公开(公告)号：US20140151107A1

公开(公告)日：2014-06-05

申请号：US13845325

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHENG-MING WENG ,  WEI-MING CHENG ,  HAN-PEI HUANG

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

公开(公告)号：US08536456B2

公开(公告)日：2013-09-17

申请号：US13156359

申请日：2011-06-09

Applicant: Yung-Chieh Chen ,  Shou-Kuo Hsu ,  Hsien-Chuan Liang ,  Shin-Ting Yen ,  Dan-Chen Wu

Inventor： Yung-Chieh Chen ,  Shou-Kuo Hsu ,  Hsien-Chuan Liang ,  Shin-Ting Yen ,  Dan-Chen Wu

IPC: H05K1/09

CPC classification number: H05K1/0251 ,  H05K1/0245 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09836

Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.

Abstract translation: 印刷电路板依次包括第一信号层，第一参考层，第二信号层和第三信号层，并且包括第一倾斜通孔和第二倾斜通孔。 第一信号层包括并行的第一传输线和第二传输线。 第一和第二传输线彼此耦合并协同地构成具有边缘耦合结构的第一差分对。 第二信号层包括第三传输线。 第三信号层包括与第三传输线并联并与第三传输线耦合的第四传输线。 第三和第四传输线协作地构成具有宽侧耦合结构的第二差分对。 第一倾斜地倾斜地在第一传输线和第三传输线之间互连。 第二倾斜地倾斜地在第二传输线和第四传输线之间互连。

公开(公告)号：US20130126590A1

公开(公告)日：2013-05-23

申请号：US13655555

申请日：2012-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

公开(公告)号：US08324506B2

公开(公告)日：2012-12-04

申请号：US12641498

申请日：2009-12-18

Applicant: Tomoyuki Ikeda

Inventor： Tomoyuki Ikeda

IPC: H05K1/03

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

公开(公告)号：US08322031B2

公开(公告)日：2012-12-04

申请号：US12211529

申请日：2008-09-16

Applicant: Chin Hui Chong ,  Choon Kuan Lee

Inventor： Chin Hui Chong ,  Choon Kuan Lee

IPC: H01K3/10

CPC classification number: H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

Abstract translation: 本文公开了具有倾斜通孔的电路板，微电子器件和其它设备。 在一个实施例中，用于互连电子部件的装置包括具有第一表面和第二表面的电介质部分。 第一端子设置在电介质部分的第一表面上，用于连接到第一电子部件。 第二端子设置在电介质部分的第二表面上，用于连接到第二电子部件。 该装置还包括沿着相对于第一表面以倾斜角定向的纵向轴线延伸通过电介质部分的通道。 该通道至少部分地填充有将第一端子与第二端子电连接的导电材料。

公开(公告)号：US20120261179A1

公开(公告)日：2012-10-18

申请号：US13529729

申请日：2012-06-21

Applicant: Satoshi YAMAMOTO ,  Takanao SUZUKI ,  Masami MATSUYAMA

Inventor： Satoshi YAMAMOTO ,  Takanao SUZUKI ,  Masami MATSUYAMA

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

Abstract translation: 本发明的内插基板包括平面基板和通孔布线，该通孔布线通过填充将该基板的第一主表面和第二主表面连接在一起的通孔而形成。 当在基板的垂直剖视图中看到通孔时，通孔具有梯形，其侧壁由通孔的内表面形成，并且梯形的两个侧面不平行于每个 其他。 梯形的两个侧面都相对于形成梯形的顶面或底面的两个顶点处垂直于第一主表面或第二主表面的两条垂直线而朝向相同侧倾斜。

公开(公告)号：US08174116B2

公开(公告)日：2012-05-08

申请号：US12674761

申请日：2008-08-25

Applicant: Koichiro Masuda ,  Tooru Mori

Inventor： Koichiro Masuda ,  Tooru Mori

IPC: H01L23/34

CPC classification number: H01L23/49816 ,  H01G2/06 ,  H01L23/49805 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an electrically insulating base member, and at least one solder guiding terminal. The base member has a bottom face, a top face and at least one side face, of which the bottom face and the top face are out of contact with each other whereas the side face contacts one or both the bottom face and the top face. The solder guiding terminal covers the bottom face partially, the top face partially, and the side face partially or wholly. A solder guiding face as the surface of a portion of the solder guiding terminal covering the side face is not normal to the bottom face.

