公开(公告)号：JP5122783B2

公开(公告)日：2013-01-16

申请号：JP2006265041

申请日：2006-09-28

Applicant: 三洋電機株式会社 ,  Fdk鳥取株式会社

Inventor： 知行 庄瀬 ,  勝之 喜田 ,  正雄 近藤 ,  泰夫 赤井

IPC: H01M2/02 ,  H01M2/10 ,  H01M2/30

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

公开(公告)号：JP4843555B2

公开(公告)日：2011-12-21

申请号：JP2007126604

申请日：2007-05-11

Applicant: 矢崎総業株式会社

Inventor： 佳浩 河村

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10015 ,  H05K2201/10462 ,  H05K2201/10598 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K2203/0588 ,  Y10T29/43 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

公开(公告)号：JP4760916B2

公开(公告)日：2011-08-31

申请号：JP2009004569

申请日：2009-01-13

Applicant: セイコーエプソン株式会社

Inventor： 稔 長谷川 ,  真朗 黒田

IPC: H01F38/14 ,  H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F27/36 ,  H01F41/04

CPC classification number: H05K1/182 ,  H01F27/22 ,  H01F27/2871 ,  H01F27/292 ,  H01F27/306 ,  H01F38/14 ,  H01F41/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/1311 ,  Y10T29/49078

Abstract: A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.

公开(公告)号：JP2010109371A

公开(公告)日：2010-05-13

申请号：JP2009246603

申请日：2009-10-27

Applicant: Medison Co Ltd ,  株式会社 メディソンMedison Co.,Ltd.

Inventor： JIN GIL JU ,  PARK JUNG LIM ,  KIM JAE YK

IPC: H05K1/18 ,  H05K1/02

CPC classification number: A61B8/4494 ,  A61B8/00 ,  A61B8/4461 ,  A61B8/4483 ,  B06B1/0622 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/055 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10083 ,  H05K2201/10462 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and a probe including the same. SOLUTION: The probe includes a transducer, the printed circuit board having a pattern part coming in surface contact with the transducer, and a bonding member bonding the transducer to the pattern part of the printed circuit board. A bonding part of the printed circuit board is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to come in contact with not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the printed circuit board. As a result, the transducer can be firmly bonded to the printed circuit board, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the printed circuit board and the transducer. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种印刷电路板和包括该电路板的探针。 解决方案：探头包括换能器，印刷电路板具有与换能器表面接触的图案部分，以及将换能器接合到印刷电路板的图案部分的结合部件。 印刷电路板的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅与接合部分的金属层接触，而且还与其电绝缘部分接触 从而提高换能器与印刷电路板之间的结合力。 结果，换能器可以牢固地结合到印刷电路板上，从而可以防止由于印刷电路板和换能器之间的连接不良而导致换能器的性能劣化。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009105434A

公开(公告)日：2009-05-14

申请号：JP2009004569

申请日：2009-01-13

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： HASEGAWA MINORU ,  KURODA MASAAKI

IPC: H01F38/14 ,  H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F27/36

CPC classification number: H05K1/182 ,  H01F27/22 ,  H01F27/2871 ,  H01F27/292 ,  H01F27/306 ,  H01F38/14 ,  H01F41/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/1311 ,  Y10T29/49078

Abstract: PROBLEM TO BE SOLVED: To provide a thin coil unit, its manufacturing method, and an electronic device. SOLUTION: The coil unit 22 includes: a planar coil 30; a wiring printed substrate 40 having a planar coil housing part 40a for housing the planar coil 30; a protection sheet 50 provided on a transmission surface side of the planar coil 30 for protecting the planar coil 30; and a magnetic sheet 60 provided on a non-transmission surface side of the planar coil 30. The planar coil 30 is housed in the planar coil housing part 40a, and is electrically connected to the wiring printed substrate 40. The planar coil housing part 40a has a shape corresponding to an outer shape of the planar coil 30. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供薄线圈单元，其制造方法和电子设备。 线圈单元22包括：平面线圈30; 具有用于容纳平面线圈30的平面线圈容纳部40a的布线印刷基板40; 设置在用于保护平面线圈30的平面线圈30的传输表面侧的保护片50; 以及设置在平面线圈30的非透射面侧的磁性片60.平面线圈30容纳在平面线圈容纳部40a中，与布线印刷基板40电连接。平面线圈容纳部40a 具有对应于平面线圈30的外形的形状。版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007129229A

公开(公告)日：2007-05-24

申请号：JP2006297897

申请日：2006-11-01

Applicant: Avx Corp ,  エイブイエックス コーポレイション

Inventor： SHINABERGER LEE ,  SMITH DEAN ,  ANDERSON TOM ,  RAWAL BHARAT

IPC: H01G4/228 ,  H01G2/02 ,  H01G9/00 ,  H01G11/00 ,  H01G11/74 ,  H01G11/78

CPC classification number: H01G2/06 ,  H01G11/82 ,  H01R12/716 ,  H05K3/301 ,  H05K3/305 ,  H05K3/32 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10962 ,  H05K2203/066 ,  Y02E60/13

Abstract: PROBLEM TO BE SOLVED: To provide a high power electrochemical double layer capacitor (DLC) capable of being mounted on a PCB without using manual soldering and attended with inhibitive increase in the ESR.
SOLUTION: The electrochemical double layer capacitor (DLC) is configured for mounting on the PCB. A first connector component is configured at each individual terminal lead of the DLC. A second connector component is mounted on the PCB, and includes a number of parallel connector elements at a footprint location for electrical mating contact with the DLC leads. The connector configuration produces a minimal increase in the equivalent series resistance (ESR) of the capacitor when mounted on the PCB.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供能够安装在PCB上的高功率电化学双层电容器（DLC），而不需要使用手动焊接，并且可以抑制ESR的增加。

