A

公开(公告)日：2004-11-03

申请号：CN03800788.6

申请日：2003-04-04

Applicant: 佳能株式会社

Inventor： 铃木仁

IPC: H02M3/28

CPC classification number: H05K1/141 ,  H02M3/00 ,  H02M3/28 ,  H02M3/33561 ,  H05K1/18 ,  H05K3/225 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/176

Abstract: 本发明涉及开关电源装置，其中具有相对短的使用寿命的可更换的元件例如电解电容器被安装在可再使用的印刷电路板和一个或几个可更换的印刷电路板上，使得可以非常容易和可靠地进行更换电解电容器的操作。可更换的印刷电路板最好被装配在可更换框架上，并替换所述可更换框架。一次侧可更换的电子元件和二次侧可更换的电子元件可被安装在同一个可更换的印刷电路板。

公开(公告)号：CN1461517A

公开(公告)日：2003-12-10

申请号：CN02801252.6

申请日：2002-04-17

Applicant: 东洋通信机株式会社

Inventor： 高梨仁 ,  内山常雄 ,  永野洋二 ,  堀江协 ,  渡边纪之 ,  四位和宏

IPC: H03B5/32

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: 本发明针对具备：在将构成振荡电路或温度补偿电路等的电子零件加以承载的配线基板的上部使用柱构件来固定组件化之后的压电振动子的构造的压电振荡器，其目的为提供一种可除去柱构件尺寸的散乱不齐或在回焊时的柱构件的载置误差等、可靠度高且作业效率优异的压电振荡器，它具备：配线基板，该配线基板的顶面的接合区上，承载构成振荡电路和温度补偿电路的多个电子零件，同时具有外部电极；及水晶振动子，此水晶振动子经由固定在该配线基板顶面上的柱构件隔开规定的间隔而被固定的形态。此外，将柱构件的底部电极导电地机械固定在形成在配线基板的顶面上的柱构件固定用图案上，而将柱构件的上部电极，与水晶振动子的底面电极，导电地机械固定。

公开(公告)号：EP3122163B1

公开(公告)日：2018-10-17

申请号：EP16169437.7

申请日：2016-05-12

Applicant: Illinois Tool Works, Inc.

Inventor： BORNEMANN, Brian J. ,  HENRY, Andrew J.

IPC: H05K3/28 ,  H05K7/14 ,  H05K7/20 ,  B23K9/10 ,  B23K9/16 ,  B23K9/32

CPC classification number: B23K9/1043 ,  B23K9/16 ,  B23K9/32 ,  H05K3/284 ,  H05K7/1432 ,  H05K7/20918 ,  H05K2201/09972 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: A method and apparatus for providing welding type power is disclosed. At least one circuit board 307 is used that is partially potted using a potting barrier 303 affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.

公开(公告)号：EP3363272A1

公开(公告)日：2018-08-22

申请号：EP16790783.1

申请日：2016-10-12

Applicant: Google LLC

Inventor： COOPER, James ,  LILJE, Joshua Norman

IPC: H05K9/00 ,  H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

公开(公告)号：EP2433479B1

公开(公告)日：2018-08-15

申请号：EP10784886.3

申请日：2010-05-11

Applicant: Raytheon Company

Inventor： GESWENDER, Chris, E.

IPC: H05K7/14

CPC classification number: H05K1/144 ,  F42B15/08 ,  F42B30/006 ,  F42C19/06 ,  H05K7/1434 ,  H05K2201/09027 ,  H05K2201/10378 ,  H05K2201/2018

Abstract: An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.

公开(公告)号：EP2306599B1

公开(公告)日：2018-02-28

申请号：EP10181103.2

申请日：2010-09-28

Applicant: VALEO VISION

Inventor： Nicolai, Jean-Marc ,  Thullier, Christophe

IPC: H01R12/62 ,  F21S8/10 ,  H05K1/14 ,  H01R12/57 ,  F21Y115/10

CPC classification number: F21V21/34 ,  F21S41/143 ,  F21S41/155 ,  F21S41/192 ,  F21Y2115/10 ,  H01R12/57 ,  H01R12/62 ,  H05K1/147 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/167

公开(公告)号：EP2685797B1

公开(公告)日：2017-12-13

申请号：EP11777176.6

申请日：2011-05-06

Applicant: Huawei Device Co., Ltd.

Inventor： YANG, Jun ,  ZHOU, Liechun ,  LI, Hualin ,  WU, Xijie

IPC: H05K7/20 ,  H05K9/00 ,  H01L23/552 ,  H01L23/00 ,  H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; and the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, and the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.