Abstract translation: 提供了当焊接的半导体器件和印刷电路板之间的间隙宽度恒定时，能够避免由于焊料的吸引引起的连接不良的隔离件以及间隔件的制造方法。 间隔件包括电绝缘基底构件和至少一个焊料引导端子。 基部构件具有底面，顶面和至少一个侧面，底面和顶面彼此不接触，而侧面接触底面和顶面中的一个或两个。 焊料引导端子部分或全部部分覆盖底面，部分地覆盖侧面。 作为覆盖侧面的焊料引导端子的一部分的表面的焊料引导面与底面不正交。

公开(公告)号：US20120092816A1

公开(公告)日：2012-04-19

申请号：US13202176

申请日：2010-10-13

Applicant: Jonas Moran ,  Mats Kleverman

Inventor： Jonas Moran ,  Mats Kleverman

IPC: H05K5/00 ,  H05K13/00

CPC classification number: G06F3/0202 ,  H03K17/9645 ,  H05K1/0275 ,  H05K1/053 ,  H05K1/115 ,  H05K1/116 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0026 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/445 ,  H05K2201/0108 ,  H05K2201/0376 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/107

Abstract: An electronic device comprises a housing having an outer face and an inner face. A key is provided on the housing, which comprises a micro hole formed in the housing and a conductive material extending within the micro hole to the outer face of the housing. A sensor is coupled to the conductive material to detect whether an object is brought into contact or out of contact with the micro hole at the outer face.

Abstract translation: 电子设备包括具有外表面和内表面的壳体。 在壳体上设有钥匙，该钥匙包括形成在壳体中的微孔和在微孔内延伸到壳体外表面的导电材料。 传感器耦合到导电材料，以检测物体是否与外表面的微孔接触或脱离接触。

公开(公告)号：US08109612B2

公开(公告)日：2012-02-07

申请号：US11510591

申请日：2006-08-28

Applicant: Toshiya Kojima ,  Gentaro Furukawa

Inventor： Toshiya Kojima ,  Gentaro Furukawa

IPC: B41J2/05 ,  B41J2/14 ,  B41J2/045

CPC classification number: H05K3/06 ,  B41J2/14233 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18 ,  H05K1/0265 ,  H05K3/041 ,  H05K3/061 ,  H05K3/107 ,  H05K3/244 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09236 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/1527

Abstract: The wiring substrate having a recess section and a projecting section formed on at least one surface of the wiring substrate, and wires formed on both the recess section and the projecting section.

Abstract translation: 布线基板具有形成在布线基板的至少一个表面上的凹部和突出部，以及形成在凹部和突出部两者上的布线。

公开(公告)号：US20120012464A1

公开(公告)日：2012-01-19

申请号：US13242166

申请日：2011-09-23

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: C25D5/02

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

Abstract translation: 一种制造印刷电路板的方法，包括：提供具有第一和第二表面的绝缘树脂基板，在第一表面上照射激光，使得形成在第一表面上具有开口并向内逐渐变细的第一开口部分，在第二表面上照射激光 形成第二开口部，该第二开口部在第二面上形成有向内侧逐渐变细并且与第一开口部连通的第二开口部，形成有具有第一开口部和第二开口部的贯通孔，在内部形成无电解电镀膜 并且在所述化学镀膜上形成电解镀膜，使得在所述贯通孔中形成贯通孔导体结构。 第一部分的开口具有相对于第二开口部分的开口偏心的重心轴线。