解决方案：电化学双层电容器（DLC）被配置为安装在PCB上。 第一连接器部件配置在DLC的每个单独的端子引线处。 第二连接器部件安装在PCB上，并且在位置位置处包括多个并联连接器元件，用于与DLC引线电配合接触。 当安装在PCB上时，连接器配置产生电容器的等效串联电阻（ESR）的最小增加。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP3718039B2

公开(公告)日：2005-11-16

申请号：JP34787197

申请日：1997-12-17

Applicant: 株式会社日立製作所 ,  株式会社日立超エル・エス・アイ・システムズ

Inventor： 智明 下石 ,  環 和田 ,  正親 増田 ,  修一郎 東 ,  孝司 江俣 ,  隆幸 沖永 ,  利夫 管野 ,  邦彦 西

IPC: H01L25/00 ,  G11C5/00 ,  H01L23/50 ,  H01L25/10 ,  H01L25/18 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

公开(公告)号：JP2004273937A

公开(公告)日：2004-09-30

申请号：JP2003065391

申请日：2003-03-11

Applicant: Fujitsu Hitachi Plasma Display Ltd ,  富士通日立プラズマディスプレイ株式会社

Inventor： KOIZUMI HARUO ,  ONOZAWA MAKOTO

IPC: H05K7/20 ,  H01F5/00 ,  H01F17/00 ,  H01F27/22 ,  H01L23/36 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18

CPC classification number: H05K1/18 ,  H01F5/003 ,  H01F17/0033 ,  H01F27/22 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/165 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a circuit substrate assembly whereon a planar coil element is disposed and mounted to generate no power loss even if it is mounted on a circuit substrate together with a circuit component provided with a large heat sink. SOLUTION: A power module 12 having a driving IC 15 whereto a heat sink 16 is fixed and a planar coil element 13 are mounted on a circuit substrate 11. The heat sink 16 has an extension part 16a which projects from the driving IC 15 and extends parallel to a substrate surface. A coil mount region A whereto a pattern wiring is not provided is formed in a part of the circuit substrate 11 facing the extension part 16a. The planar coil element 13 is mounted parallel to the circuit substrate 11 with a coil part opposite to the coil mount part A. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：TW200847204A

公开(公告)日：2008-12-01

申请号：TW097105468

申请日：2008-02-15

Applicant: TDK股份有限公司 TDK CORPORATION

Inventor： 白川幸彥 SHIRAKAWA, YUKIHIKO ,  三浦巖 MIURA, IWAO

IPC: H01G

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: 本發明提供一種可簡便地進行於電路基板上之面安裝之電子零件及其安裝構造與變換器裝置。面安裝型電子零件具備介電體素體、電極、引出導體以及引線。介電體素體具有主面以及側面。於主面上形成有電極,於主面上形成有電極,電極彼此相對。引出導體之第1部分配置於側面。引出導體之第1部分配置於側面。引線之第1部分與引出導體之第1部分相連接。

Abstract in simplified Chinese: 本发明提供一种可简便地进行于电路基板上之面安装之电子零件及其安装构造与变换器设备。面安装型电子零件具备介电体素体、电极、引出导体以及引线。介电体素体具有主面以及侧面。于主面上形成有电极,于主面上形成有电极,电极彼此相对。引出导体之第1部分配置于侧面。引出导体之第1部分配置于侧面。引线之第1部分与引出导体之第1部分相连接。

公开(公告)号：TWM337173U

公开(公告)日：2008-07-21

申请号：TW096221431

申请日：2007-12-17

Applicant: 高效電子股份有限公司

Inventor： 李博勝

IPC: H01R

CPC classification number: H05K3/301 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: 本創作係一種接腳固定座,其係令一塊體形成二平行的穿孔,且該塊體的底部係呈平坦狀,而在該塊體的前表面自各穿孔的位置朝底部方向形成與該穿孔連通的定位槽,該分別與二穿孔連通的二定位槽亦為平行,而該塊體的後表面從底部延伸出一抵靠板,該接腳固定座係供電子元件的接腳穿入其穿孔,而與該電子元件固定,且該接腳穿入後,即能夠將該接腳彎折以放入定位槽中,使得接腳的彎折處具有一致性,且無需使用治具定位再彎折,所以製程相當簡便,而且彎折時不會影響接腳與電子元件之間的連接,亦不會破壞電子元件的本體結構。

Abstract in simplified Chinese: 本创作系一种接脚固定座,其系令一块体形成二平行的穿孔,且该块体的底部系呈平坦状,而在该块体的前表面自各穿孔的位置朝底部方向形成与该穿孔连通的定位槽,该分别与二穿孔连通的二定位槽亦为平行,而该块体的后表面从底部延伸出一抵靠板,该接脚固定座系供电子组件的接脚穿入其穿孔,而与该电子组件固定,且该接脚穿入后,即能够将该接脚弯折以放入定位槽中,使得接脚的弯折处具有一致性,且无需使用治具定位再弯折,所以制程相当简便,而且弯折时不会影响接脚与电子组件之间的连接,亦不会破坏电子组件的本体结构。